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WSO/UV-LSS Detector with large dimension MCP Baosheng Zhao* National Astronomical Observatories of CAS * E-mail :open@opt.ac.cn. Contents. Research Bases 2. Project Demonstration & Design 3. Key Technologies and Research Contents. 1. Bases. EUV (30.4 nm) Imager Based on WSA Detector
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WSO/UV-LSSDetector with large dimension MCPBaosheng Zhao*National Astronomical Observatories of CAS* E-mail :open@opt.ac.cn
Contents • Research Bases • 2. Project Demonstration & Design • 3. Key Technologies and Research Contents
1. Bases EUV (30.4 nm) Imager Based on WSA Detector - Supported by the Directional Project of Knowledge Innovation Project of Chinese Academy of Sciences
1. Bases Schematic Diagram of the System
1. Bases • Curved MCP Photo of the Curved MCP Curvature Radius: 70mm Effective Area: φ50mm Thickness: 0.8~1mm; Gain: 104 Patent Certificate
1. Bases The planar structure sketch, entire and local magnified photos of WSA collector (from left to right)
1. Bases Schematic of WSA Collector
1. Bases Gain Distribution
1. Bases Image of Dark-count Gain Distribution of Dark-count
1. Bases Imaging Result in our lab
1. Bases 1024×1024,spatial resolution superior to 150μm (a)Used WSA;(b)used CCD Camera
1. Bases UV Image Intensifier(110~200nm) Photocathode: CsI
2. Project Demonstration & Design Requirements of the spacial weak UV detecting: 1) Solar Blind; 2) Photon Counting Mode; 3) High Detecting Quantum Efficiency; 4) High Local Dynamic Range.
2. Project Demonstration & Design Detecting Wavelength Range: 110nm-320nm Photocathode: 110nm-175nm, CsI 170nm-320nm, CsnTe Schematic of the Detector
dimension : 150X50X40(mm3) Input dimension: 106X6(mm2) Spatial resolution: 40μm 2. Project Demonstration & Design Rectangle Profile of Detector
2. Project Demonstration & Design Profile of Detector
Ceramic parts custom-making Heat treatment Ceramic metallization Final assembly Design Metal parts custom-making Heat treatment Nickel deposition Leak detection Inspection /storage Laser soldering 2. Project Demonstration & Design Technics of Vacuum Shell
Optical manufacture Nickel deposition Design Photolithography Inspection Indium sealed edge metallization(NiCr+Au) 2. Project Demonstration & Design Technics of Mg2F Window
2. Project Demonstration & Design WSA Collector Design 1) MCP – Ge Layer – WSA Collector 2) MCP – WSA Collector Design Draft of the WSA Collector
Key Technological Indexes 2. Project Demonstration & Design Curved MCP Effective Area: 106×6 mm2 Size: 112×12 mm2 Gain: 104 Pore Diameter: 12.5 micron Ratio of Length to Diameter : 40:1 Thickness: 0.5 mm Resistance: 40~80MΩ Curvature Radius: 1000mm
2. Project Demonstration & Design Photocathode CsI a) 100-175nm photocathode b) 170-320nm photocathode Cs2Te
2. Project Demonstration & Design Electronic Readout Subsytem
3. Key technologies and research contents Key technologies: • High quantum efficiency and large format photocathode preparation technology; • Cylinder MCP preparation technology; • High resolution WSA electron collector preparation technology; • High voltage power supply with low ripple and high stability and control circuit technology; • Low noise charge sensitive preamplifier, pulse shaping circuit, sample and hold circuit, AD convertor, DSP and FPGA digital technologies; • Detector calibration technology.
3. Key technologies and research contents Research contents: • LSS detector scheme; • Detector structure design; • Detector electro-optical system design; • Spherical (curved) surface MCP manufacture; • WSA structure design; • Detector electron read-out system design; • High voltage power supply design with high stability and low ripple; • Auto gain control circuit system design for high voltage power supply; • Detector system calibration.