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Integrated Circuit and System Design Expertise: The Heart of Future Electronic Products

Integrated Circuit and System Design Expertise: The Heart of Future Electronic Products. Charles G. Sodini MIT Cambridge, MA January 14, 2003. Wafer Fab. Assembly Test. Marketing Dist. Design. Electronics Products Value Chain. Components. General Characteristics

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Integrated Circuit and System Design Expertise: The Heart of Future Electronic Products

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  1. Integrated Circuit and System Design Expertise:The Heart of FutureElectronic Products Charles G. Sodini MIT Cambridge, MA January 14, 2003

  2. Wafer Fab Assembly Test Marketing Dist. Design Electronics Products Value Chain Components • General Characteristics • IDM’s perform all functions • Value-added processes in wafer fab • Huge Capital Costs • Foundries perform only one function

  3. Electronics Products Value Chain (con’t) Products Product Definition Manufact. Test Marketing Dist. Design Service • General Characteristics • Multinational Companies • Strong in Product Defn, Marketing Distribution and Service • Detailed Design and Manufacturing - often sub-contracted

  4. Changing Face of Electronics Products • Traditional consumer electronics examples • Audio, Video, Telephones • Traditional PC electronics examples • PCs, Laptops, Peripherals • Examples of PC/Consumer electronics products • DSCs, MP3 players, Cell phones, PDAs, DVDs Rapid convergence of consumer and PC electronics offers interesting opportunities

  5. Electronics Products Business Models • Dominated by Multinational Corporations • Functions performed • Product definition • Use both “off the shelf” and special purpose chips • Marketing/Distribution • Service • Growing importance in providing revenue streams • Functions outsourced • Detailed product design • Manufacturing & Test

  6. Opportunity for New Business Model • Combine innovative product definition with special purpose chip design • Unique products with higher value become possible • Higher barrier to entry • Special purpose chips are difficult to duplicate rapidly

  7. Example - SMaL Camera Technologies • Technology developed at university • Brightness Adaptive Imaging • Low power image sensor design • At Company • Innovative product definition • Complete re-design of image sensor for product application

  8. Innovative Product Design • Form factor possible • High level of integration • Low power dissipation

  9. Partner with Multinational Companies for Marketing and Distribution

  10. Innovation Business Model • Perform IC design and innovative product design • High value-added functions • Outsource wafer fab, assembly & test • Partner with Multinationals for manufacturing marketing/distribution and service

  11. Wafer Fab Assembly Test Marketing Dist. Design IC Design Research and Development • Define research driver system that pushes current design capabilities. • System driver should push architectural as well as circuit design knowledge • In the components model this research feeds directly into the design function.

  12. HDTV videophone controller (NGI) stereo novelties Wireless Gigabit Local Area Network (WiGLAN)An IC Design Research Driver at MIT • PC Peripherals • Consumer Electronics • Interactive Video

  13. Research Goals • Demonstrate key circuit and system concepts to advance wireless LAN to Gb/sec data rates • Adaptive system architecture to support wide range of data rates and quality of service • Develop low power design techniques at the circuit, chip architecture and system level to support portable appliances

  14. WiGLAN ADAPTER WiGLAN ADAPTER WiGLAN ADAPTER WiGLAN ADAPTER High Data Rate Appliance ADAPTER Appliance Appliance Appliance W iGLAN Processor WiGLAN Architecture • Network Controller • Allocates channels • Measures SNR • Space-Time Diversity Network Controller NGI

  15. DSP Space-Time Processing Network Server DSP Multi-Carrier Adaptive Rate QAM Network Controller with Space-Time Diversity Receiver Chain Transmitter Chain Receiver Chain Transmitter Chain Receiver Chain Transmitter Chain Receiver Chain Transmitter Chain • Digital Modulation • Digital Space-Time Diversity Processing • Improves channel capacity • Replicated Transmit/Receive Chain

  16. OFDM 150 MHz bandwidth available in 5.8 GHz band, with bins ~1 MHz wide. • Conversion between time and frequency via (I)FFT • Narrow bins provide more granularity for changing data demands • Narrow bins increase total complexity, but allow greater potential for parallelism • Cyclic prefix similar to frequency guard bands

  17. Adaptive Modulation • Can adaptively change modulation for each bin based on measured channel response. Either optimal (gray) or coarse (dark gray) water pouring can be used. • Most of the benefit comes from avoiding very bad frequency bins. • Optimal: 54 b/s/Hz • Coarse: All equal • 40 b/s/Hz • 48 b/s/Hz (best) • Threshold may differ for each block • Coarse requires less overhead to identify bin modulation

  18. Digital Signal Processor Baseband Mixed-Signal Processor RF Trans. Appliance Network Adapter Block Diagram • Physically Small - Requires High Integration • 3 Major IC’s - RF, Baseband Mixed Signal, DSP • Quality of Service - Scaleable with Power Dissipation Network adapter

  19. Baseband Mixed-Signal Processor Wideband A/D Conversion • DC-150MHz, oversampled at 600MSPS • ~12 bit linearity/resolution • Low power (~1W, core) Programmable Gain Amplifier • 0-20dB, 72 dB Linearity Channel Equalization • Channel fading characteristic requires only modest amplitude equalization

  20. Digital Signal Processor Baseband Mixed-Signal Processor RF Trans. Appliance Network Adapter Block Diagram • Physically Small - Requires High Integration • 3 Major IC’s - RF, Baseband Mixed Signal, DSP • Quality of Service - Scaleable with Power Dissipation Network adapter

  21. WiGLAN Receiver: Architectural Approach Primary Goals • Multiple receivers in parallel • Fully integrated analog front end Major Challenges • Design & implementation of wide-bandwidth high frequency filters • Isolation between receivers

  22. WiGLAN Receiver: Integrated Filters Motivations: Isolation & matching complexities with use of multiple external discrete filters Approaches: • Q-enhancement techniques to compensate • low Q on-chip inductors • Simple & novel filter building blocks • Traditional passive & active integrated circuit techniques reuse, where appropriate, to implement higher order filters Challenges: • Filter stability with component tolerances • Receiver linearity and noise degradation

  23. WiGLAN Receiver: Image Reject Filter (Prototype Building Block) Tunable rejection response Tunable center frequency

  24. The Main Messages • Opportunity: Combine innovative product definition with special purpose chip design • Research to develop new technology is essential to feed component design capabilities. • Circuit and system techniques developed in the research environment should have wide applicability in future products given a well defined system driver. • IT TAKES TIME: Research does not output results directly for products

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