1 / 11

Wafer Edge Exclusion

Wafer Edge Exclusion. Kevin Fisher. Outline. What is Edge Exclusion? Motivation for reducing edge exclusion ITRS Roadmap Problems on the Edge Example: Copper Deposition. What is Edge Exclusion?. Edge of wafer considered unusable for a variety of reasons

aquarius
Download Presentation

Wafer Edge Exclusion

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Wafer Edge Exclusion Kevin Fisher

  2. Outline • What is Edge Exclusion? • Motivation for reducing edge exclusion • ITRS Roadmap • Problems on the Edge • Example: Copper Deposition

  3. What is Edge Exclusion? • Edge of wafer considered unusable for a variety of reasons • Chips entirely on wafer but too close to edge are still invalidated

  4. Yield Loss on the Edge • Current edge exclusion is 3mm • Reduces usable area of wafer by 2% • 300mm wafer: 70685 mm2 total area • 297mm usable area: 69279 mm2 • Area loss: 1406 mm2 • Athlon 64 die size: 144 mm2

  5. Increasing Yield 300mm Pentium 4 Processor wafer (130nm)

  6. ITRS on Edge Exclusion • Two references in 2003 Yield Enhancement report

  7. Problems on the Edge • Chips, cracks, identification notches • Slurry/photoresist residue • Cleaning contaminants • Peeling films

  8. Copper Interconnects • Two problems affect edges of wafers with copper metal layers • Barrier, seed layer residue • Copper islands

  9. Barrier/Seed Residue

  10. Copper Islands

  11. One Solution: Wet Processing Chambers • Apply film in liquid-filled chamber • Chemical breaks film’s surface tension

More Related