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Welcome to DVCon China !

Welcome to DVCon China !. Bin “Rocker” Liu General Chair Intel Corp. Conference Sponsor. www.accellera.org. Accellera Global Sponsors. Vice Chair Henry Chew UNISOC Technologies. General Chair Bin “Rocker” Liu Intel Corp. Introducing the Steering Committee.

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Welcome to DVCon China !

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  1. Welcome to DVConChina! Bin “Rocker” Liu General Chair Intel Corp.

  2. Conference Sponsor www.accellera.org Accellera Global Sponsors

  3. Vice ChairHenry ChewUNISOC Technologies General ChairBin “Rocker” LiuIntel Corp. Introducing the Steering Committee • Poster ChairLincoln LeeMentor, A Siemens Business TPC ChairRoman Wang AMD Inc. TPC Vice ChairJinhuang HuangTsinghuaic Short Workshop ChairSimon ChangCadence Design Systems Tutorial ChairPeiyu LiuQualcomm DVCon US RepresentativeDennis BrophyMentor, A Siemens Business Accellera RepresentativeLu DaiQualcomm Finance ChairLynn GaribaldiAccellera

  4. Conference Management Meet the on-site staff that is here to assist you throughout the conference! Robin Albright Conference Management MP Associates, Inc. Kevin Lepine Conference Management MP Associates, Inc. In partnership with:

  5. Join DVCon Across the WORLD!

  6. Peiyu Liu Tutorial Chair

  7. Tutorials Thank you to our Sponsors: Tutorial 1: Next Gen System Design and Verification for Transportation 1630 – 1800 Ballroom A Tutorial 2: Open Virtual/Hybrid System Platform Speed-up the Idea to SW and HW Design 1630 – 1800 Ballroom B Tutorial 3: Enabling Continuously Fast HW/SW co-Design and co-Verification -- Virtual Prototyping & Hybrid Emulation 1630 – 1800 Pudong

  8. Simon Chang Short Workshop Chair

  9. Short Workshops Thank you to our Sponsors: Short Workshop 1: Portable Coverage: Integrating Formal and Simulation Coverage for Efficient, Faster Verification Signoff 1315 – 1400 Ballroom A Short Workshop 2: Using Portable Stimulus to Verify an ARMv8 Sub-System Integration on an SoC 1315 – 1400 Ballroom B Short Workshop 3: Verification Strategy in a Connected World of 5G 1315 – 1400 Pudong

  10. Short Workshops Thank you to our Sponsors: Short Workshop 4: Smart FPGA Prototyping for Fast Bring-up on Billion-gate Design 1530 – 1615 Ballroom A Short Workshop 5: Billion-cycle Power Estimation using Fast Emulation 1530 – 1615 Ballroom B Short Workshop 6: Using Verification Continuum Platform to Speed PCIe System Verification 1530 – 1615 Pudong

  11. Roman Wang Technical Program Committee Chair

  12. Stuart Lindsay • Advanced Micro Devices, Inc. • Bin Liu • Intel Corp. • Ruping Ma • Altran Group • Wei Mao • Horizon Robotics • LiboMeng • Analog Devices, Inc. • Wu Shan • ZTE • Pankaj Singh • Cadence Design Systems, Inc. • Brian Sniderman • Advanced Micro Devices, Inc. Mike Bartley Test and Verification Solutions William Chen Advanced Micro Devices, Inc. MalathiChikkanna Broadcom Corp. Leo Fang Synopsys, Inc. Harry Foster Mentor, A Siemens Business Bill Fu Realtek Semiconductor Corp. Shujun Hou Tsinghuaic Ajeetha Kumari CVC Pvt., Ltd. • Jia Tian • Gigadevice • Darko Tomusilovic • Vtool Ltd. • Srinivasan Venkataramanan • CVC Pvt, Ltv. • Alex Wan • NXP Semiconductors • Justin Wang • Media Tek, Inc. • Roman Wang • Advanced Micro Devices, Inc. • Gaoxue Xu • Unisoc Communications, Inc. • Deyoung Yang • Unisoc Communications, Inc. • Fan Yang • Fudan University • Baodong Yu • Beijing Smartchip Microelectronics Tech. • Alex Zhang • Qualcomm, Inc. • David Zhang • Cadence Design Systems, Inc. • Landy Zhang • DJI • Xiuqin Zhang • Xi’an UnilC Semiconductors • Xufeng Zhang • Unisoc Communications Inc. • Junhao Zheng • Spreadtrum TPC Committee

  13. Technical Submissions • Abstract Submissions • 51 Extended Abstracts Submitted • 12 Papers Accepted for Oral Presentations • 23% Acceptance Rate • Poster Session • Additional 15 high quality submissions presented as a poster • Fully reviewed! • Papers & Posters in proceedings online Total of 53%Acceptance Rate for Oral & Poster Presentations

  14. Best Paper & Best Poster Awards YOU BE THE JUDGE! • Attendees select the outstanding papers and posters. • Voting will close at 16:15 • Presentation of Award Recipients will be right before the evening keynote in Ballroom B. • https://www.surveymonkey.com/r/FLGPZXT

  15. Special Thanks to our Sponsors TUTORIALS KEYNOTES

  16. SHORT WORKSHOPS REGISTRATION Special Thanks to our Sponsors MEDIA PARTNERS

  17. Welcome Exhibitors

  18. Wednesday, April 17: 10:45 to 18:00 Visit DVCon China’s many interesting exhibitors located in the hall to network with colleagues, collaborate with industry leaders, and hold one on one discussions! Expo Hours

  19. Enjoy DVCon China 2019!

  20. Keynote 1 Driving Digitalization With A Boundary Free Innovation Platform Dr. Stefan Jockusch Vice president of Strategy for Siemens PLM Software Thank you to our Sponsor:

  21. Keynote 2 The Race for 5G Leadership is ON: Is Our Verification Up to the Task? SusheelTadikonda Vice President of Verification Continuum Solutions Engineering in the Verification Group at Synopsys Thank you to our Sponsor:

  22. Keynote 3 Optimizing Verification Throughput for Verification in a Connected World of 5G and AI/ML Michał Siwiński Vice President of Product Engineering and Management for the System & Verification Group at Cadence Design Systems Thank you to our Sponsor:

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