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HO SIPM

HO SIPM. Jim Freeman Fermilab. HO HPD Status. Late in the game HPDs discovered to be very sensitive to intermediate magnetic fields, especially if E is not parallel to B. (HB and HE are at high B and things are OK.)

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HO SIPM

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  1. HO SIPM • Jim Freeman • Fermilab

  2. HO HPD Status Late in the game HPDs discovered to be very sensitive to intermediate magnetic fields, especially if E is not parallel to B. (HB and HE are at high B and things are OK.) This has resulted in many HO HPDs dying, and all of R1 and R2 HO have been turned down to 6.5KV (from 8 KV initially). (During the HPD development phase we had hoped to run HO at 10 KV.) Result is that HO is not operating as specified in the TDR. (Cannot see muons for calibration or other uses, poor signal to noise reduces utility of leakage correction for jets.)

  3. HO http://www.springerlink.com/content/wlp5505n47371239/fulltext.pdf

  4. HO Tower Segmentation

  5. HO Tiles

  6. HO R0 Dimensions HO has 4 fibers/tile so rough dimensions of R0 max segmentation are ~ 15X15 cm.

  7. HPD CRAFT muons in R1/R2 R1/R2 S/N ~ 2 R0 S/N ~ 5

  8. Plan • Replace HPDs with “drop in” SIPM cards. • Remove working HPDs, retest them in magnetic field test stand, and store them for possible use as spares in HO R0, HB, and HE.

  9. Plan II • We have tested SIPMs in test beams, test stands, radiation exposures • Have had 2 RBXs of SIPMs operating in P5 since April 2009. • (24 RBXs total so current installation is about 10% of total for R1/R2) • Plan to prepare and burn-in all electronics cards in advance. • Open RBX, exchange RM with HPD with pretested RM with SIPMs. • Take HPD RM upstairs to surface factory, replace HPD with SIPMs and prepare for installation.

  10. Assumptions about Plan • Use existing infrastructure without changes • Radiation Level is 10X LHC (with 3X safety factor) • = 10*3* 500 fb-1 = 15000 fb-1 = 2E11 neutrons, E>100 keV. Tests were done to (at least) this level • HCAL Phase I upgrade back end electronics requirement is backward compatibility with existing electronics • Replacement will be ready for Nov 2010 shutdown. Phased installation is possible but undesirable.

  11. SIPM and Control Card Control Card SIPM array Peltier SIPM card is same spacing as HPD pixels. Control card generates (70V) bias, reads leakage current, controls Peltiers, reads temperatures. QIE connection

  12. SIPM CRAFT Muons in R1/R2 S:N HPD ~ 2:1 S:N SIPM ~ 40:1 http://indico.cern.ch/contributionDisplay.py?contribId=19&confId=64764 The conclusions of the analysis of CRAFT data are:

  13. Example of improvement:HO R2 mEffvsp rejection 7-8 GeV E Calorimeter-based pi/mu separation S = Sip(m)i Green – Old Blue – HPD Red - SIPM SIPMs (compared to HPDs) give 40X improvement in pion rejection at mu efficiency = 50% Useful for high rate low Pt muon physics (like b’s) Jake Anderson

  14. Hamamatsu (US/SWISS?) -sample tests -wafer position info -IV curve CERN Sample tests of 7 each wafer incl: QE, noise, IV curve,Vb, raddam, lifetime CERN Probe all: Ileakage at +1 V FNAL Assembly diodes on mounting card contact probe test FNAL Control card design + component specs INDIA Control assembly card communication test CERN complete sample tests RM CERN shipping inventory INDIA Control + mounting card MAIN TESTING Complete system test with conventional amplifiers + QDC CERN P5 Replacement in extracted RMs Full test with stand alone DAQ CERN UX55 Replacement in RBXs Full test with HCAL DAQ SiPM - MPPC Control and SIPM card Delivery

  15. Schedule for R1/R2 Demonstration of suitable candidate SIPMs (summer 2009)             Presentation of draft proposal to HCAL community (Nov 2009)             CMS Management Review of SIPM proposal (Dec 2009)             Final choice of SIPM vendor (Dec 2009)             Qualification of local electronics fab vendors (India) Nov 2009 Procurement of 2100 Hamamatsu SIPMs (Feb 2009)             Delivery of SIPMs (May 2010)             QC testing of SIPMs (May – Aug, 2010)             Design of final electronics cards (Feb 2010)             Final evaluations (rad, reliability, noise) of final electronics cards (Apr 2010) Launch fabrication of electronics (Apr 2010)             Evaluation of first batch of assembled cards (May 2010)             Full production electronics (May, June 2010)             Start of fabrication of completed electronics + SIPMs (and burn-in)(July 2010)             Start of delivery of completed electronics + SIPMs to CERN  (August 2010)             Finish of fab of completed electronics+SIPMs (Sept 2010)             Finish of Delivery of completed electronics/SIPMs to CERN Oct 2010             Development of Point 5 factory ( Aug, Sept 2010) Ready for installation work Nov 2010

  16. Opportunity for R0 LHC Schedule 2010 – 2011 Run 2012 – mid 2013 18 month shutdown Mid 2013 – mid 2015 ? Second run Mid 2016 to 2017 shutdown Early opportunity for R0: Install at end of first run One segment per eta-phi tower = ~30X30 cm towers Can piggy-back on R1/R2 Use Hamamatsu 3X3 SIPMs Maybe 25m pixels (1600/mm2 or about 11K pixels) ~500 MIPs Light mixer 3.6mm diameter  3.0mm Use identical electronics as R1/R2 Indians build electronics? Cost SIMPs 600 * 50 Euro = 30K E + electronics + labor = modest cost HO has hardware interface to RPC trigger, ready to trigger Phase 1 in 2016 Can have 4 channels per eta-phi tower Do both?

  17. Mixer for R0 Existing cookie fiber bundle 4X2 + 1 9 fibers, dia = 3.6mm Dia = 3.6 + ~ 5 mm Dia = 3.0 - 3X3 Hamamatsu SIPM

  18. Status Plan to be ready to replace R1 and R2 at next shutdown. Want the rework to be done at next shutdown to get maximum utility from the replacement. Could (easily) include R0 upgrade Next opportunity to work on R0 2016

  19. Temperature Stabilization

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