1 / 25

Bruce Mayer, PE Dir. System Engineering 17Oct02

Engr/Math/Phys 25. 3x00 XY-Stage Transit/Settling Time. Bruce Mayer, PE Dir. System Engineering 17Oct02. Effecting Planer Motion. An XY Stage. Executive Summary. Test Procedure Attach Accelerometer to 3xxx Stage Move Stage in Short, Medium, Long Runs

Download Presentation

Bruce Mayer, PE Dir. System Engineering 17Oct02

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. Engr/Math/Phys 25 3x00 XY-StageTransit/Settling Time Bruce Mayer, PEDir. System Engineering17Oct02

  2. Effecting Planer Motion An XYStage

  3. Executive Summary • Test Procedure • Attach Accelerometer to 3xxx Stage • Move Stage in Short, Medium, Long Runs • Record Accelerometer OutPut With Oscope • Estimated SETTLING TIME: <15ms • Olympus Stage Transit-Time Model • d Travel Distance in mm • Tt Transit Time in mS

  4. Goals & Logistics • Goals → For 3xxx XY-Stage Determine • Typical AntiVibration-Table Settling Time • Model: Transit-Time vs. Transit-Distance • Logistics • Test Date = 15-Oct-2002 • Experimenters = B. Mayer, CEE • Test System = YYY-3xxx • Hi-Accuracy XY-Stage • Mechanical (i.e., spring-based) AntiVibration Table

  5. Test Design • Attach Accelerometer to XY-Stage • Measure Accelerometer Output w/ Oscope • Program System for Die Jumps on 200mm wafer with KLARRF Map Die Patterns • X-Pitch = 7.8408280000e+03 µm (7.8408 mm) • Y-Pitch = 1.4138693000e+04 µm (14.1387 mm) • Die Jumps: L↔R, T↔B, UL↔LR, UR↔LL • Full Cross-Wafer (long) Moves • 4-Die Moves • Single-Die Moves

  6. Omega ACC-102 Accelerometer(100 mV/g) AcceleroMeter Mounting Wafer & Chuck Major Axis = Z OTA-3xxxStage

  7. Instrumentation Cables To/FromAcceleroMeter Omega ACC-PS1AcceleroMeterPower Supply Fluke-199 200 MHz ScopeMeter

  8. Stage-Move Profiles – 200mm Wafer

  9. Results & Analysis - Plots on Next Slides • AntiVibe Table Settling Time  15ms • Time Beyond Motor-Stop • S-Curve Accel & Decel Improves Settling Time • Transit-Time Model Determined by Linear-Regression: • d Travel Distance in mm • Tt Transit Time in mS • Full Speed = 1/[4.37 mS/mm] = 229 mm/S • Very-Short Move Time  Const  47 mS

  10. Results & Analysiscont.1 • Max Z-Acceleration = 5.92g • Y-Axis “Rattles” about 4-TIMES More than the X-Axis • Suggests inquiry into the source of the added Settling Time

  11. ~ConstantVelocity Ramp Up/Down

  12. Ramps Only

  13. All Done for the COURSE See You in Fall 13

  14. All Done for Today An XYStage

  15. Engr/Math/Physics 25 Appendix Time For WhtBd Demo Time For Live Demo Bruce Mayer, PE Licensed Electrical & Mechanical EngineerBMayer@ChabotCollege.edu

  16. Engr/Math/Physics 25 Settling TimeAPPENDIX Bruce Mayer, PEDir. System Engineering17Oct02

  17. AcceleroMeter Instrumentation

  18. AcceleroMeter Specifications

  19. KLARFF Map Details FileVersion 1 1; FileTimestamp 08-22-02 13:33:54; InspectionStationID "NONE" "BITMAP" "ORB102"; SampleType WAFER; ResultTimestamp 08-22-02 10:14:55; LotID "QT96B2815340_3"; SampleSize 1 200; SetupID "T96B_UP" 05-08-02 07:02:28; StepID "RTP_ANNEAL_2"; SampleOrientationMarkType NOTCH; OrientationMarkLocation UP; DiePitch 7.8408280000e+03 1.4138693000e+04; DieOrigin 0.0000000000e+00 0.0000000000e+00; WaferID "01"; Slot 1; SampleCenterLocation 4.3974690000e+03 7.8404710000e+03;

More Related