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Semiconductor Assembly and Testing Services Market, By Service (Assembly & Packaging Services and Testing Services), By Packaging Solutions (Copper Wire and Gold Wire Bonding, Copper Clip, Flip Chip, Wafer Level Packaging and TSV), By Application (Communication, Computing & Networking, Consumer Electronics, Industrial and Automotive Electronics), and by Region (North America, Latin America, Europe, APAC and MEA) - Size, Share, Outlook, and Opportunity Analysis, 2019 - 2027<br>
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SEMICONDUCTOR ASSEMBLY & TESTING SERVICES MARKET ANALYSIS Semiconductor Assembly and Testing Services Market, By Service (Assembly & Packaging Services and Testing Services), By Packaging Solutions (Copper Wire and Gold Wire Bonding, Copper Clip, Flip Chip, Wafer Level Packaging and TSV), By Application (Communication, Computing & Networking, Consumer Electronics, Industrial and Automotive Electronics), and by Region (North America, Latin America, Europe, APAC and MEA) - Size, Share, Outlook, and Opportunity Analysis, 2019 - 2027
Market Overview The global semiconductor assembly and testing services market was valued for US$ 35,772.8 MN in 2019. Market Dynamics Drivers • Increasing demand for mobility and connectivity in consumer electronic products is expected to drive growth of the global semiconductor assembly and testing services market during the forecast period • Additional features offered by SATS providers over in-house testing and packaging capabilities are expected to propel the global semiconductor assembly and testing services market growth over the forecast period
Market Dynamics Restraints • Constant fluctuations in exchange rates is expected to hinder the global semiconductor assembly and testing services market growth during the forecast period • High capital investment for high-end packaging solutions is expected to restrain growth of the global semiconductor assembly and testing services market over the forecast period
Market Opportunities • Investments in advanced packaging solution to pose lucrative business opportunities • High capacity utilization rates is expected to present lucrative business opportunities
Market Trends • Growing focus on mergers and acquisitions • Product innovation through technological advancements is a major trend in the market • Segment information: In global semiconductor assembly and testing services market, by service type segment, the assembly and packaging services sub-segment dominated the global market in 2019, accounting for 80.1% share in terms of value, followed by testing services.
Competitive Section • Key companies operating in the global semiconductor assembly and testing services market are ASE Group, Powertech Technology Inc., Global Foundries Inc., Amkor Technology Inc., CORWIL Technology Corp., Integrated Microelectronics Inc. (Psi Technologies Inc.), STATS chipPAC Ltd. (JCET), Chipbond Technology Corporation, and Silicon Precision Industries Company Ltd. • Key Developments • Key companies in the market are focused on mergers and acquisitions, in order to gain competitive edge in the market. For instance, in April 2019, ON Semiconductor acquired Global Foundries Inc. for US$ 430 million. • Major market players are involved in mergers and acquisitions, in order to enhance their market presence. For instance, in May 2017, Amkor Technology Inc. acquired Nanium S.A, a semiconductor packaging firm.
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