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Details and Assumptions for Technology Requirements and Potential Solutions

ITRS 2001 Factory Integration Chapter Factory Information and Control Systems (FICS) Backup Section. Details and Assumptions for Technology Requirements and Potential Solutions. Backup Outline. How Metrics were Selected International Contributors FICS Technology Requirements Table

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Details and Assumptions for Technology Requirements and Potential Solutions

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  1. ITRS 2001 Factory Integration Chapter Factory Information and Control Systems (FICS) Backup Section Details and Assumptions for Technology Requirements and Potential Solutions ITRS Factory Integration TWG

  2. Backup Outline • How Metrics were Selected • International Contributors • FICS Technology Requirements Table • Translating FICS Technology Requirements to Reality • Supporting Material for FICS Technology Requirements ITRS Factory Integration TWG

  3. How Metrics were selected • Almost every metric is a best in class or close to best in class • Sources are: Rob Leachman’s published 200mm benchmarking data, individual IC maker feedback, Trecenti/UMC 300mm joint venture published data, and I300I Factory Guidelines for 300mm tool productivity • It is likely a factory will not achieve all the metrics outlined in the roadmap concurrently • Individual business models will dictate which metric is more important than others • It is likely certain metrics may be sacrificed (periodically) for attaining other metrics (Example: OEE/Utilization versus Cycle time) • The Factory Integration metrics are not really tied to the technology nodes as in other chapters such as Lithography • However, nodes offer convenient interception points to bring in new capability, tools, software and other operational potential solutions • Inclusion of each metric is dependent on consensus agreement We think the metrics provide a good summary of stretch goals for most companies in today’s challenging environment. ITRS Factory Integration TWG

  4. Bob Bachrach, AMAT Dave Bloss, Intel David Bouldin, TI Raymond Bunkofske, IBM Hugo Chang, Winbond Ivan Chou, Compaq Eric Christensen, AMD Blaine Crandell, TI Gino Crispieri, ISMT Daren Dance, WWK Klaus Eberhardt John Ellis, SISA Clint Harris, Brooks Automation International Contributors • Michio Honma, NEC • Leon McGinnis, Georgia Tech • Shantha Mohan • Lisa Pivin, Intel • Lance Rist, ISMT • Jennifer Robinson, FabTime • Claus Schneider, Franhaufer • Doug Scott, PRIA • Toshi Uchino, Trecenti • Hiromi Yajima, Toshiba • Hank Watts, PRIA • Mitchell Weiss, PRIA ITRS Factory Integration TWG

  5. Factory Info and Control System (FICS) Requirements ITRS Factory Integration TWG

  6. Translating FICS requirements to Reality ITRS Factory Integration TWG

  7. Get MES software from Supplier Develop Tool/WIP Workflow models Test Tool/WIP Workflow models Convert legacy FICS capabilities to new MES Integrate existing FICS with MES Functional test of all capabilities Install new MES in factory Integration test MES and FICS Factory On-line Integration Time for New Factory Integration System Software Must Decrease • Assumptions: • New MES capabilities exceeds existing MES capabilities • New MES = new database, new interfaces to other software applications, and new configuration requirements • New MES capabilities must be understood, then integrated with the factory equipment and existing FICS software systems • Time is required to integrate the new MES with FICS systems that are reused (not replaced) Time to integrate New Factory-wide Software system into a New or Existing factory is expected to decrease ITRS Factory Integration TWG

  8. Solutions to decrease: • If fundamental process models exist, then can use historical data to decrease time to create new algorithm • Wafer Level Tracking; Slot tracking, & Storage/Retrieval of all data with Wafer ID reference • Integration of data analysis & APC FW • If data is available, then can start with Analyzing Results • Decrease to 4 weeks • Must have enough variability in data • Solutions unknown to decrease below 4 weeks Integration Time for Equipment Control Systems (APC algorithm) Must Decrease Perform Experiment / Acquire “X” input data Analyze Results and create Process Model Release to Factory Floor Time Not to scale Build APC algorithm into APC System Functional Test of APC algorithm Design of Experiment Acquire “Y” output data Total Time (expected to decrease) • Assumptions: • APC algorithms are developed (not purchased) • Production tool time available for performing experiments • APC Framework exists. Just need to add new algorithm • Able to reuse of business logic from other APC algorithms • Wafer-level data available • Tool parameters can be modified ITRS Factory Integration TWG

  9. Solutions to decrease: • If fundamental process models exist, then can use historical data to decrease time to create new algorithm • Wafer Level Tracking; Slot tracking, & Storage/Retrieval of all data with Wafer ID reference • Integration of data analysis & APC FW • If data is available, then can start with Analyzing Results • Decrease 4 weeks • Must have enough variability in data Integration Time for Equipment Control System (Host Controller) Must Decrease Develop Host Controller Integration Test Host Controller Release to Factory Floor Time Not to scale Design Host Controller Functional Test Host Controller Time (expected to decrease) • Assumptions: • Includes automated intrabay, wafer level control, and process control capabilities / standards • Requirements defined • Production tool time available for testing • Able to reuse of business logic from other Host Controllers • Production tool SECS/GEM interface meets requirements ITRS Factory Integration TWG

  10. Timeline to Develop & Conform to Software Standards Must Decrease • Metrics • FICS: Time to Create FICS Standard • FICS: Lead time for software compliance to standards Standards Group Formed (Suppliers + IC Makers) 1st Iteration Of Standard Document Guideline Defined Final Standard Document (with prototype learning) Tasks to Develop the Standard User Requirements Document Design Of Standard Total Time should reduce from 12 months today to 4 months by 2007 Time Zero Time Prototype Design Of Standards Compliant Software Development of Production S/W Not to scale Tasks to Develop Software that Conforms to Standards Production S/W Conforms to Standards Prototype Development and test Time to conform to standards can be greatly reduced by parallel development of the the standard and the software application ITRS Factory Integration TWG

  11. Process Control Process Control discussion have been divided into 3 basic high level Capabilities • Fault Detection and Classification • ITRS Problem: Prevent scrap or equipment damage • Run to Run Control (lot to lot, and wafer to wafer) • ITRS Problem: Optimize performance to processing spec • Integrated Metrology • ITRS Problem: Reduce module level TPT + AMHS moves Solutions have been divided into ‘levels’ that progressively increase equipment capability and responsibility • Strategy: reduce risk by providing ‘baby steps’ associated with factory systems & equipment change (crawl, walk, run) • Level 0: Basically what we have today • Level 1-n: Some intermediate steps toward our vision • Level n+1: Vision ITRS Factory Integration TWG

  12. Fault Detection and Classification Prevent scrap or equipment damage Potential Solution: Guidelines and Standards Target • ITRS Requirements include: • Defect Reduction: Particle density (particles / m2) tied back to yield • Overall Equipment Efficiency • Add process repeatibility ITRS Requirement: Equip Table Target ITRS Factory Integration TWG

  13. Advanced Process ControlOptimize performance to equipment processing specification Potential Solution: Guidelines and Standards Target • Primary ITRS Requirements is Coefficient of Variation for (ITRS examples): • Litho – gate CD control (nm), Overlay Control (nm) • Diffusion – Oxide thickness and thickness control ITRS Requirement: Equip Table Target ITRS Factory Integration TWG

  14. Integrated MetrologyReduce module level Throughput Time (TPT) Potential Solution: Guidelines and Standards Target • Primary • Factory Cycle time [days] per mask layer (hot lot and non-hot lot) • AMHS system throughput (moves / hour) • Secondary • Floor space effectiveness (activities / hour / m2 or WIP turns / m2) ITRS Requirement: Equip Table Target ITRS Factory Integration TWG

  15. Fault Detection and Classification (1/2) • Outside of Tool • FDC Modeling • FDC control configuration • External sensor and tool data integration by IC Maker • Level 0 FDC Assumptions: • FDC occurs outside the tool • Data collection through SECS interface for integrated sensors • Use Trace data collection (S6F1) or SVID (S1F3/4) • Data collection frequency 1-3 Hz through the SECS interface • IC Makers integrate sensors and use proprietary interfaces where needed. • Tools needs graceful shutdown options at various intervals (some exist, implementations vary) Host System FDC Module SECS Interface used for most data collection and all control FDC Data FDC Control External Sensor Integration Optional • Graceful Shutdown options required • Detailed wafer and chamber data required Step N UI IC Maker integrated External Sensor Process Equipment ITRS Factory Integration TWG

  16. Step N UI Process Equipment Fault Detection and Classification (2/2) • Outside of Tool • Host determines actions based on type of fault • Host issues control command • Level 1 FDC Assumptions: • Some FDC may occur inside the tool • Enables real-time control loops • IC Maker configures in tool FDC control model and actions to be taken based on process via standard interface (if it exists) • Tool determines when model is violated, controls tool, and notifies host (in tool FDC case) • Historical and Summary Data collection through standard EE Interface (with high level linkage data) • Tools needs graceful shutdown options at various intervals • Immediately, after this step, after this lot • May also have off tool FDC and health monitoring in parallel to on tool FDC • OPEN: How does this interact with wafer to wafer control (FDC model may need to change with each wafer) Host System Slow FDC Module SECS Interface used to control tool in the event of a fault FDC Signal FDC Control • Inside the Tool • FDC Models configured • FDC host signals configured • FDC actions may also be configured • Historical and Summary data storage and analysis • Detailed wafer and chamber data tracked EE Interface EES ITRS Factory Integration TWG

  17. UI UI Metrology Equipment Metrology Equipment Run to Run Control (1/3) • Level 0 L2L R2R Assumptions: • IC Maker configures control model based on process • Recipe adjustment calculations made using metrology data and other data from the equipment or process. • Recipe adjustment occurs outside the tool (recipe adjusted by the host and downloaded to the equipment) • Parameterized recipes supported on some equipment • Metrology data collected through the SECS interface • Parameterized recipes required • Detailed wafer and chamber level data required Step N UI Step N-1 Step N+1 Models and Recipe Adjustment Process Equipment SECS Detailed wafer and chamber data required Equip Controller SECS SECS Equip Controller Equip Controller Feed Forward Control - Use preprocess metrology data to adjust processing for that lot Metro data collected via SECS interface Metro data collected via SECS interface Run to Run Control Feedback Control - Use post metrology feedback data to adjust processing for the next lot Host System ITRS Factory Integration TWG

  18. UI UI Database Adaptor Metrology Equipment Metrology Equipment Run to Run Control (2/3) (Lot to Lot Case) Proposed Guidelines • Level 1 L2L R2R Assumptions (non integrated metrology case) • IC Maker configures control model based on process • Recipe parameter value calculations made using metrology data and other data from the equipment or process (occurs in the EEC). • Recipe parameter values are applied to base recipes inside the tool • Parameterized recipes utilized (supported on all equipment via SEMI standard) • Recipe parameters are recommended to the Host by the EEC • Recipe parameters downloaded to the equipment via the Host • Still need recipe download capability for base recipes • Metrology data collected through the EE interface • Executed values reported from equipment to EEC (with high level linkage data) Recipe Adjustment Models and Calculations Modular apps with open interfaces Recipe Recommendations Host System EES Feed Forward Control - Use preprocess metrology data to adjust processing for that lot Equip Controller Equip Controller Equip Controller EE Database Run to Run Control Feedback Control - Use post metrology feedback data to adjust processing for the next lot Recipe ParameterControl Factory Network SECS SECS Detailed wafer and chamber data required EE EE EE SECS Metro data collected via EE interface Metro data collected via EE interface Step N Step N+1 Step N-1 UI Recipe Adjustment (Parameterized recipes required) Process Equipment ITRS Factory Integration TWG

  19. Run to Run Control (3/3) (Wafer to Wafer Case) • Level 2 W2W R2R Assumptions (IM only case) • Lot to Lot capabilities are same as level 1 • IC Maker configures control model based on process and downloads like a recipe via some download standard. • Recipe parameter value calculations made using metrology data and other data from the equipment or process (occurs in the tool). • Recipe parameter values are applied to base recipes inside the tool • Parameterized recipes utilized (supported on all equipment via SEMI standard) • Still need recipe download capability for base recipes • Metrology data collected through the EE interface • Any modification to the process parameters reported from equipment to EEC (with high level linkage data) • OPEN: Should internal communication between process part and metrology part be standardized? • IM means that the Metrology part is integrated with the process part of the tool • Both Hardware and Software EES Modular apps with open interfaces Integrated SECS and EE Interfaces for Process and Metrology EE Database Factory Network EE Network EE Host System Recipe and Model Selection and Download via SECS Interface SECS Integrated Metro data and detailed wafer and chamber data collected via EE interface Equip Controller Integrated Metrology Module (not Bolt on) UI Parameterized recipes required Recipe Adjustment Models, Calculations, Control Integrated Process and Metro Equip. ITRS Factory Integration TWG

  20. Integrated Metrology (1/1) Guideline: • Hardware integrated process and metrology tools shall also integrate their data collection and control systems. OK OK NG Standalone In-Line Integrated Off Tool EEC System Off Tool EEC System Off Tool EEC System EEC Network Dual EEC Lines Single EEC Line Individual EEC Lines Process Tool Process Tool Process Tool Metrology Tool Metrology Tool Metrology Tool Individual SECS/GEM Lines Dual SECS/GEM Lines Single SECS/GEM Line Control Network Off Tool Control System Off Tool Control System Off Tool System Control ITRS Factory Integration TWG

  21. OHV Intelligent Equipment Integrated with Factory Scheduling and Dispatching Can Improve OEE • Improve OEE through more effective equipment utilization equipment • Requires integrated equipment, scheduling/dispatching, AMHS, and factor operations 1a. Load port event signals carrier leaving OR 1b. Timer event indicates when carrier is nearly finished processing • Dispatcher selects next lot for processing • AMHS routes carrier to process equipment • Next lot delivered to buffer before it starves  OHV  b UI UI Process Chamber a Stocker Process Equipment SECS/GEM SECS/GEM  Equipment Controllers Scheduling & Dispatching System AMHS Control System Information Bus ITRS Factory Integration TWG

  22. Intelligent Equipment Integrated with Factory Scheduling and Dispatching Can Improve OEE • Improve OEE by optimizing Preventative Maintenance (PM) timing and avoiding unscheduled or last minute scheduled down time • Requires integrated equipment, scheduling/dispatching, AMHS, and factor operations 1. Chamber data indicates need for Preventative Maintenance (PM) 2. Equipment sends PM event 3. Scheduler determines when to PM the equipment 4. Technicians notified via page that a specific PM is required 5. Equipment finishes processing and is taken offline for 6. Equipment taken off-line when appropriate 7. Technicians notified that equipment is ready. PM occurs. OHV    UI Process Chamber Process Equipment   SECS/GEM  Equipment Controllers Scheduling & Dispatching System Paging System   Information Bus ITRS Factory Integration TWG

  23. Other Systems Manufacturing Execution Systems Decision Support Systems Standard for data formats, data access, and inter application interfaces Mainstream Computer Communications stds APC, Fault Detection & Classification, Integrated metrology, EES, e-Diagnostics Process Job, Control Job standards Production equipment Carrier mgt standard Utilization tracking standard Equip Eng I/F Factory Network Carrier ID standard SECS-II GEM HSMS Enhanced parallel I/O standards Process Control standards Wafer level tracking & control standards User Interfaces Factory Information & Control System Standards • Open standards are required to avoid custom solutions which increase integration time and cost • Proprietary interfaces will not be acceptable • What is still needed: • Faster standards development • Faster Implementation of defined standards • Better strategy for inter-application interface standards Legend: -> Standards Exist -> Standards Are Under Development -> Standards Are Needed ITRS Factory Integration TWG

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