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Your Technology Experts …2017

Your Technology Experts …2017. Your Full Service, Time Sensitive, Printed Circuit Board Solution.

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Your Technology Experts …2017

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  1. Your Technology Experts…2017

  2. Your Full Service, Time Sensitive, Printed Circuit Board Solution Located in the Heart of Silicon Valley, Streamline Circuits is your premier PCB manufacture of leading edge Technology and Innovation. We offer full service solutions for Rigid PCB’s, Flex PCB’s and Rigid-Flex PCB’s in both Ultra Quick Turn options along with Standard Production lead times. You will find that Streamline holds the necessary certifications to insure the highest standards of workmanship while supporting your companies specifications. TeleCom Mil / Aerospace DataCom Industrial Medical

  3. Streamline Circuit Corp’s Facility Manufacturing all levels of technology Time sensitive prototyping through production The facility was established in 1982 New management team installed September 2003 75,000 sq. ft. PCB manufacturing facility Complete manufacturing process under one roof 1 mile from the San Jose Airport Delivery convenience for out of state customers Located in Silicon Valley Short car ride away for pick up & deliveries Financially secure in current market conditions Low cost infrastructure Located in Silicon Valley

  4. Management and their Experience • Chuck Dimick –CEO / Founder • Over 38 years of experience in PCB manufacturing.  Former CEO of Dynamic Details Inc. and founder of the company's predecessor, Dynamic Circuits Inc. (1991) • Greg Halvorson – President / Founder • Over 34 years of experience in PCB manufacturing. Former VP of Operations of Dynamic Details Inc. and Dynamic Circuits Inc. • Tom Doslak – Sr. Vice President of Sales & Marketing / Founder • Over 26 years of industry experience. Former Director of Sales for Braztek Intl. and Western Regional Sales Manager for Dynamic Details Inc. • Michael Graves - Vice President of Operations • Over 30 years industry experience in both production and prototype manufacturing. Former VP of Operations for Pacific Circuits, and DDI. He also has experience as Quality Manager of a major PCB fabricator. • Lorraine Hook – Director of Quality • Over 47 years of industry experience. Former Director of Quality for many successful companies including DCI and DDI. She has held dual positions as Corp. Quality Systems Manager. • Mike Trammel – Director of Engineering • Over 28 years of industry experience. Former Director of Engineering for DDI and Dynavision. 12 years of Materials Application Engineering and R&D experience.

  5. Management and their Experience Cont. • JR Ramirez – Production Manager / Founder • Over 36 years of industry experience. Former Production Manager for both Dynamic Details Inc. and Dynamic Circuits Inc. • Louis Oliveira – Pre-Production Engineering Manager • Over 29 years of CAM “Computer Aided Manufacturing” experience to Streamline Circuits. Previously was Pre-Production Engineering at Dynamic Details. Held various key positions at Davila International Circuits. • Phil Ramon – Pre-Production Engineering Supervisor • Over 36 years of experience in the PCB industry. Previously worked for 16 years on the management team for South Bay Circuits, more than 9 years as Pre-Production Engineering Manager and 10 years at CTS Printex. 

  6. Customer Service Support Customer Service (24 hours - 7 days a week) Sales, Engineering, Manufacturing and Quality Dedicated customer service readily available-our support group’s located onsite in the facility Quick response to all requests such as: Job status Delivery pull-in Quantity Increases Engineering design modification Inside Sales Customer Support

  7. Proactive Engineering Services Manufacturing Capabilities Prototype though volume All time sensitive builds DFM (Design for Manufacturability) DFM Software (reviews in 10 minutes) Net list compare to customer data Custom Verification programs Looking for customer design error In plan Smart data Collection System Controlled Impedance Verification Stack up assistance Copper distribution Material verification Cam Valor Stations 4 Laser Direct Imaging units

  8. Go to Pre-Production Controlled Impedance Verification • DFM Scan & Report • Stack up assistance • Copper distribution • Material verification • Sub Panel /Array Support

  9. Quality Reassurance Net list compare prior to MFG Matching Net list to Gerber data Front End DRC (design rule check) Searching for customer design mistakes AOI Automated Optical Inspection Verifying inner & outer layers, and SUBs X-Ray Verification After Lam (Inspecta), After Drilling Cross Section Verification Hole Integrity True-Chem Software Controlled Impedance Testing TDR test of panel coupons 100% Net List Test On All Product Eliminator Tester & flying probe Coordinate Measurement Machine First articles, 100% measurement verification In house Mil & deliverable Lab Automated Optical Inspection Fusion 22 (25 Micron)

  10. On Time Delivery Assurance 100% In-house manufacturing from start to finish Control delivery & customer flexibility In-process quality verification system No out sourcing delivery delays Employee Training program Performance evaluation every 6 months In-house Chemical Laboratory Cross Sections Chemical analysis Mil spec verification 10 flying Probe Testers Vacuum Lamination press

  11. Continuous Improvement Programs Working daily on: Research and Development Pre-Engineering Programs Improvement Process Program Department Performance Reviews Preventative maintenance program Employee Training Program Planned Capital expense program 48,000 holes per minute 7 Micro Via laser Total Management meetings

  12. A Full PCB Solution Multilayer Rigid / Rigid- Flex / Flex 1 to 70 Layers Plus 28:1 High Aspect Ratio 3.23 Mils Hole to Copper Buried / Blind Vias 9 Sequential Laminations 13+ Stacked Vias 1 Mil Trace & Space Cavity Constructions 6 oz. + Copper Thickness Copper Filled Micro Vias +/- 5% Controlled Impedance Tol. Certifications • AS9100 Rev. C / ISO 9001 / ISO 13485 • Mil-Spec 55110 / ITAR • RoHS & Halogen Free Materials • IPC 6012 Rigid / 6013 Flex / 6015 MCM / 6016 HDI / 6018 High Frequency • 3 Mil Mechanical Drills • 24” x 30” Oversize Panel • 2 Mil Laser Drill Vias • Up to 345 Mils Board Thickness • Via Under Pad (Conductive & Non-Conductive Filled) • 75+ Materials (Hybrid Constructions)

  13. PCB TECHNOLOGY ROADMAP Emerging Technology Engineering walk through Standard Manufacturing Advanced Manufacturing .0038” .0038” +/-.001” .003” .003” +/-.001” .002” .002” +/-.00075” .001” .001” +/-.0005” .0005” .0005” +/-.00025” Line Width 1. Line and Space Line Space Tolerance Drill Size .008” +.010” 28:1 .004” +.008” 20:1 .003” +.006” 20:1 .003” +.002” 28:1 2. Drilled Via Size Pad Diam Aspect Ratio Up to 36 Up to .187” <16”X22” 36 to 48 Up to .300” <19”X22” 48 to 60 Up to .350” <22X28 >.350 Layer Count 3. Misc. Attributes Thickness Board Size FR4 Polyimide PTFE HC (Rogers) Nano Foils Alternative Resin Systems Next Generation HSD Advanced Interposers Interposer Substates UTR’s 4. Laminate Materials Rigid Flex Rigid Flex FR4 Stiffeners High Speed Flex High Reliability Flex Data Security UL Multilayers EMI Shield Conductive Bond Ply Thin Flex UL Approved Flex *UTR = Ultra Thin Rigid 13 http://streamlinecircuits.com/high-speed-materials/

  14. TECHNOLOGY ROAD MAP CONTINUED 5. Micro Via Size Emerging Technology Engineering Walk through Standard Manufacturing Advanced Manufacturing .003” +.004” 1:1 Via Size .004” +.005” .6:1 .002” +.004” 2:1 .001” +.003” 3:1 Pad Dam Aspect Ratio HASL Entek Imm Silver ENIG ENEPIG LF HASL Eless Au Sel Solder Imm tin Solder Bump TBD 6. Surface Finishes +/-.003” .006” +/-.002” .003” +/-.001” .002” Tangency Registration 7. LDI Soldermask Min opening Min hole .012” 8:1 .010” 12:1 .008” 18:1 <.008 20:1 8. Conductive and Non-Conductive Via Fill Aspect Ratio 14

  15. Certifications Nadcap ISO 9001:2000 IPC 6012,13,15,16,18 Class 3 DA and DS ITAR AS9100 Rev C Mil-Spec 31032

  16. BACK Q-Pulse Total Quality Management • Quality Assurance Systems • Q-Pulse Quality System • NCMR’s and Corrective Actions • Audits • Training • Equipment Calibrations

  17. Use advanced equipment technologies to manufacture today's printed circuit board requirements The future in PCB manufacturing is about technology and automation Hire and Train equipment operators High percentage engineering personnel and staff Streamline’s Capital Expenditures Laser Direct Imaging Nuvogo LDI (18 Micro) Cuposit & Electroless Line DES Inner Layer Strip-line

  18. Streamline’s Toolkit 18

  19. IPC Manufacturing Class & Industries

  20. Rigid-Flex Examples 10 Layer Micro via BGA 6 Layer Rigid Flex 8 Layer Rigid Flex Micro via 6 Layer Rigid Flex with Cavity

  21. Pre Production Engineering Quality Verification Test Product Integrity Develop Etch Strip LDI Image Processing Electroless Technology Registration and Micro Via’s Solder Mask Silkscreen Off-Shore Solution Flex / Rigid-Flex Laser Drilling Test Cases PCB Equipment Needed for the Future Back

  22. Flex / Rigid-Flex

  23. Rigid-Flex Examples 10 Layer Micro via BGA 6 Layer Rigid Flex 8 Layer Rigid Flex Micro via 6 Layer Rigid Flex with Cavity

  24. Flex Capabilities

  25. Base Material Flex and Rigid Flex IPC- Manufacturer Material Name 4202/1 DuPont Pyralux FR 4203/1 DuPont Pyralux FR 4203/18 DuPont Pyralux FR, Pyralux 4204/1 DuPont Pyralux FR, Pyralux 4204/11 DuPont Pyralux AP 4101/21 Isola FR406, FR408, 370 4101/24 Isola FR406, FR408, 370 Arlon PrePreg 49N 4101B/124 Arlon PrePreg 51N 4101/26 Isola FR406, FR408, 370 Isola Prepreg FR406N Grace GA-170LL 4101/41 Arlon 35N Isola Prepreg P26 4101/42 Arlon PrePreg 38N 4101/99 Isola 370HR • Other Material Flex and Flex-Rigid • Name Manufacture Material Name • Conductive Silver Ink DuPont CB028 • Flex LPI Solder Mask Taiyo PSR-9000FXT, PSR-900 • Rogers RFLEX 8080 Liquid Coverlay • Kapton/Polyimide Stiffener DuPont Pyralux, FR, Pyralux • FR4 Stiffener Isola FR406, FR408, 370 • Grace GA-170LL • Polyimide Stiffener Arlon 35N • Aluminum Stiffener • Pressure Sensitive Adhesive 3M 467MP, F9469PC, F9460PC • Strain Relief (Epoxy) Emerson &Cuming Eccobond 45 Clear, Black Note: Other materials available and have been manufactured, but non standard on per customer request.

  26. Technology Process

  27. Quality Assurance Pre-Production Engineering Services • “In Plan” planning software • Customer Specific Rules Based Automation • Valor front end CAM (Unlimited Seats) • Industry Standard for front end engineering • Stack up consultations, Service OfferedNo Charge $ • Insight Frontline DFM’s, Service OfferedNo Charge $ • Tech Seminars /Webinars • Material Science, Latest in Laminates and Pre Preg’s • R&D, Building the Toughest to Gain the Knowledge • When you need it, we will be ready!

  28. Hybrid Construction for low cost (Meg 6 combined with low cost material for power layer)

  29. High Speed Materials Website Page

  30. DFM Report

  31. Go to slide 8 BACK Graphical DFM report

  32. Imaging System

  33. LDI (Laser Direct Imaging)Orbotech Paragon SM20

  34. BACK LDI Imaging Systems • 100% Laser Direct Imaging (LDI) • Repeatable process, computer controlled • 24/7 consistent imaging regardless of shift • No film means lower tooling costs • No repeating defects • Consistent trace width • Tighter impedance control (+/- 5 %) • ¼ Mil Accuracy .0008 Min Line/.0005 Space • Layer to layer registration within .0004” • No film growth due to heat expansion

  35. SCHMID Precision DES Line(Develop – Etch – Strip)

  36. BACK Inner Layer Develop Etch Strip • January 2012 State of the art Schmid DES line Installed • Computer controlled for consistent product • Full automation removes human element • 2 Micron variation over panel • 1 mil core capability for substrate, HDI, and Rigid flex • 4,000 Cores per day capacity based on current copper mix • Tripled capacity upon installation • Positions Streamline for future technologies

  37. ESI UV / CO2 Laser Drilling Systems • 42,000 Holes Per Minute • 2 tables (84,000 holes per minute with dual table deployment) • High speed and volume throughput • Removes RF stitching constraint • Copper weights can be reduced/more waveforms • Hole sizes are shrinking with increased density of collimator • Recipe controlled • Eliminates carbon burn on cutting edge

  38. Laser Drilling • 7 Laser drills in house (7th has been purchased) • Daily processing 4-N-4 of means experience • Higher stacks available • .0014” Hole, .004” Pad advances technology window • Aspect Ratio: 3:1 • Positional Accuracy for Hole Location +/- .0005”

  39. Via formation, Aspect Ratios and Stacked Vias for Increased Densities BACK

  40. BACK Electroless Processing • Completely Automated Line installed January 2012 • Industry leading 28:1 Aspect Ratio: allows for higher density designs • Bar coded processing removes operator errors • Dwell times established in planning for speed & efficiency, translating to consistent product • Ultrasonic, knife edge agitation, vibration & thumper • 36 stations, Oversized tanks (24”x 30” Panels) • High volume throughput capability

  41. IPS Automatic Electroless Plating Line

  42. Test Capabilities: BACK • 100% Flying probe testing (8 Systems) • Flexibility, no fixtures, less cost • Allows for testing sub chapters before final book • Everett Charles Eliminator for faster testing • Every board 100% Net List Tested

  43. ATG Flying Probe Testing (8) • 16 Head Test Units • Soft Touch Capable • Fine Pitch .19mm Centers to .003 Pitch • ATG’s A7a (2) • 8 advanced speed test heads • Self-loading automation • Automatic adjustment of the vacuum matrix • Universal shuttle with tensioning function • 4 wire measurement • Micro short detection • Label printer

  44. PluritecInspecta X-ray Registration System

  45. Internal Registration In unison with “Xact Software” for scaling Internal Registration is one of the key attributes in being successful X-Ray allows verification in real time X-Sections Verify X-Ray

  46. Xact Scaling Report

  47. Non Conductive Filled Via Wrap Per IPC 6012 Class III Electroless Wrap Smooth Copper Dendrites (Teeth)

  48. Copper Fill Laser Vias & Through Hole Solid Copper Vias BACK Thermal Via Farms for Thermal Management

  49. Chip Scale Packaging Requires Streamlines Equipment Sets for Success-100% LDI Chip Scale Packaging

  50. LSMDP Laser Solder Mask Defined PadUsing the LDI’s Precise Imaging to .0005” clearance Allows reduced solder mask clearance sizes May reduce layer count Maximize geometry Using laser solder mask defined pad (LSMDP) You can define a “Pad” on top of a pad

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