Transfer Calibration

1. Transfer Calibration LRT Training Center Shaw Wang

2. Theory of Operation • All wafer locations throughout the system are defined as stations. • Each robot must be calibrated (“taught”) to each station. • Stations are typically defined by the wafer center at each location. • The wafer center position is defined by a radial (R) and theta (T) coordinate relative to the robot being taught. The vertical position (Z or BTO) is defined relative to the robot being taught. Which is typically defined as the wafer height that the wafer can freely enter and exit the station. • Stations with multiple slots must define the number of slots (slot) and the pitch (p) between the slots. • For stations not radially located from the robot center, the wafer path to and from the station must also be defined (via points). • For stations which require mapping, map positions must also be defined. These positions are typically defined with radial, theta and wrist coordinates. • Reference • “Transfer Calibration procedure”, 202-012898-001 Rev G

3. CDM (Control display module) Dummy wafer (Carbon wafer) Chamber fixture ATM arm position Airlock fixture Dynamic Alignment FOUP fixture ATM Aligner fixture Refer document:202-012898-001 version G Transfer Calibration Fixtures

4. Transfer Calibration Fixtures

5. ATM Robot Drive ATM Robot Controller Motor Power Terminal Server RS-232 Serial Cable Signal Cable (SIO 1) Null Modem Cable (SIO 2) RS-232 Serial Cable Aligner VTM Robot 24VDC Power 24VDC Power VTM Mother Board Misc IO Misc IO System Block Diagram ATM ROBOT COVER SWITCHES LPM 1, LPM 2, LPM 3 Aligner Window A/L1 Window, A/L2 Window Right Side Window (Bottom) Right Side Window (Top) Newer Systems

6. ATM Robot Cover Switches A/L 2 Window Right side Window A/L 1 Window Alinger Window Loadport Switch 1 ,2 & 3

7. ATM 2 Middle FOUP ATM 3 Right FOUP ATM 1 Left FOUP ATM 7 Aligner ATM 4 IMM ATM 10 ATM 8 ATM 9 ATM / VTM 6 Left Airlock (1) ATM / VTM 5 Right Airlock (2) VTM 4 PM 4 VTM 1 PM 1 VTM 3 PM 3 VTM 2 PM 2 Station Numbering

8. Wafer Flow • Serial Processing • Poly, Exelan

9. Wafer Flow • Parallel Processing • Metal/Strip, Poly/Strip

10. ATM Calibration • Module station positions (R, T, Z) are taught by the user using the CDM and a fixture that is placed in the module. • Intermediate points are defined by calculations based on the nominal positions. • Intermediate points include via positions, map positions, & map via positions. • Nominal points are based off of a defined home position. • Constants are defined where possible and set based on nominal positions or values.

11. VTM Calibration • Module station positions (R, T, Z) are taught by the user using the CDM and a fixture that is placed in the module. • Constants are defined were possible and set based on nominal positions or values. • Each VTM position is optimized using Dynamic Alignment (can be done at atmosphere or vacuum) • A wafer is perfectly centered in the station • Wafer is centered either by a fixture (PM) or by the aligner (LL) • Routine is run through system software to adjust the station • The wafer is picked • Dynamic Alignment reports a radial and theta offset (wafer center offset). • Station position (R and T) is adjusted so that the arm and the wafer line up.

12. Prepare the System • 2300 software ready. • ATM /VTM Robots had installed. • System must be leveled. • Robots and aligner had been setup. • Pin lifter calibrated.

13. Leveling Procedure • ATM Robot Leveling. • Aligner Leveling. • Airlock Buffer/Cool Station Leveling. • 25 slots Buffer station Leveling. • LPM Installation and Leveling. • KLA Metrology Station Leveling. • VTM Robot End Effector Leveling for SCARA Arm. • ATM Robot vacuum switch set up.

14. ATM/VTM Robots Calibration • ATM-LPM. • ATM-KLA Metrology Station. • ATM-Airlocks. • ATM-Aligner. • ATM-Buffer/Cool station. • VTM-Airlocks. • VTM-PMs. • After finished all the station, do the ironman test. • To identify the reliability of transfer.

15. Diagnose\Iron Man

16. Calibration Parameters

17. Backup – WPS System

18. WPS System • Dynamic Alignment is a wafer location and centering algorithm used during wafer transfer in the VTM. Dynamic Alignment uses two sensors on each facet to determine the location of the wafer. • 200mm use sensor 2 for wafer presence. • 300mm use sensor 1 for wafer presence. 300mm Wafer 200mm Wafer

19. WPS controlPCB Sensor optical 7 Sensor optical 1 P2 P1 Sensor optical 8 Sensor optical 2 P4 P3 Sensor optical 9 Sensor optical 3 P6 P5 Sensor optical 10 Sensor optical 4 P8 P7 Sensor optical 11 Sensor optical 5 P10 P9 Sensor optical 12 Sensor optical 6 P12 P11 VTM Mother PCB WPS System • 200 mm System Connect to Emitter Connect to Detector AL1 S2T AL1 S1T AL1 S1R AL1 S2R AL2 S1T AL2 S2T AL2 S1R AL2 S2R PM1 S1T PM1 S2T PM1 S1R PM1 S2R PM2 S2T PM2 S1T PM2 S2R PM2 S1R PM3 S1T PM3 S2T PM3 S2R PM3 S1R PM4 S1T PM4 S2T PM4 S2R PM4 S1R

20. WPS System • 300mm System Connect to Emitter Connect to Detector AL1 S1T Sensor optical 7 WPS controlPCB Sensor optical 1 AL1 S3T P2 P1 AL1 S1T AL1 S3R AL2 S1T AL2 S3T Sensor optical 8 Sensor optical 2 P4 P3 AL2 S1R AL2 S3R PM1 S1T PM1 S3T Sensor optical 9 Sensor optical 3 P6 P5 PM1 S3R PM1 S1R PM2 S3T Sensor optical 10 Sensor optical 4 PM2 S1T P8 P7 PM2 S3R PM2 S1R PM3 S3T PM3 S1T Sensor optical 11 Sensor optical 5 P10 P9 PM3 S3R PM3 S1R PM4 S3T PM4 S1T Sensor optical 12 Sensor optical 6 P12 P11 PM4 S3R PM4 S1R VTM Mother PCB

21. WPS System • Location

22. Component • Transducers • 24 VDC to provide light source for fiberoptics • Convert light energy into 5 VDC signal • LEDs • Green - DC Power ON • Amber - OFF when Blocked • Gain Adjustment - Factory Set LEDs Transducers Center Finding PCB Gain Adjustment

23. Component • Detector • Receive light if not blocked by wafer • Emitter • Send light Emitter Detector

24. DA function • Theory of Operation

25. DA function • Theory of Operation