1 / 7

Thin and high-pitch laser- etched mesh manufacturing and bulking "

RD51 Common Projects. Thin and high-pitch laser- etched mesh manufacturing and bulking " . (INFN Bari, CEA Saclay, CERN). V. Berardi, P. Colas, Rui de Oliveira. Motivation. Thin foil (5 micron Cu for instance) to maximize the gain

chipo
Download Presentation

Thin and high-pitch laser- etched mesh manufacturing and bulking "

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. RD51 Common Projects Thin and high-pitch laser-etchedmeshmanufacturing and bulking" (INFN Bari, CEA Saclay, CERN) V. Berardi, P. Colas, Rui de Oliveira

  2. Motivation • Thin foil (5 micron Cu for instance) to maximize the gain • High pitch (>1000 lpi) to reduce ion backflow (see NIM A 535 (2004) 226) As a conclusion it is expected that the optimalion backflow conditions will be fulfilled with a1000 lpi mesh for 100 micron gap, and with a 1500 lpimesh for 50 micron:

  3. Bulking of thinmeshes Presently ‘bulk’ Micromegas are made withwovenmeshes, 380-450 lpi. Let us tryelectroformedthinmeshes

  4. Ultrafast laser drilling • New high-rate ‘fs’ lasers make it possible to drill more perfect holes (no melting) in quantities. • Might replace wet etching for some materials (ceramics) or down to 10 µ diameter Various processes at various time scales fs ps ns µs Laser trepanned hole RD51 Bari WG1

  5. Fori Cu 20x20_50ms_500mW_50x Fori Cu 20x20_50ms_500mW_inf_50x Fori 50ms_700mW_50x

  6. Duration, Milestones and Funding • The projectis for an initial duration of 1 year, startingFeb. 15, 2012 • There willbepresentations in every collaboration meeting (mid-June and earlyOctober) • The taskswillbeshared as follows: • Bari : improve laser punching technique • CEA Saclay : test of meshes, gain ion back-flow • CERN: bulkingwithvariousmeshes • Funding: 19 000 CHF (8 000 Bari, 5000 Saclay, 6000 CERN)

More Related