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TDM Photonic Network using Deposited Materials

TDM Photonic Network using Deposited Materials. Robert Hendry, Gilbert Hendry, Keren Bergman Lightwave Research Lab Columbia University HPEC 2011. Motivation for Silicon Photonics. Performance scaling becoming extremely difficult Data movement cost increasingly expensive

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TDM Photonic Network using Deposited Materials

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  1. TDM Photonic Network using Deposited Materials Robert Hendry, Gilbert Hendry, Keren Bergman Lightwave Research Lab Columbia University HPEC 2011

  2. Motivation for Silicon Photonics • Performance scaling becoming extremely difficult • Data movement cost increasingly expensive • On/off-chip communication bandwidth limited • Photonics offers: • Higher bandwidth density • High datarate and parallel wavelengths • Low operating power • Low latency HPEC 2011 2

  3. Target Architectures Optical link to memory Optical interconnection network on stacked memory HPEC 2011 3

  4. Ring Resonators electric control Off resonance switch modulator waveguide waveguide optical message light source signal On resonance electric control switch signal waveguide waveguide signal filter HPEC 2011 4

  5. Photonic Communication Electrical control Photonic Network Light source Optical signal ring-resonator modulators filters Optical signal detectors HPEC 2011 4

  6. Photonic Communication Electrical control Photonic Network Light source Optical signal 10 Gb/s x 3 = 30 Gb/s aggregate bandwidth filters Optical signal detectors HPEC 2011 5

  7. Optical Power Budget Nonlinear Effects The total injectable power Ptotalmust remain below a threshold to avoid non-linear effects. Ptotalis then divided among the N wavelengths of a WDM packet, where each channels injects at Pchannel. Total Injected Power Ptotal = Pchannel × N Optical Power Injected Power Per Wavelength Maximum Network-Level Insertion Loss Received Power Detector Sensitivity HPEC 2011 6

  8. Silicon Photonics Technologies • Crystalline Silicon • Best electrical and optical properties • Unable to deposit HPEC 2011 9

  9. Silicon Photonics Technologies • Crystalline Silicon • Best electrical and optical properties • Unable to deposit • Polycrystalline Silicon • Can deposit • Very lossy HPEC 2011 9

  10. Silicon Photonics Technologies • Crystalline Silicon • Best electrical and optical properties • Unable to deposit • Polycrystalline Silicon • Can deposit • Very lossy • Silicon Nitride • Very low loss • Can deposit • Not useful active devices HPEC 2011 9

  11. Poly-Si / SiN Combination approach • We can use silicon nitride and polycrystalline silicon in combination • SiN for non-active wave guides • Poly-Si for active devices (e.g. ring-resonator based switch) Designs for a layered modulator and switch HPEC 2011 10

  12. Poly-Si / SiN Combination approach • Waveguide crossings eliminated • Insertion loss, crosstalk both incurred heavily in waveguide crossings • However, .1 dB insertion loss per vertical coupling [Sun et al. 2008] HPEC 2011 11

  13. Insertion Loss Analysis • Worst-case insertion loss for a photonic mesh [Biberman et al. 2011] HPEC 2011 12

  14. Insertion Loss Analysis • Worst-case insertion loss for a photonic mesh [Biberman et al. 2011] HPEC 2011 13

  15. Photonic TDM NoC Architecture • Mesh topology • No electronic links, other than TDM clock distribution Time slot 1 Time slot 2 TIME Time slot 3 Time slot 4 Time slot 5 HPEC 2011 15

  16. Photonic TDM NoC Architecture • Mesh topology • No electronic links, other than TDM clock distribution Time slot 1 Time slot 2 TIME Time slot 3 Time slot 4 Time slot 5 HPEC 2011 16

  17. Photonic TDM NoC Architecture • Mesh topology • No electronic links, other than TDM clock distribution Time slot 1 Time slot 2 TIME Time slot 3 Time slot 4 Time slot 5 HPEC 2011 17

  18. Photonic TDM NoC Architecture • Mesh topology • No electronic links, other than TDM clock distribution Time slot 1 Time slot 2 TIME Time slot 3 Time slot 4 Time slot 5 HPEC 2011 18

  19. Photonic TDM NoC Architecture • Mesh topology • No electronic links, other than TDM clock distribution Time slot 1 Time slot 2 TIME Time slot 3 Time slot 4 Time slot 5 HPEC 2011 19

  20. Photonic TDM NoC Architecture • Mesh topology • No electronic links, other than TDM clock distribution Time slot 1 Time slot 2 TIME Time slot 3 Time slot 4 Time slot 5 HPEC 2011 20

  21. X-Y Buffering • Mesh topology • No electronic links, other than TDM clock distribution Nonlinear Effects Ptotal = Pchannel × N Optical Power Maximum Network-Level Insertion Loss Detector Sensitivity HPEC 2011 21

  22. Photonic TDM vs. Photonic Circuit-Switched Insertion Loss HPEC 2011 22

  23. Single-Layer Switch vs. Multi-layer Switch Single-layer TDM Switch Multi-layer TDM Switch North 1 Gateway 5 8 2 East 4 6 West Control 7 3 South HPEC 2011 23

  24. Single-Layer Switch vs. Multi-layer Switch Single-layer TDM Switch Multi-layer TDM Switch North 1 Gateway 5 8 2 East 4 6 West Control 7 3 South 18 crossings 4 crossings HPEC 2011 23

  25. TDM Network Insertion Loss Analysis 8x8 Network 4x4 Network 64x64 Network 16x16 Network HPEC 2011 25

  26. Maximum Bandwidth (# of Wavelengths) 8x8 Network 4x4 Network 16x16 Network 64x64 Network HPEC 2011 26

  27. Summary of Results HPEC 2011 27

  28. Conclusions • Poly-Silicon and Silicon Nitride in conjunction are a good choice of materials for photonic interconnection networks • Low-loss • = more wavelengths = higher bandwidth • We’ve shown that our best network, when at large scale, can be improved with a multi-layer implementation • Future work: We expect the elimination of waveguide crossings to significantly reduce crosstalk across a wide variety of network architectures HPEC 2011 28

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