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Simple Layout Class 2. zzz. Today’s Class. Last week Introduction Create schematic library Capture schematic Create PCB library (footprint) Layout. Through-hole Packages. SIP: single in-line packages DIP: dual in-line packages.
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Simple Layout Class 2 zzz Wireless Sensor Network And Labs fall 2011
Today’s Class • Last week • Introduction • Create schematic library • Capture schematic • Create PCB library (footprint) • Layout Wireless Sensor Network And Labs fall 2011
Through-hole Packages • SIP: single in-line packages • DIP: dual in-line packages Through-hole package are old, their number decreased in modern design Wireless Sensor Network And Labs fall 2011
SMD Packages • Chip resistors, capacitors, inductors • 0402, 0603, 0805, … • Represent size of the chip • 0805 means 0.08” x 0.05” rectangle Wireless Sensor Network And Labs fall 2011
SMD Packages • SO: Small outline • Usually refer to IC with two rows of leads • QFP: Quad flat package Wireless Sensor Network And Labs fall 2011
SMD Packages • QFN: Quad flat package, no-leads • The packages we introduced just now are most commonly used • Device datasheet should include the package information • You will need it for PCB layout Wireless Sensor Network And Labs fall 2011
SMD Packages These two are widely used in high end processor. They allow more pin-out from a single package. We seldom use ICs in these package, it is too difficult to solder by hand • BGA: Ball Grid Array • PGA: Pin Grid Array Wireless Sensor Network And Labs fall 2011
Why To Buy • Various sources • Online retailers • www.digikey.com • www.mouser.com • Local distributors These are probably two of the world largest online electronic components retailers. If the component you need cannot buy from these two sources, you might want to consider the other component! Wireless Sensor Network And Labs fall 2011
Block Diagram Connector 3-Pin Infrared 6V Connector 3-Pin Infrared Taroko Location node 3.3V Regulator LM317L Taroko Control node 3.3V Battery 4 AA 6V output 6V Connector 3-Pin Motor Connector 3-Pin Motor Wireless Sensor Network And Labs fall 2011
Components • Battery connector: 2-pin, • Regulator: LM317L, 8-pin SOIC • Resistor, capacitor • Taroko connector • Location node: 2x5 pin, 2x3 pin • Control node: 2x5 pin, 2x3 pin • Infrared connector: 3 pin • Motor connector: 3 pin Wireless Sensor Network And Labs fall 2011
PCB Layout • Software • We are using “Altium Design 6” • There are many other software available • Process • Initial setup • Create schematic library • Capture schematic • Create PCB library • PCB layout • Output Wireless Sensor Network And Labs fall 2011
PCB copper 1-layer board 2-layer board copper Multi-layer board (Taroko is 4-layer board) copper Wireless Sensor Network And Labs fall 2011
Terminologies Top layer: copper on top Top overlay: white marks on top layer Top paste: paste mask on top layer Top solder: solder mask on top layer Keep out layer: defines the shape of the board pads: holds the IC leads vias: holes Bottom layer: copper on bottom Bottom overlay: white marks on Bottom layer Bottom paste: paste mask on Bottom layer Bottom solder: solder mask on Bottom layer Wireless Sensor Network And Labs fall 2011
PCB Library • Once you have every component you need on the schematic library, you can start create PCB library • PCB library defines the footprint of the component LM317L AD7798 Wireless Sensor Network And Labs fall 2011
What Is Footprint AD7798 placed on the board After finish the layout and get the PCB board. This is how it look like. A footprint created in the software Wireless Sensor Network And Labs fall 2011
Dimension The basic idea is the footprint you defined can fits the chip • Must follow the exact dimension • Other wise the component cannot solder on the board • Leave some extra space for soldering 6.4mm extra space for soldering Wireless Sensor Network And Labs fall 2011
Simple Calculation 7.7mm 4mm (0.3* 1.85) mm These are pads, they use to hold the lead of the IC. You can define the length you want. You must leave some space for soldering Wireless Sensor Network And Labs fall 2011
The Footprint You Need • LM317L Regurator • SOIC 8 (Check datasheet) • Power Connector (端子台) • Pitch 5.08mm • Infrared proximity connector • Pitch 2.0 mm • Connector: 2x5 pin, 2x3 pin, 3 pin • Pitch 2.54mm • Chip capacitor, resistor • 0805 Wireless Sensor Network And Labs fall 2011
LM317L Physical Dimension Wireless Sensor Network And Labs fall 2011
Create Footprint – By Wizard • By wizard (old version altium) • Tool -> IPC Footprint Wizard Wireless Sensor Network And Labs fall 2011
Step 1 Wireless Sensor Network And Labs fall 2011
Step 2 Check datasheet for correct number Wireless Sensor Network And Labs fall 2011
Step 3 – No Need Thermal Pad Wireless Sensor Network And Labs fall 2011
Step 4 – Use Default Wireless Sensor Network And Labs fall 2011
Step 5 – Low Density You can use large Toe Fillet, hand soldering will be easier Wireless Sensor Network And Labs fall 2011
Use Default Wireless Sensor Network And Labs fall 2011
Step 7 – Use Default Wireless Sensor Network And Labs fall 2011
Give It A Name Wireless Sensor Network And Labs fall 2011
SOIC-8 Footprint Wireless Sensor Network And Labs fall 2011
X,Y Coordinate (0,5.2) 8 5 4 1 (0,0) (1.27,0) (2.54,0) (3.81,0) Wireless Sensor Network And Labs fall 2011
Create Footprint • Manual edit • Place pads • Place overlay • The white mark Wireless Sensor Network And Labs fall 2011
Power Connector • Create Footprint Wireless Sensor Network And Labs fall 2011
Infrared Connector millimeters Wireless Sensor Network And Labs fall 2011
Copy Footprint • Copy miscellaneous component’s footprints • In you are using Win 7 • Copy “Miscellaneous Connectors.IntLib” and “Miscellaneous Devices.IntLib” to another directory • In C:\Program Files\Altium Designer 6\Library • Open and extract these two library • Copy following footprint • Miscellaneous Devices.PcbLib • 2012[0805] • Miscellaneous Connectors.PcbLib • HDR1x2, HDR1x3, HDR2x3, HDR2x5 Wireless Sensor Network And Labs fall 2011
The Footprint You Need • LM317L Regurator • SOIC 8 (Check datasheet) • Create by wizard • Power Connector (端子台) • Pitch 5.08mm • Manual create • Infrared proximity connector • Pitch 2.0 mm • Manual create • Connector: 2x5 pin, 2x3 pin, 3 pin • Pitch 2.54mm • Copy from miscellaneous component’s footprints • Chip capacitor, resistor • 0805 • Copy from miscellaneous component’s footprints Wireless Sensor Network And Labs fall 2011
Link Schematic Library And PCB Library • After create all the footprint need, linking with the schematic library • link schematic library and PCB library • Update schematic • Notes • Pins on the schematic library must map to the pins on PCB library, which is identical to real chip. Wireless Sensor Network And Labs fall 2011
Pin To Pin Mapping Wireless Sensor Network And Labs fall 2011
Pin To Pin Mapping Wireless Sensor Network And Labs fall 2011
Check Schematic And Choose Footprint • Choose Footprint Wireless Sensor Network And Labs fall 2011
Normal Procedure Is better to follow this one Procedure we took Normal procedure • Create component libraries in the PCB software • Schematic library • PCB library • Link PCB and Schematic library • Capture schematic • Draw the circuit on the PCB software • Choose footprint when you place components • Layout • Decide the shape of the board • Placing components • Make connections • Make the hardware board • Export layout to manufacturer output, send to PCB manufacturer • Home made PCB • Create component libraries in the PCB software • Schematic library • Capture schematic • Draw the circuit on the PCB software • Create PCB library • Link PCB and Schematic library • Update schematic • Choose footprint • Layout • Decide the shape of the board • Placing components • Make connections • Make the hardware board • Export layout to manufacturer output, send to PCB manufacturer • Home made PCB Wireless Sensor Network And Labs fall 2011
Now • Create your footprint • Choose correct footprint • Check schematic Wireless Sensor Network And Labs fall 2011
Export to PCB • Compile the schematic and export the components to PCB design document • Compile • Project -> Compile Document xxxxx.SchDoc • Export the footprints to PCB • Design -> Update PCB Document xxxxx.PcbDoc Wireless Sensor Network And Labs fall 2011
Environment And Keep-Out • Setup the layout environment and defines the keep out layer • Environment (optional) • (Right click) Option -> Board Options • Metric or Imperial • Snap grid • Define Keep-out • Define the shape of your PCB board Wireless Sensor Network And Labs fall 2011
Component Placing • Place the component 0102 • Component placing is important • Carefully place the component according to the signal path • Frequency used quick key • Dragging the component, press “space” to rotate • Dragging the component, press “l” to place at the other size • Place the bypass capacitor as close to the power pin as possible Wireless Sensor Network And Labs fall 2011
Design Rules • Editing design rules • It defines the rules that your PCB board must follow • Frequently used rules • Clearance – minimum distance between traces • Routing Width – minimum and maximum allowable trace width • Routing Vias – minimum and maximum via size (diameter and hold size) • At least you need to change “routing width” Wireless Sensor Network And Labs fall 2011
PCB Layout • Routing 01020304 • My way • Route the power line first, route them at the edge • Make the track width wider for power line • Route the signal line on the top layer as much as you can • Make the bottom layer as a continuous ground plane Wireless Sensor Network And Labs fall 2011
Place Some Signature • Just for fun • You can put some text on the “Overlay layer” • Either “Top Overlay” or “Bottom Overlay” • Text can be • Team name • Members name • Date • Whatever you want Wireless Sensor Network And Labs fall 2011
Design Rules Check (DRC) • This function check everything • According to the rules you setup • Run Design Rules Check (DRC) • If errors found, must fix it • Clearance Constraint • Broken-Net Constraint • Fix errors and run DRC again Wireless Sensor Network And Labs fall 2011
Ground (GND) Polygon Pour • Polygon Pour is a large area of copper • Usually use for GND • Route signal on one side, place GND polygon pour on the other side • Connect every GND through a via to another side • Place GND polygon pour • And run DRC again Wireless Sensor Network And Labs fall 2011
Fabrication Outputs • Export the layout to fabrication outputs • Export Gerber files • Export NCdrill file • Pack all files in project output directory • Send these files to PCB manufacturer • wait for about 1.5 weeks • cost about NT4000 ~ NT6000 • you will get a professional PCB board Wireless Sensor Network And Labs fall 2011