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Advanced Semiconductor Manufacturing Techniques: A Peek Inside the Invensense ITG-3200 Three-Axis Gyroscope

Explore advanced semiconductor manufacturing techniques like standoff structure, CMOS cavity mask alignment, and eutectic bonding in the ITG-3200 gyroscope.

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Advanced Semiconductor Manufacturing Techniques: A Peek Inside the Invensense ITG-3200 Three-Axis Gyroscope

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  1. STANDOFF mask STRUCTURE mask GERMANIUM mask Wafer 3 - CMOS CMOS-CAVITY mask (optional) Dicing street Aluminum/germanium eutectic ~vacuum ALIGNMENT mask Wafer 1 CAVITY mask SiO2 Wafer 2

  2. MPU-3000, 3-Axis gyroscope in 2.8mm x 2.4mm

  3. A Peek Inside the Invensense ITG-3200 Three-Axis Gyroscope http://memsblog.wordpress.com/2010/08/11/a-peak-inside-the-invensense-itg-3200-three-axis-gyroscope/

  4. http://memsblog.wordpress.com/2010/08/11/a-peak-inside-the-invensense-itg-3200-three-axis-gyroscope/http://memsblog.wordpress.com/2010/08/11/a-peak-inside-the-invensense-itg-3200-three-axis-gyroscope/

  5. http://memsblog.wordpress.com/2010/08/11/a-peak-inside-the-invensense-itg-3200-three-axis-gyroscope/http://memsblog.wordpress.com/2010/08/11/a-peak-inside-the-invensense-itg-3200-three-axis-gyroscope/

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