Bridging Theory in Practice

1. Bridging Theory in Practice Transferring Technical Knowledge to Practical Applications

2. Semiconductor Manufacturing

3. Semiconductor Manufacturing

4. Semiconductor Manufacturing Intended Audience: • Electrical engineers with a desire to learn more about how semiconductor components are fabricated, packaged, and tested Topics Covered: • How are semiconductor components fabricated? • How are semiconductor components packaged? • How are semiconductor components tested? Expected Time: • Approximately 30 minutes

5. Semiconductor Manufacturing • How are semiconductor components fabricated? • How are semiconductor components packaged? • How are semiconductor components tested?

6. Semiconductor Manufacturing • How are semiconductor components fabricated? • How are semiconductor components packaged? • How are semiconductor components tested?

7. Semiconductor Fabrication Semiconductor components are fabricated typically from one of several different processes While suppliers might use various names, the processes themselves vary little between companies Power MOSFET processes Bipolar processes Combination processes using two or more of the above

8. Power MOSFET Process Power MOSFET processes are for discrete power transistors and integrated logic/power devices Power MOSFET transistors are intended for high current and/or high voltage operation. They have a unique construction which allows them to operate under “extreme” conditions. Source Gate Source n n p+ n epi n+ substrate Drain

9. Bipolar Process Bipolar processes are for discrete bipolar transistors, high-performance analog functions, and very high speed devices Bipolar processes traditionally allow for more precise analog design and high speed operation (consuming more power)

10. Combination Process Often, different processes are combined to provide a higher level of system integration on a single chip Bipolar + CMOS = BiCMOS Bipolar + CMOS + Power MOS = “Smart Power” or "BCD"

11. Combination Process • Often, different processes are combined to provide a higher level of system integration on a single chip • CMOS + PowerMOS = Vertical MOS

12. Semiconductor Fabrication SiO2 p p n n n p epi

13. Semiconductor Manufacturing • How are semiconductor components fabricated? • How are semiconductor components packaged? • How are semiconductor components tested?

14. Die Attach Basic Semiconductor Package Leadframe

15. Semiconductor Die Bonding Pads Basic Semiconductor Package

16. Semiconductor Die Basic Semiconductor Package Wire Solder Ball

17. Semiconductor Die Basic Semiconductor Package Body Epoxy

18. Semiconductor Packaging Semiconductor packages can be classified into two groups: Industry standard packages Widely used by multiple suppliers Often proven (old) technology “Proprietary” packages Package may be used by one or only a few suppliers Often a new technology which has not yet been embraced by the semiconductor industry

19. Semiconductor Packaging Next, packages can be classified into power and small signal packages Power packages Designed to extract the maximum amount of heat from the die Wide variation in design styles Typically have “low” pin counts Small signal packages Designed for minimum cost and foot-print size Little variation in design styles Typically have “high” pin count options

20. Power Packages Rthjc = 23C/W Rthjc = 1.3C/W Rthjc = 1.8C/W Rthjc = 17C/W Rthjc = 2.0C/W Rthjc = 26C/W

21. Small Signal Packages Grid Array Style Traditional Dual In-Line Quad Style

22. Semiconductor Manufacturing • How are semiconductor components fabricated? • How are semiconductor components packaged? • How are semiconductor components tested?

23. Testing Development As the semiconductor is being designed, a thorough test algorithm is being developed to verify the device meets all functional and parametric requirements When the first components are manufactured, they are submitted for analysis with the new test algorithm to determine if the component needs to be improved before production begins

24. Production Testing • When a component is released to production, the test algorithm is reviewed • Some tests may be eliminated and/or modified for production purposes if the supplier can verify the devices functionality through other tests and guard-banding Prototype Tests for Rdson Maximum () IDS = 1A, Vsupply = 12V, Tj = 25C 0.10 IDS = 1A, Vsupply = 12V, Tj = 125C 0.17 IDS = 4A, Vsupply = 18V, Tj = 25C 0.08 IDS = 4A, Vsupply = 18V, Tj = 125C 0.14 Production Tests for Rdson Maximum () IDS = 4A, Vsupply = 12V, Tj = 25C 0.10

25. Why Are Some Tests Eliminated for Production Devices? The test itself may be destructive The test may be a subset of other tests The test may require manual intervention The test may require additional hardware The test may take too long Production testers cost millions of dollars and require an extremely high level of up-keep Suppliers want to minimize the level of testing required to ensure a customer’s high quality expectation while shipping an affordable component

26. Semiconductor Manufacturing

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