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MUON UPGRADE: ME0

MUON UPGRADE: ME0. All engineering drawings from Sasha Surkhov 22.2.2014 PRELIMINARY !!. GMM 3-3-2014. INTERFACE HE: ME0. Extension up to 3.0 ; 3.5 ; 4 ? Calorimeters are working o ut various scenarios. ME0 CHAMBER LOCATION. R_in is 400mm  R_out 1400mm Z_min 200mm Z_max 300mm.

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MUON UPGRADE: ME0

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  1. MUON UPGRADE: ME0 All engineering drawings from Sasha Surkhov 22.2.2014 PRELIMINARY !! GMM 3-3-2014

  2. INTERFACE HE: ME0 • Extension up to 3.0 ; 3.5 ; 4 ? • Calorimeters are working • out various scenarios

  3. ME0 CHAMBER LOCATION R_inis 400mm  R_out 1400mm Z_min200mm Z_max300mm

  4. SHIELDING

  5. Possible ME0 Stack Layout Back flange Mechanical Supports Guiding Rail & Services Pocket For package of 6 • 20-degrees/chamber in phi, 2-chamber units offset in phi degrees in successive layers • Assures 4 or more hits at all f , given the dead space between abutting chambers • Absorbers removed from previous version • Need simulations to evaluate geometry • Weight of each 20 x 18 degree 6 layer wedge 60x6 = 360 kg • Weight of ME0 per endcap 360x12= 4320 kg 6 1 3 5 2 4 Thicknesses cm: 2.5 Borated Poly 1.2 Pb 3.2 Single Chamber 1 3.2 Single Chamber 2 3.2 Single Chamber 3 3.2 Single Chamber 4 3.2 Single Chamber 5 3.2 Single Chamber 6 3.2 Sliding Rail 1.2 Pb 2.5 Borated Poly ------------------------ 28.8cm 2.5 borated polyethylene plus 1.2 Pb for n shielding f direction → 2.5 borated polyethylene plus 1.2 Pb for n shielding 12 30 degree Chambers R_inis 400mm  R_out 1400mm Z_min200mm Z_max300mm Dz = 30 cm • Archana: 21.2.2014

  6. Readout Electronics - Current baseline VFAT3 ASIC GEB Opto-hybrid GBT TTC TTC Opto links uTCA uTCA DCS DCS DAQ DAQ Muon TF Backend electronics Paul Aspell & Gilles Delentdecker

  7. ME0 Power : Possible Granularity • Each single detector will consist • 3072 readout channels – strips running one directional in φ • 24 VFAT3 chips • 1 optical-hybrid based on GBTs • One ME0 super-module wedgewill consist 6 times the single detector. • 18432 readout channels – strips running one directional in φ • 144 VFAT3 chips • 6 optical-hybrids based on GBTs

  8. LV Power Table and LV Cables Package 8A@3V 14A@3V 22A@3V • Modular Structure of ME0 permits easy maintenance and operation of all the electronics • The LV power granularity should follow the same concept. It will secure: • Flexibility of switch on/off part of the super-module • Secure the LV current monitoring on single detector level. • Dealing with “low” currents per cable. • The LV power cable package couldbe: • 6 cables for the VFATs 8A@3V • 6 cables for the optical hybrids 14A@3V

  9. Fibers – Possible Layout • Per single detector we have 4 versatile optical links with 8 fibers to the uTCA GEB in total • Per super-module we will have 24 versatile optical links with 192 fibers to the uTCA GEB

  10. HV Powering • It will be based on Multichannel system able to measure the HV currents through the GEM foils. GEM tops GEM bottom

  11. Cable Package for the ME0 super-module - Wedge 12 LV cables – (6 x 14A@3V) + (6 x 8A@3V) 192 Fibers (24 versatile links to uTCA GEB) 6 HV Multi-core cables

  12. Approximate ME0 Deadlines August 20 Submit CMS/LHCC March 20 First Draft April 20 II Draft May 20 III Version June 20 TP Ready TP Preparation Stack Layout Wedge Engineering Layout R&D Needed Module Layout Readout Layout Front-End electronics DAQ Cost Estimates Services Layout Integration Layout CERN Test Beam Requests Costing estimates

  13. BackUP • Documents available from integration Office

  14. DETAILED INFO ON SHIELDING

  15. Present Shielding for ME1/1: Need Simulations for ME0 shielding 20mm B-Poly + 10mm Pb h=2.0 GE1/1 GE0 25mm B-Poly + 12mm Pb Neutron Shielding 50mm B-Poly + 50mm Pb Z ~ 5250-5530* GMM - Archana Sharma - 3/2/2014

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