PWB Product Data-Driven Analysis Using STEP AP210 An Example XAI Application

1. ISTPED Workshop Roanoke VA July 19, 2000 Integration of Software Tools for Power Electronics Design http://www-rp.me.vt.edu/bohn/ISTPED/ PWB Product Data-Driven Analysis Using STEP AP210An Example XAI Application Russell S. Peak Senior Researcher & Co-Director Engineering Information Systems Lab eislab.gatech.edu CALS Technology Center Georgia Institute of Technology

2. Outline • Generalized Analysis Integration • Challenges • Techniques and Applications • Experiences with AP210 • Summary

3. X-Analysis Integration (XAI)(X=Design, Mfg., etc.) • Goal: Improve product engineering process by integrating physical behavior simulations with other life cycle models • Challenges: • Heterogeneous Transformations • Diversity: Information, Behaviors, Disciplines, Fidelity, Feature Levels, CAD/CAE Tools, etc. • Multidirectional Associativity: Design  Analysis, Analysis  Analysis • One Approach: The Multi-Representation Architecture (MRA) • Initial Focus: Automation of ubiquitous analysis for design

4. Analysis Integration Challenges: Heterogeneous Transformations STEP AP210 Mentor Graphics Cadence STEP AP210 STEP AP209 ?? Mentor Graphics Ansys • Homogeneous Transformation • Heterogeneous Transformation Design Model A Design Model B Design Model A Analysis Model A

5. Analysis Integration Challenges: Information Diversity “Analyzable” Description Environmental Conditions “Manufacturable” Description Specification Semantics STEP AP220 STEP AP210 • “PWB should • have low bow & twist” • “Warpage < 7.5% when • board is cooled from lamination to 25oC” lamination temperature = 200oC Idealizations

6. Diverse Analysis Disciplines De N Electromagnetic Thermomechanical Electrical Fatigue Vibration Thermal

7. Multi-Fidelity IdealizationsSame Mode; Idealized Geometries of Varying Dimension Design Model (MCAD) Analysis Models (MCAE) Mode (Behavior) = Deformation 1D Beam/Stick Model flap support assembly inboard beam 3D Continuum/Brick Model

8. Missing Today:Explicit Design-Analysis Associativity little automation inconsistency No explicit fine-grained CAD-CAE associativity little knowledge capture G idealizations = K f ( r , b , h ) 3 1 P P = f C = f be 1 2 ht se p 2 r t e 0 e Detailed Design Model Analysis Model (with Idealized Features) Channel Fitting Analysis “It is no secret that CAD models are driving more of today’s product development processes ... With the growing number of design tools on the market, however, the interoperability gap with downstream applications, such as finite element analysis, is a very real problem. As a result, CAD models are being re-created at unprecedented levels.” Ansys/ITI press Release, July 6 1999 http://www.ansys.com/webdocs/VisitAnsys/CorpInfo/PR/pr-060799.html

9. X-Analysis Integration Techniques Multi-Representation Architecture (MRA) Explicit Design-Analysis Associativity Analysis Module Creation Methodology Constrained Objects (COBs)

10. Diverse Analysis Integration Projects AP210 Usage • Team Integrated Electronic Response (TIGER) • Sponsor: Defense Advanced Research Prog. Admin. (DARPA) (SCRA subcontract) • Domain: PWA/B thermomechanical analysis • Product Data-Driven Analysis in a Missile Supply Chain (ProAM) • Sponsor: U. S. DoD JECPO National ECRC Program • Stakeholder: U. S. Army Missile Command (AMCOM) • Domain: PWA/B thermomechanical analysis • Design-Analysis Associativity Technology for PSI (PSI-DANTE) • Sponsor: Boeing • Domain: Structural analysis • Design-Analysis Integration Research for Electronic Packaging • Sponsor: Shinko Electric • Domain: Chip package thermal resistance analysis AP210 Usage Potential AP210 Usage

11. Flexible High Diversity Design-Analysis IntegrationTutorial Examples: Flap Link (Mechanical/Structural Analysis)

12. Flexible High Diversity Design-Analysis Integration Aerospace Examples:“Bike Frame” / Flap Support Inboard Beam Design Tools Modular, Reusable Template Libraries Analysis Modules (CBAMs) of Diverse Feature:Mode, & Fidelity MCAD Tools CATIA XaiTools Analysis Tools 1.5D General Math Mathematica In-HouseCodes Lug:Axial/Oblique; Ultimate/Shear Image API (CATGEO) Analyzable Product Model XaiTools 1.5D Fitting:Bending/Shear Materials DB FEA Elfini* MATDB-like 3D Assembly: Ultimate/FailSafe/Fatigue* Fasteners DB FASTDB-like * = Item not yet available in toolkit (all others have working examples)

13. Flexible High Diversity Design-Analysis Integration Electronic Packaging Examples: Chip Packages/Mounting (Project with Shinko Electric) Design Tools Modular, Reusable Template Libraries Analysis Modules (CBAMs) of Diverse Mode & Fidelity Prelim/APM Design Tool Analysis Tools XaiTools ChipPackage XaiTools ChipPackage General Math Mathematica FEAAnsys Thermal Resistance Analyzable Product Model 3D XaiTools PWB DB Materials DB* ThermalStress EBGA, PBGA, QFP Basic 3D** Basic Documentation Automation AuthoringMS Excel ** = Demonstration module

14. Outline • Generalized Analysis Integration • Challenges • Techniques and Applications • Experiences with AP210 • Summary

15. ProAM Design-Analysis IntegrationElectronic Packaging Examples: PWA/B Pro AM Design Tools Modular, Reusable Template Libraries Analysis Modules (CBAMs) of Diverse Mode & Fidelity ECAD Tools Mentor Graphics, Accel* Analysis Tools XaiTools PWA-B General Math Mathematica STEP AP210‡ GenCAM**, PDIF* 1D, 2D, 3D Solder Joint Deformation* FEAAnsys PWB Layup Tool XaiTools PWA-B Analyzable Product Model PWB Warpage XaiToolsPWA-B 1D, 2D Laminates DB PTH Deformation & Fatigue** Materials DB 1D, 2D ‡ AP210 DIS WD1.7 * = Item not yet available in toolkit (all others have working examples) ** = Item available via U-Engineer.com

16. Information Requirementsof TIGER/ProAM Analysis Modules PWB Warpage (Formula-Based) PWB Warpage (FEA-Based) PWA Warpage Solder-Joint Deformation PTH Deformation Detailed PWB Layup Layer Functions PWB Outline Package Geometry Package Materials Lead/Termination Shape Lead/Termination Material Component Location Solder Joint Shape Solder Joint Material PTH Geometry PTH Plating Material

17. Analyzable Product Model (APM) Technique Detailed component PWA Layout PWB Design 1 Oz. Cu 3 x 1080 1 Oz. Cu M100P1P11184 1 Oz. Cu 3 x 1080 1 Oz. Cu Analysis Models Design Representations Solder-Joint Deformation Model T Ec , c , c ES , S , S Analyzable Product Model (APM) EB , B , B PWB Warpage Model T EB , B , B PWA Deformation Model T EB , B , B Use idealizations Combine information and add idealizations Ec , c , c

18. CAD-APM Integration Technique Design File D1 STEP File DN STEP File D1 Analyzable- Product Database Design File DN Analyzable Product Model Custom Schema D1 STEP Schema Mapping Definition Language Design Application D1 Translator D1-to-STEP Analysis Application A1 Custom Schema DN STEP Schema Mapping Tool 3 Mapping Analysis Application AM Design Application DN Translator DN-to-STEP 1 2 4 Source Files Design Translation Analysis Target File

19. AP210 Board Outline Information used_representation property_definition_representation definition definition shape_definition_representation product_definition_shape shape_aspect shape_definition characterized_definition name inter_stratum_feature ‘board outline’ name ‘PCB outline’ items[0] elements geometrically_bounded_2d_ wireframe_shape_representation curve geometric_curve_set geometric_set_select curve S[ 0 : ? ] bounded_curve coordinates points Board outline coordinates REAL cartesian_point polyline trimmed_curve L[ 1 : 3 ] L[ 2 : ? ] trim_1 S[ 1 : 2 ] trim_2 trimming_select S[ 1 : 2 ]

20. PWA-B APM in TIGER/ProAM Projects solid material linear elastic model part (partial) assembly pwb electrical component electrical package leads pwa through-hole package surface mount package discrete component integrated component pwb feature resistor capacitor pwb passage pwb layer component occurrence solder joint plated through passage pwb copper foil pwb prepreg set pwb copper cladded laminate location

21. AP210 - APM Mappings Source schema (AP210) curve curve bounded_curve points coordinates REAL cartesian_point polyline trimmed_curve L[ 1 : 3 ] L[ 2 : ? ] trim_1 S[ 1 : 2 ] trim_2 trimming_select S[ 1 : 2 ] Target schema (APM) Mapping assignment x REAL outline xy_coordinate pwb L[ 1 : ? ] y

22. Iterative Design & AnalysisPWB Warpage 1 Oz. Cu 3 x 1080 2 Oz. Cu Tetra GF 1 Oz. Cu 2 x 2116 1 Oz. Cu Tetra GF 2 Oz. Cu 3 x 1080 1 Oz. Cu PWB Layup Design Tool 1D Thermal Bending Model Quick Formula-based Check Layup Re-design PWB Warpage Modules Analyzable Product Model 2D Plane Strain Model Detailed FEA Check

23. PWB Warpage Modulesa.k.a. CBAMs: COB-based analysis templates PWB Thermal Bending Model (1D formula-based) PWB Plane Strain Model (2D formula-based)

24. Experiences Using AP210 to Drive Analysis • AP210 originally geared toward manufacturing, but good source for analysis too. • Some information not available: • in AP210 (e.g., detailed PTH geometry)* • in typical ECAD database (e.g., detailed PWB layup) • Some design performed by supply chain members • E.g., detailed PWB layup • Need mechanism to add such info to a common repository • Need to coordinate unique identifiers in AP210 data with data from other sources (e.g., part numbers in laminate database) *Note: Used c.1997 AP210 DIS WD1.7. The latest AP210 version may now support such information.

25. Design-Analysis IntegrationUsing STEP and APMs • Domain-specific models (AP210, AP207) are semantically richer than geometry-focused ones (and therefore easier to use for analysis). • Trend toward feature-based, object-oriented CAD • “Smart product models” • Analysis has insatiable information appetite (multi-fidelity) • A given product model cannot support every conceivable future idealization need. • APMs enable additions as needed • Companies can implement mix of company PMs and APMs (along with standard PMs) to support design-analysis requirements for a given set of analysis modules. • Analysis module information needs dictate APM content

26. XAI Summary • Emphasis on X-analysis integration (XAI) for design reuse (DAI,SBD) • Multi-Representation Architecture (MRA) • Addressing fundamental XAI/DAI issues • Explicit CAD-CAE associativity: multi-fidelity, multi-directional, fine-grained • General methodology --> Flexibility & broad application • Research advances & applications • Product data-driven analysis (STEP AP210, GenCAM, etc.) • Internet-based engineering service bureau (ESB) techniques • Object techniques for next-generation aerospace analysis systems • FEA modeling time reduction in pilot tests (chip packages): > 10:1 (days/hours to minutes) Improved Simulation-Based Designs • Tools and development services • Analysis integration toolkit: XaiTools™ and applications • Pilot commercial ESB: U-Engineer.com • Company-tailored engineering information system solutions • Motivated by industry & government collaboration

27. For Further Information ... • EIS Lab web site: http://eislab.gatech.edu/ • Publications, project overviews, tools, etc. • See: Publications  DAI/XAI  Suggested Starting PointsX-Analysis Integration (XAI) Technologyhttp://eislab.gatech.edu/pubs/reports/EL002/ • Regarding AP210 usage, see especially: • Tamburini, D. R.; Peak, R. S.; Fulton, R. E. (1997) Driving PWA Thermomechanical Analysis from STEP AP210 Product Models. 1997 ASME Intl. Mech. Engr. Congress & Expo., Dallas. http://eislab.gatech.edu/pubs/conferences/wam97-tamburini/ • Product Data Driven Analysis in a Missile Supply Chain, http://eislab.gatech.edu/projects/proam/ • XaiTools™ home page: http://eislab.gatech.edu/tools/XaiTools/ • Pilot commercial ESB: http://www.u-engineer.com/ • Internet-based self-serve analysis • Analysis module catalog for electronic packaging • Highly automated front-ends to general FEA & math tools

28. Nomenclature