1. Introduction of Photonics 21 2. IMEC: Electronics

1. 1. Introduction of Photonics212. IMEC: Electronics ICT report Chee Wee Liu, Department of EE, NTU

2. Photonics21 Work Groups • Photoncis21 is a European Technology Platform found in2005. • The members of Photonics21 are representative of European photonics industry, research institutions and colleges. • With 1400 members in 49 countries. • 7 Work Groups (WGs): 4WGs are application-oriented, 3WGs focus on cross-disciplinary issues. WG5 Security, Metrology &Sensors WG1 Information & Communication WG2 Industrial Manufacturing and Quality WG6 Novel Optical Components & Systems Cross Section Issue Application WG3 Life Science & Health WG7 Research, Education & Training WG4 Lighting & Display

3. Energy-Efficient Lighting • Toward Low-Carbon Economy-High efficient White LED (>180lm/W).-Low cost LED manufacturing.-Standardised LED light engines. • Main application-Illumination and Displays. Sodium lamps LED lighting

4. Renewable Energy Generation • Demand- 12% market share of EU electricity demand for photovoltaics in 2020. (EPIA)- 20% reduction in carbon dioxide emissions by 2020. • Expected Efficiency in 2020- Improve solar cell efficiency by 30%.- Achieve costs < €0.1per kWh for electricity. • Using Laser systems to improve the solar cell’s quality and performance. EPIA: EUROPEAN PHOTOVOLTAIC INDUSTRY ASSOCIATION

5. Information & Communication • Demand- Network bit rates will be as high as 40Gbps andtotal transmission capacity per carrier will be in the 100 Tbps range by 2015.(from OIDA’s report) • Large optical network system- Faster data communication (broad bandwidth access). • On-chip optical interconnect- Si-based optical interconnect is a promising solution for a faster on-chip interconnect.- A novel technology used to replace old Cu metal contact.- Short-term application: inter-chip communication.- Long-term application: large optical integrated circuits (including optical logic devices). Intel‘s optical interconnect OIDA: Optoelectronics Industry Development Association

6. CARS: Coherent anti-Stokes Raman Scattering microscopy SRS: Stimulated Raman Scattering OCT: optical coherence tomography Life Science & Health • Cancer-Laser surgery (Less invasive). -A faster and reliable cancer detection method (CARS, SRS). • Eye cure-Cellular resolution image from within the retina (OCT). • Preclinical research-High speed detection (real time 3D image).-High resolution image (angstrom-scale).-High precision. Optical tomography Under White light Under Fluorescent light

7. IMEC Research Programs • CMOS Scaling ─focus on (sub-)22nm technology nodes • Lithography, 3D integration, Emerging devices, Logic DRAM devices, Flash memories, Interconnects • CMOS-based heterogeneous integration (CMORE) • SiGe MEMS, GaN power electronics and LEDs, Silicon photonics, Power devices, and mixed-signal technologies • Human++ ─healthcare domain • Wearable and implantable body area networks, with low-power components, radios and sensors, life sciences • Energy • Photovoltaics and GaN power electronics • Smart Systems • Power-efficient green radios, large-area electronics, wireless autonomous transducer systems, innovative visualization systems

8. IMEC COMS Scaling • Lithography • Water based ArF immersion lithography with double patterning • Extreme ultra-violet (EUV) lithography (13.5nm wavelength). • Logic/DRAM Devices • High-mobility channel devices (Ge & III/V) • Logic and dynamic RAM • Scaling to 22 and 15nm nodes for bulk planar and MuG FETs • Gate-first/gate-last HKMG (EOT scaling, single or dual dielectric) • 22nm Interconnect technology (Cu/low-K) • Scaling of the dielectric constant & Pitch • Advanced barrier, seed, copper resistivity and copper contacts • Barrier and dielectric reliability • 3D integration ― through-silicon vias (TSV) • Flesh ― floating-gate and nitride-based technology • Emerging devices ― Resistive RAM (RRAM), Floating-body RAM (FBRAM) TSV

9. CMOS-based heterogeneous integration (CMORE) More-than-Moore R&DA platform to turn novel concepts into products • Power devices and mixed-signal technologies • High voltage Si-based power devices • High-speed SiGe:C BiCMOS • SiGe MEMS technology platform and design platform • MEMS packaging • Testing and Reliability of MEMS • Silicon photonics • GaN • GaN epitaxial layer growth • GaN for RF power amplification and high power conversion • GaN light-emitting diodes • Vision systems • Hybrid backside illuminated imagers • Hyperspectral imaging SOI waveguide

10. Human++ • Wearable and implantable body area networks • Wireless Sensors and actuators • Ultralow-power analog interfaces • Ultralow-power radio • Micropower generation and storage • Integration technology for wearable and implantable applications • Integrated wearable systems • Life sciences • Functional nanosystems • In-vitro bioelectronic systems • In-vivo bioelectronic systems • Biosensors • Micro total analysis systems wireless autonomous sensor system

11. Energy • Photovoltaics (Solar+) • Crystalline Si solar cells • High-efficiency PV stacks for terrestrial concentrators (III-V cells) • Thermovoltaic (TPV) systems for electricity co-generation (Low-bandgap cells) • Organic photovoltaics • GaN • GaN epitaxial layer growth • GaN for RF power amplification and high power conversion • GaN light-emitting diodes high-efficiency photovoltaic stack

12. Smart Systems • Power efficient green radio • Cognitive radio: opening new horizons in wireless communication • 60GHz wireless communication: boosting high-data-rate short-range connectivity • Ultralow power wireless: getting mega-performance from micro-Watts • Vision systems • Hyperspectral imaging • Adaptive resilient embedded systems (ARES) • MultiView • Large-area electronics and systems-in-foil • Organic light-emitting devices • Organic photovoltaics • Organic and oxide electronics Wafer with organic RFID