MPPE

1. MPPE

2. (1) Progress from the Sep. 2005 design meeting • <MPPE> • 18 Oct 2005(Tue) 4th MPPE meeting @ ISAS/JAXA • 18 Oct 2005(Tue) MEA team meeting @ ISAS/JAXA • 19 Oct 2005(Wed) MSA team meeting @ ISAS/JAXA • 20 Oct 2005(Thu) MSA team meeting @ ISAS/JAXA • Oct 2005 ENA team meeting @ ISAS/JAXA • <MEA> • 1) Revised version of MEA I-ICD was submitted. • 2) MCP life thermal test at 80°C pauses due to a trouble in the source in the vacuum chamber. • 3) Prototype design: fabrication progress smoothly • 4) Electronics prototype boards fabricated. Components will be soldered. • 5) Installation of a new electron source in the other vacuum chamber on going – will be used to test the prototype. • <MIA> • 1) Revised version of MIA I-ICD was submitted. • 2) Development of attenuation grid (1st stage) is finished. • 3) Test-model discrete MCP anode was tested. • 4) Designing of ASIC (optional plan) started.

3. <MSA> • 1) Revised version of MSA I-ICD was submitted. • 2) MSA team meeting was held @ ISAS on Oct. 19, 20. • (CETP) • 1) Optimization of TOF section and connection with "top-hat" output still ongoing • 2) Updated figures provided to ISAS for purge location, interface between optic box and electronics, length of delay line, MSA design and double MCP metallization. • 3) Further modeling of UV rejection is ongoing. • (ISAS) • 1) ISAS tested the TOF FEE and new TDC CHIP: no problem. • 2) Optimization of the optics of Energy Analyzer part is still ongoing. • 3) Test model partial metallization MCP is under fabrication process. • 4) MCP (6 MCPs) for CETP PM sensor is under fabrication. • 5) Detailed delay line anode design is ongoing. • (MPS) • 1) Progress of manufacturing breadboard model of HVPS is still ongoing. • 2) Tests of HV electronic components is ongoing. • (BIRA-IASB) • All activities, except those related to specifications and documentation, are pending due to the postponed ESA decision on Bepi Colombo.

4. <HEP> Revised version of HEP-ele and –ion I-ICD was prepared. SSSD process design was finished by HPK. Prototype of SSSD will be made in next year. MCP assembles design for HEP-ion is in progress by HPK and MHI smoothly. MHI is now designing the acoustic shutter of HEP-ion for realizing the easy contact and closing with the instrument being normally installed on the spacecraft under a launch condition. 5) MHI has started to make an SSD-front-end module and read-out test module for HEP-ion & -ele. <ENA> TM integration is about to be completed. 2) HVPS TM board tests completed. 3) TM FEE+IFE completed and under testing in ISAS (Chandrayaan-1 configuration). MCP holders manufacturing is completed and items delivered to ISAS. 4) FEE analysis of the BC configuration is completed and the possibility to accommodate of the ENA sensor on the lower deck is confirmed. The issue concerning the foot pattern and related blocking of the FoV is under investigation. The simulation model was developed and the preliminary results show that the limitation of FoV are acceptable. 5) Evaluation of the use of JPEG compression for the ENA data continues.

5. (2) Problems / Differences from the nominal plan <MIA> Development of flight-use ASIC chip will be delayed by 6 months. More delay is expected without enough funding in 2006. <MSA> Some questions regarding BepiColombo status at ESA. More information expected at the next SPC meeting in February 2006. All activities of BIRA-IASB, except those related to specifications and documentation, are pending due to the postponed ESA decision on BepiColombo. <HEP> The cost estimate from HPK is delayed for the HEP-ion MCP assembly. The MCP assembly design is also behind the schedule. HV design using a module made by EMCO Co. is delayed. <ENA> HVPS power consumption is increased.

6. (3) Development plan in Mar.-May 2006 • <MPPE> • Revised version of MPPE I-ICD will be submitted.(HEP, ENA) • <MEA> • 1) Mechanical parts will be mounted. We have still to wait for the spheres. • 2) Electronics boards will be populated with the components. • 3) Test of the new electron source will start. • 4) Components selection will continue, • 5) MCP life thermal test will restart after the verification of the source. • <MIA> • 1) Detailed thermal Model of MIA will be made. • 2) Continue designing ASIC. • 3) Test Model Anode will be designed (nominal plan) • <MSA> • (CETP) • 1) TOF modeling to be pursued • 2) Test of compression algorithm with FPGA developed by BIRA-IASB to be performed. • (ISAS) • 1) Test model partial metallization MCP will be fabricated. • 2) ISAS will continue optimizing the optics of Energy Analyzer part. • 3) ISAS will figure out the problems concerning the delay line anode system.

7. (MPS) • 1) First tests with breadboard model of HVPS • 2) Next design of HVPS box, mechanical drawings • 3) Next design of HVPS boards, selection of preliminary electronic parts • <HEP> • Thermal cycle test for SSD front end electric board • ASIC for SSD read-out thermal life test at 80 degree • Test model MCP will be made by HPK • Test model SSSD will be made by HPK • Data read out sequence will be tested using the test module made in 2005 6) The detailed design of the MCP assembly manufactured by Hamamatsu for the HEP-ion sensor should be fixed by considering the sensor structure built by MHI. • <ENA> • Test model: Manufacturing (including electronics, until January) • Test model: Testing the detector unit • Test model: Shipping the detector unit to Sweden • Test model: Assembling the whole unit • Test model: Mechanical testing • Test model: Performance testing

8. (4) Major A/I Status MPPE is investigating the data compression method. There is some possibility that MPPE uses data compression (JPEG) chip inside MDP. This item should be resolved with first priority taking into account the available CPU power. (will be discussed at 5th MPPE meeting on 5 April) EMCO refused to show the inside structure of HVPS module. (We have already confirmed that there will be no problem in purchasing and screening the EMCO HVPS module.) MPPE is now considering to use EMCO HVPS module based on EEE specified screening. MPPE is also considering another possibility to use HVPS module provided by another company. The baseline will be fixed by fall 2006. 3) Thermal shield of HEP partly blocks the field of view of MIA. The distance between HEP-ion and MIA should be as large as possible. Detailed thermal shield design will be made in FY2006. In FY2005 thermal shield was partly designed for MEA.

9. (5) Major request to System / Other subsystems & payloads In addition to the requirements written in MPPE proposal, MPPE has the following additional requirements. 1) survival heaters during transfer orbit (foreign sensors) 2) temperature monitor by HCE (foreign sensors: when sensor power is off) Concerning 1) and 2), agreement inside MPPE and negotiation between MPPE and MMO system are necessary. Current Requirement Status: (will be discussed at 5th MPPE meeting on 5 April) Cruising Phase Temperature Monitor N.A. Survival Heater Request ENA MMO power:ON Sensor Power:OFF HCE temperature monitor request MSA, ENA Sensor temperature is estimated from the HCE monitored temperature around the sensor (on the lower deck) MIA, MEA, HEP MMO power: ON Sensor Power: ON Temperature monitor inside the sensor is powered on and the temperature will be sent from sensor to MDP with telemetry data All Sensors

10. 3) MPPE needs information about the temperature dependent spacecraft panel motion. 4)MPPE strongly hopes that the metal fittings at the corner of the spacecraft should be installed on the opposite side of the upper and lower decks of MMO (outside the spacecraft).Though MPPE will consider using additional pedestal to install some of the sensors that will be installed at the corner of the spacecraft, it requires non-negligible additional weight. MPPE’s current understanding: Though it is not finally confirmed, there is some possibility that the metal fitting will be moved to the outside the spacecraft. According to ISAS mechanical engineer, from the mechanical point of view there was almost no difference between the two locations of these metal fittings. At the same time, NTSpace thermal engineer said that only little thermal effect was foreseen by changing the location of these metal fittings. -> Substrate support fixture will be moved to the exposed side !!

11. (6) Others Concerning the +3.3V power line, the possibility for MPPE to have small +3.3V linear regulator inside each sensor head with +~4V supplied to each sensor head from MDP should be considered. MPPE’s current understanding: Though it is still under consideration, there is some possibility that each MPPE sensor will have its own PSU. If this is realized, there will be no problem with +3.3V.

12. 2) MPPE Mater schedule was revised based on the revised MMO Master schedule.

13. 3) MSA team meeting EGU@Vienna (4 April, 2006) • Meeting time: • From 5:00 pm till 7:00 pm • Meeting place : • Hotel Mercure Wien City • 4) 5th MPPE meeting EGU@Vienna (5 April, 2006) • Meeting time: • From 6:00 pm till 8:00 pm • Meeting place : • Hotel Mercure Wien City • 5) New Co-Is • Dr. Shoichiro Yokota (ISAS/JAXA) has become a Co-I of MSA-MPPE. • Dr. Hiroshi Hasegawa (ISAS/JAXA) has become a Co-I of MIA-MPPE.

14. I. MPPE <A/I> HV EMCO refused to show the inside structure of HVPS module. >> Report from MPPE 2) Thermal shield: HEP partly blocks the field of view of MIA. >> Report from MPPE Detailed thermal shield design will be made in FY2006. In FY2005 thermal shield was partly designed for MEA.

15. <Request> 1) Requirement of “Survival heaters during transfer orbit” (foreign sensors) and “Temperature monitor by HCE” (foreign sensors: when sensor power is off) should be more clarified. >> Report from MPPE. Current Requirement Status: (will be discussed at 5th MPPE meeting on 5 April) Cruising Phase Temperature Monitor N.A. Survival Heater Request ENA MMO power:ON Sensor Power:OFF HCE temperature monitor request MSA, ENA Sensor temperature is estimated from the HCE monitored temperature around the sensor (on the lower deck) MIA, MEA, HEP MMO power: ON Sensor Power: ON Temperature monitor inside the sensor is powered on and the temperature will be sent from sensor to MDP with telemetry data All Sensors 2) Information about the temperature dependent spacecraft panel motion. >> Report from System 3) MPPE strongly hopes that the metal fittings at the corner of the spacecraft should be installed on the opposite side of the upper and lower decks of MMO (outside the spacecraft). >> It is already solved. If it is solved it will be informed to all the MPPE team that they can keep their currentdesign (I/F between SPC panel and each sensor) @ 5th MPPE meeting.