1 / 58

Vijay K. Arora Wilkes University E-mail: varora@wilkes

Vijay K. Arora Wilkes University E-mail: varora@wilkes.edu. Emerging Technologies. Our Motivation and Economics. Adam Smith, “An Enquiry into Nature and Causes of the Wealth of Nations” (1776) The wealth is created by laisse-faire economy and free trade

dayton
Download Presentation

Vijay K. Arora Wilkes University E-mail: varora@wilkes

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. Vijay K. Arora Wilkes University E-mail: varora@wilkes.edu

  2. Emerging Technologies

  3. Our Motivation and Economics Adam Smith, “An Enquiry into Nature and Causes of the Wealth of Nations” (1776) The wealth is created by laisse-faire economy and free trade John Maynard Keynes, “The General Theory of Employment, Interest, and Money” (1936) The wealth is created by careful government planning and government stimulation of economy 1990’s and Beyond The wealth is created by innovations and inventions

  4. 20th Century Paradigm • Formulate a hypothesis or theory • Accumulate data • Do extensive experimentation and Check • Publish if newsworthy • Respect others’ work helping them to grow in the profession • Demonstrate character ethics that puts community interests above personal aggrandizement

  5. 21st Century Paradigm • Formulate a hypothesis or theory or design • Make a prototype structure • Patent it • Raise 17 million dollars and start an IPO • Sue your competitor for stealing your idea • Demonstrate personality ethics that lubricates the process of human interaction for personal aggrandizement

  6. Gross world product and sales volumes

  7. Exponential GrowthSIA roadmap

  8. Historical Trends • New Technology generation every three years • For each generation, memory density increase by 4 times and logic density increases by 2.5 times • Rule of Two: In every two generations (6 years), the feature size decreased by 2, transistor current density, circuit speed, chip area, chip current and maximum I/O pins increased by 2

  9. Research Scenario • A comprehensive transport theory for quantum processes at nanosacle • High-field distribution in quantum wells • Optimization of the shape and size of quantum wells for high frequencies • Quantum Computing: Multi-state logic by using quantum states • Failure of Ohm’s Law: Re-assessment of the circuit theory principles

  10. Goals for High Speed Performance • Large transistor current • Time constants • Interconnects • Cross talk • Reduced transit time • Increased Mobility • High Saturation Velocity • Reduced Size

  11. Source: Cadence RC and Transit Time Delays Source: Cadence

  12. Interconnect ProblemsRC Time Delays • RC time delay is increasing rapidly • Wire resistance is rising • Wires have larger cross-section … introduce coupling • Electromigration imposes current limits • System performance, area and reliability are determined by interconnect quality, not devices!!!

  13. 1  0.5  Increasing Performance Decreasing Coupling Effect Interconnect Performance 0.25  Increased cross-section improves performance but also increases noise and capacitive and inductive coupling

  14. R3 R2 R1 layer m Cc layer m Cf Cf Cf Co Cf Cs Cf Cf Cs Cf Cf substrate R4 layer n RC Delay Considerations • Cint = Cf + Cs + Co + Cload •  = Rint * ( Cint + Cc/(Cint+ Cc) ) •  = Rint * (Cint2 + Cint.Cc +Cc)/(Cint + Cc) • Cc depends on dimensional shrink due to increased in cross-section • In VLSI, make Cc becomes insignificant as possible, then •  = Rint * Cint

  15. Physical Effects • Quantum Effects • High-Field Effects • Field Broadening

  16. Nano-Scale Quantum Engineering

  17. Bulk Semiconductors All 3 cartesian directions analog-type Density of States:

  18. Quasi-Two-Dimensional QW z-direction digital-type x,y-directions analog-type Density of States:

  19. AlGaAs/GaAs/AlGaAs Prototype Quantum Well

  20. Quasi-One-Dimensional QW y, z-direction digital-type x-directions analog-type (QWW) Density of States:

  21. Quasi-Zero-DimensionalQuantum Well All 3 cartesian directions digital-type Quantum box (dot)

  22. Quantum Well WireQuantum Box (Dot)

  23. Quantum Well Arrays

  24. Density of States

  25. Quantum Well with Finite Boundaries

  26. Triangular Quantum Well Approximate: Exact:

  27. Quantum-Confined Mobility Degradation • Changes in the Density of States • Changes in the relative strength of each scattering interaction

  28. Mobility Degradation Versus Quantum Confinement

  29. Gate-Field ConfinementMobility Degradation in a TQW

  30. Electron and Hole Mobility in Submicron CMOS Courtesy: Y. Taur and E. Novak, IBM Microelectronics, IEDM97 Invited Talk.

  31. Random Thermal Motion

  32. Quantum Emission

  33. Randomness to Streamlining Velocity Vectors in Equilibrium Randomness: Velocity Vectors in a Very High Field Streamlined:

  34. Saturation Velocity-Bulk Fermi Integral Normalized Fermi Energy

  35. Saturation Velocity Limits Non-degenerate limit Degenerate limit

  36. Saturation Velocity-Q2D

  37. Saturation Velocity-Q1D

  38. Modeling Transport =0 Transient Response:

  39. Quantum Emission Effective Collision time: Effective collision length:

  40. 1-D Random Walk in a Bandgap semiconductor

  41. Modeling the Distribution

  42. Left-Right AsymmetryItinerant Electron Population

  43. Streamlining the Randomness

  44. Drift-Diffusion Drift Diffusion Drift Velocity Diffusion Coefficient

  45. Single-Valley v-E Characteristics

  46. Velocity-Field Characterisitcs

  47. Effect of Degeneracy (2-D)

  48. Mobility Degradation

  49. Diffusion Coefficient Degradation

  50. I-V Characteristics Microresistors

More Related