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HIP-Module Technology HIP- 全新组件技术

HIP-Module Technology HIP- 全新组件技术. Higher Power and Lower Cost ($/W) 更 高功率 同时 更低成本（ 美元 / 瓦）. HIP-Module Technology – powerfull HIP- 组件技术 - 高功效. compared to standard H-pattern module 和传统的 3 栅 电池 片组件相比， HIP 组件： 5% more power output 增加 5% 的功率输出 40% less shading 减小 40% 的遮光面积

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HIP-Module Technology HIP- 全新组件技术

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  1. HIP-Module TechnologyHIP-全新组件技术 Higher Power and Lower Cost ($/W) 更高功率同时更低成本（美元/瓦）

  2. HIP-Module Technology – powerfullHIP-组件技术-高功效 compared to standard H-pattern module 和传统的3栅电池片组件相比，HIP组件： • 5% more power output 增加5%的功率输出 • 40% less shading 减小40%的遮光面积 • 60% lower resistive losses 降低60%的阻抗损失

  3. 277W Module reached in first trial首批试产组件达到277瓦

  4. 5% Higher Module Power提高5%的组件功率 5%

  5. Low cell-to-module losses更低的CTM封装损失 • Calculated optical and electrical losses for a monocrystalline HIP-Module • 单晶HIP组件从电池到组件的光电损失计算图

  6. 60% Lower Resistive Losses in the Ribbon降低60%因焊带产生的阻抗损耗 • FF loss in theRibbon • HIP-Module: • 4x4mmx0.15mm: 1.6% relative H-Pattern Module 3x1.5mmx0.2mm 4x4mmx0.056mm: 4.3% relative FF loss of HIP-Module is 60% lower than FF loss of standard H-pattern module. HIP组件的FF填充因子损失相比标准H型组件 降低了60%

  7. HIP-Module Technology – cost efficientHIP-组件技术- 成本效益 • 2% lower cost ($/W) compared to standard H-pattern module 成本比标准3栅组件低2%(美元/瓦) • 35% lower Ag usage compared to standard 3 busbar cell 比标准3主栅电池片组件少用35%的银浆 • 30% lowerinvestand 10% lowermaterial cost($/W)

  8. 2% Lower Cost降低2%的组件成本 2%

  9. Useofstandardmaterialsandprocesses • Standard PV-ribbonscanbeusedforthecellinterconnection • No additional material (such assolderpasteorconductiveglue) isneededtocontactthecells • Onlystandard, off theshelfequipment (Stringing, Lay-Up, Bussing, EL-testing) isneeded

  10. HIP-Module Technology – superior designHIP-组件技术-更出众的设计 • Only thin and straight lines are visible 整块组件只有稀少的几根直线图案 • Ribbons are all hidden behind the cells 所有焊带联结隐藏在电池片背后 • Module can be produced in a all white version or in a all black version 可实现全黑组件或全白底组件

  11. Breakthrough in cell interconnection电池片背面串联的突破 • Old Interconnection原串联方式 • Fork type叉状型– complex复杂 • New Interconnection新串联方式 • S-shaped ribbon S型 焊带 Turning of every second cell 每隔一片进行旋转– asymmetic pad arrangement - 不对称的背面形式 • Eliminates 180° turning 避免了180度的旋转 • Enables symmetric pad arrangement 保证背面的对称性

  12. Isolation hidesribbons • Isolation hidesribbons also betweenthecells 绝缘胶带可隐藏电池片间的联 结焊带 • Isolation isavailable in blackorwhite 可选择黑色或白色绝缘胶带 • Holes are stamped during stringing process 焊接的同时可实现绝缘胶带圆孔冲压 Detailed view 局部细节

  13. HIP-Module Technology – easy toimplementHIP-组件技术-更出众的设计 • Onlythestringerneedstobeexchanged in themoduleline, all theotherequipmentscan still beused. • Only a hole drillingmachine (with Laser) isneeded in thecellline. • The reuseofexistingequipmentmakestheimplemenationoftheHIP technology fast andaffordable

  14. Yourwaytoimplementthe HIP-Technology • Step 1: Adapt the cell for HIP, mainly the arrangement of the back contact pads. Komax Solar can provide support. • Step 2: Upgrade or install the production equipment for HIP cell interconnection. Komax Solar is the owner of the secured Intellectual Property and can provide a quotation for the cell interconnection equipment. • Step 3: Obtain the license for using HIP technology. The license is granted to PV module producers by Komax Solar free of charge. Interested in the HIP-Module Technology?如对HIP新组件技术有兴趣 Talk to请联系：

  15. Acknowledgements致谢 • Komax Solar, Inc. wouldliketothank Fraunhofer ISE forcellproduction, modulelaminationandthesimulations. In addition, wewouldliketothankHeraeusPreciousMetalsandPemcoforprovidingpastes, aswellas, Rena forwetchemicalprocesses. We would also like to thank Ulbrich for providing wide and thin ribbons and 3M for providing insulating material betweencell and ribbons. • 库迈思太阳能公司想感谢弗劳恩霍夫（ Fraunhofer ISE）提供协助电池生产，组件层压和模拟测试。此外，我们要感谢贺利氏公司和Pemco公司提供银浆，以及Rena公司提供的湿化学工艺。我们还要感谢奥博锐提供宽而薄的焊带和3M公司提供电池和焊带之间的绝缘材料。

  16. Thank you for your attention！ 谢谢您的关注！

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