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Advanced Integrated Control and Data Systems for Constellation Satellites. Dr. Michael Hahn, Günther Elsner Astrium GmbH; 81663 München, Germany Phone:+49 89 607 24280 Fax:+49 89 607 28964 Email:michael.hahn@astrium-space.com. Content. Introduction
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Advanced Integrated Control and Data Systems for Constellation Satellites Dr. Michael Hahn, Günther Elsner Astrium GmbH; 81663 München, Germany Phone:+49 89 607 24280 Fax:+49 89 607 28964 Email:michael.hahn@astrium-space.com
Content • Introduction • Market Needs and Supplier Capabilities - a never ending conflict..... • Existing solutions • Gammabus Avionics Improvement
Introduction • Avionics Division Heritage and Mission • experience in avionics since 1970's (as MBB) • used to work in close interaction with S/C system engineering • capabilities for avionics applications • AOCS and data handling for • commercial telecommunication (Spacebus-Platform) • constellation (Globalstar) • science missions (SPAS/Artemis/CHAMP/GRACE) • specialization on commercial telecommunication satellites • optimized for low recurring production cost at high flexibility and reliability • design to cost • design for production • spin off to one-off type of equipment
Market Needs and Supplier Capabilities..... • Market demands on Spacecraft computers: • Long heritage • high reliability • low price • fast, long term availablity • high flexibility • high mainainability • robustness • high performance • low budgets • lead to a......
Market Needs and Supplier Capabilities..... ...... lead to a „C4“ architecture: But there a some realistic measures to merge those contradictorily demands!
Market Needs and Supplier Capabilities..... • Improvement capabilities: • Standardization of building blocks (heritage, maintainability, robustness) • internal and external interfaces • modular design • Reduction of components (reliability, cost, lead time, budget, availability) • higher integration • restrictive selection • Implementation of redundancy (reliability, robustness, maintainability) • increased cross coupling • cascaded levels of redundancy • Design to manufacture and test
Existing solutions Spacebus/Flexbus 16bit Onboard Computers
Processor & Plug-In PROM Safeguard Memory Reconfiguration Equipment I/F Standard On-Board Computers • Architecture: • Internal cross-strapping for high reliability for >15 years in GEO • AOCS, Data Handling and Payload Control: • 1750 A Microprocessor • Reconfiguration Module • Packet TM/TC • Mass Memory • Sensor and Actuator Interfaces • Unit Parameters: • Mass: 16 kg • Volume: 415 x 280 x 215 • Power: 25 W Spacebus 3000B 18 Flight Units Globalstar 72 Flight Units
Reconfi. Reconfi. Telecmd Processor Telemty Interface Telecmd Telemty Interface Processor Converter Converter Mass Mass CIA CIA CIA CIA Module Module Module Module Module Module Module Module Module Module Memory Memory Module Module Module Module MAIN MAIN MAIN MAIN MAIN RED. RED. RED. RED. RED. CIA CIA CIA CIA RED. MAIN MAIN RED. LB-I/F LB-I/F LB-I/F LB-I/F LB-I/F LB-I/F LB-I/F LB-I/F LB-I/F LB-I/F Typical OBC Architecture unreg. Power Sensors Actuators Test I/F MIL1553Bus HPC1 out TC in TM out Local Bus unreg. Power Sensors Actuators Test I/F MIL1553Bus HPC1 out TC in TM out
Architectural Key Features • Single point failure free architecture • Fully redundant design • Internal cross coupling by redundant backplane bus • Free combination of all modules • Independent power supplies • Direct cross coupling of most external interfaces possible • Fault Detection, Isolation and Recovery Mechanisms (FDIR) • Failure History and Safeguard Storage for fast system restart
Reconfiguration Capabilities • Surveillance of system parameters (e.g. filtering, masking) • Undervoltages • Sun Presence/Earth Presence alarms • Thruster-On-Time surveillance • Battery Charge • Processor health (Watchdog) • Ground configurable, autonomous processing of alarms • Execution and control of reconfiguration sequences • Additional High Priority Command Interface • Build In Test supporting RM tests through PM
Operability • Ground controlled or autonomous redundancy switching • Reprogramming during flight • RAM/EEPROM contents • Reconfiguration parameter (masks and filter constants, redundancy switching) • External Terminal Interface for HW/SW Test and Debugging • Build In Test of kernel modules • Parallel PM operations (Master/Slave) • Testmode for selftest of inactive RM • Autonomous failure detection and recovery mechanisms • continous Normal Mode operation in case of failures • no Safe Mode required during redundancy switching
Gammabus Avionics Improvement Gammabus 32bit Onboard Computer
Gammabus OBC Improvements • Standardization of building blocks (heritage, maintainability, robustness) • Frequent use of international standards (UART/HDLC/1355/1553) or • simple analog/digital Inputs/outputs • reduction of customized, failure-sensitive designs • modular design with internal standard interfaces (mechanical/electrical/architectural)
Gammabus OBC Improvements • Reduction of components (reliability, cost, lead time, budget, availability) • higher integration by increased usage of ASICs and FPGA • selection of designs wrt. Component reduction (type and amount), long-term availability • Multiple-usage of Multi-purpose ASIC (ParallelSerialInterfaceEngine) • strategic mixture between new and „traditional“ technologies
Gammabus OBC Improvements • Implementation of redundancy (reliability, robustness, maintainability) • increased cross coupling by higher modularity, separated building blocks, cold or hot partial redundancy • Implentation of „hidden“ redundancy resources, e.g. second data path, internal spare functions (e.g. RAM sections, redundant modes) • cascaded levels of redundancy under software control for partial failure isolation and recovery
Gammabus OBC Improvements • Design to manufacture and test • Standard designs for standard manufacturing processes • common test approach (e.g. JTAG, standard blocks), reduced coupling of functions
FACE/Onboard FACE/ERC32 FACE/Ground RTEMS/ERC32 Development Environment (F.A.C.E.)
Conclusion Goals (to be) achieved: • Increased Processing Perfomance:>1000% • Increased Interfaces/functions:>100% • Increased Performance/Power ratio: 500% • Increased Flexibility • Increased Operability (tbc by our customers) • Decreased size/mass: 20% • Decreased cost: 10% • Decreased Production time: 30% • Stable, high Reliability