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Semiconductor Cooling Techniques. -Sohan Purohit Department of Electrical and Computer Engineering, University of Rochester. Introduction. High Performance-High Power go hand in hand. Cooling and Power Delivery become important issues. In the near future Total Chip power rises by ~ 60 %
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Semiconductor Cooling Techniques -Sohan Purohit Department of Electrical and Computer Engineering, University of Rochester Sohan Purohit, University of Rochester
Introduction • High Performance-High Power go hand in hand. • Cooling and Power Delivery become important issues. • In the near future • Total Chip power rises by ~ 60 % • Heat Flux-Expected to double Sohan Purohit, University of Rochester
Projection of Processor Power Sohan Purohit, University of Rochester
Nottingham Inversion Cooling • Based on Internal Field Emission • Uses Composite-Thin-Film Device + Heat Sink • Uses Wide Band Gap materials-prevents tunneling of electrons Sohan Purohit, University of Rochester
How it Works • Injected Electrons are transported Quasi Ballistically. • Heat carried by electrons is decoupled from the lattice. • Cooling due to removal of hot electrons by tunneling-Also called NOTTINGHAM INVERSION COOLING Sohan Purohit, University of Rochester
Cooling by Luminescence up-conversion • Interaction of a system with radiation can lead to cooling. • Physicists report observation of phonon-mediated up-conversion of luminescence in GaAs. • Sample is resonantly pumped with light energy. • Temperature drops as much as 10% of initial temperature are reported. • Localised lattice cooling takes place-Important for the semiconductor industry. Sohan Purohit, University of Rochester
Cooling is due to a strong electron phonon coupling at the localised spot-somehow disconnected from the rest of the lattice sub system. • This coupling still remains somewhat a mystery. • Results –Qualitative. • Possibility of Localized cooling however has been demonstrated. Sohan Purohit, University of Rochester
Electronic Cooling by Quasiparticle Tunneling • A very much unexplored approach. • Replace metal by a heavily doped semiconductor, in the cooling device. • From the Practical and Technological side-Best choice. • Efficient Integration in today’s Semiconductor industry. Sohan Purohit, University of Rochester
How it Works • Weak Electron Phonon coupling at low temperatures. • Weak EP coupling-Key Issue in the Cooling Process. • Silicon films-Strong candidates for low-temperature on-chip cooling applications. Sohan Purohit, University of Rochester
Recent Developments • Semiconductor Cooling has received much attention in the past few years. • Novel Cooling techniques coming up. • Promising new Techniques • Micro-pump Cooling • Ion Pump Cooling. Sohan Purohit, University of Rochester
Conclusions • As on-chip power increases-Cooling issues become important problems to deal with. • Novel cooling techniques discussed here are a direct off shoot of this. • “Either we let our fate determine its own course or we proactively attack the power issues”-Christian Belady, Hewlett Packard Company Sohan Purohit, University of Rochester