Idea-to-Silicon-2.5D Packaging Technology-SoCs for High Performance Computing-SoC designs to 7nm process technology

1. Idea-to-Silicon • OpenFive’s Idea-to-Silicon capabilities combined with our advanced design methodologies on leading-edge 5nm, 7nm and 12nm foundry processes. • Your fastest path to custom silicon is here When standard products don’t meet your business or technical requirements, it’s time to go custom. • Specialized custom SoC solutions can be optimized for power, performance, and area, giving you greater design flexibility and a competitive edge. • OpenFive’s Idea-to-Silicon capabilities combined with our advanced design methodologies on leading-edge 5nm, 7nm and 12nm foundry processes, and 2.5D packaging technology enable exciting new designs applications such as Artificial Intelligence (AI), Edge computing, Networking, and High-Performance Computing (HPC). https://openfive.com/custom-silicon/

2. Front-end Design,Integration, and Verification • Design expertise for building scalable, customized SoCs with in-house design, integration, and advanced verification using automated tools and methodology. • Our Capabilities: SOC Micro-architecture,RTLDesign and Synthesis, SOC IP Integration,Design Verification,FPGA Prototyping https://openfive.com/custom-silicon/

3. 2.5D Technology • 2.5D IC is a packaging technology where multiple die are placed face down and side by side on a silicon or organic interposer.  • The active surface of the die has micro-bumps that connect to pads on the surface of the silicon interposer. • Connections from these pads directly connect to TSVs (Through Silicon Vias), which pass through the interposer substrate and connect to the package substrate.  https://openfive.com/custom-silicon/

4. Benefits of using anIdea-to-Silicon Methodology • Cost Savings: Ongoing product development costs on derivatives of existing chip designs are high and make it hard to integrate new IP. The OpenFive Idea-to-Silicon methodology reduces cost and time to market to enable your silicon with your preferred software stack. • Design Flexibility: OpenFive’sIdea-to-Silicon methodology provides an ideal starting point to explore and enter into key markets with the advantage of a faster design cycle by integrating required IPs from our wide IP portfolio, thereby providing a competitive advantage. • Rapid Time-to-Market: The OpenFive Idea-to-Silicon methodology enables optimized layout for power, performance, and size requirements, and reduces time to market for ongoing product roadmap development. • More Choice: Combine RISC-V and Arm® standard cores with OpenFiveSoC IP, IP from OpenFive partners and your own IP to get your ideal custom silicon. https://openfive.com/custom-silicon/

5. Please do visit my website for in-depth information. Website: https://openfive.com/custom-silicon/