Introduction to The discussion – Fermilab's 3D Future and Exploiting our Results

1. Introduction toThe discussion – Fermilab's3D Future and Exploiting our Results

2. recapitulation Through presentations, shown earlier today, we get overviews of : • the background of the 3D technologies and an overview of what the Fermilab team could do, • Fermilab developments for selected direction, • applications benefiting from 3D technologies (where Fermilab can have an important role to play), • realistic approaches to continue 3D efforts seen by the industrial partner We are hoping for recommendations and decisions: • can we afford to continue developments exploiting 3D technologies? • can we afford NOT to continue developments exploiting 3D technologies? • or maybe the results are sufficient for assessments of 3D technologies and we should move on and do something else? • If the choice is to continue, then: • how to get the appropriate funds to support next steps (Fermilab LDRD included)?, • what kind of help can come from internal programs, and from external applications? • What is the environment for joint applications with other entities (other labs) and crossing the boundaries between domains of funding agencies, e.g. HEP-BES, etc.. 3D Workshop, Nov. 15, 2013

3. background Environment of integrated circuits technology for radiation detector readout systems is: • Competitive • Investment-hungry • Characterized by long experience curves for the ASIC groups • Challenging due to restrictions in access to the cutting edge technologies, legalities and bureaucratic burden associated with it Groups tend to focus on one or a few particular detector technologies, families of design blocs, design methodologies or assembly works and excel offering complementary sets of skills and tools to the community Fermilab advanced 3D-IC technology gaining the World leading position! 3D Workshop, Nov. 15, 2013

4. uniqueness How competitive it is becoming now: RD53 (CERN) based formed to promote a 65 nm process and coordinate work towards HL-LHC upgrades; develops dynamically despite of high costs multiple groups ( WGs in RD53) to cut a relatively small pie (design of an analog bloc of the Phase 2 CMS Pixel Tracking System). Eventually great ideas and an added value are needed to succeed. 3D? 3D Workshop, Nov. 15, 2013

5. target 3D chip is composed of two or more layers of active electronic components and featureshorizontal intra-tierand vertical inter-tier connectivity, Distinguishingfeatures of 3D technologies: 4Through Silicon Vias (TSV)5Bonding5Wafer thinning5Back-side processing3 Transformational change: 4Finer pitch pixels 5Less mass 5Higher localized “on detector” functionality 5Bump bond alternative 5Non dead space arrays 3 Long-term goal: Support: glassor Si interposer 3D ASIC with TSVsthreadingconnections Large-areaseam-less sensor Strategic goal: 4 side buttable, dead-area-free detectors for uses rangingfromX-ray, visible, IR imaging to classical tracking 5 3D Workshop, Nov. 15, 2013

6. additional opportunities - 1 Developments that are motivated (although not HEP): Continuation of the VIPIC project: Time of Arrival capable camera for X-ray Correlation Spectroscopy together with the Photon Science Division BNL (BES) 6 3D Workshop, Nov. 15, 2013

7. additional opportunities - 2 Large-area, large DR, direct detection (Si), soft – X-ray camera for the Dynamic Compression Sector at the APS at the ANL 7 3D Workshop, Nov. 15, 2013

8. additional opportunities - 3 Detector with counting capabilities >100MHz/pixel Examples of scintillating materials http://scintillator.lbl.gov Large-area, indirect detection (fast scintillator), hard – X-ray camera for future X-ray Light Sources (BESAC recommendation 07/25/2013) 8 3D Workshop, Nov. 15, 2013

9. Particularly SiPMs at Fermilab 4Discussions about building new technology of a solid state photo-detector have been started ~5-6 years ago at Fermilab 4Despite of multiple attempts, numerous discussions and already starting relations with industry to collaborate … nothing actually happened … no funding We have been talking about opening activities that would lead to new technologies development Digital and 3D Digital SiPM 2013 IEEE NSS & MIC: Ch.Xu, E.Garutti, S.Mandai, E.Charbon, “Comparison of Digital and Analog Silicon Photomultiplier For Positron Emission Tomography Application” VCI2013: K.Yamamoto, “Assembly technology of 4-side buttableMPPC” L.H.C.Braga, “A Fully Digital 8 16 SiPM Array for PETApplicationsWith Per-Pixel TDCs and Real-Time Energy Output”, IEEE Journal of Solid-State Circuits, Vol. 49, No. 1, January 2014 J.F.Pratte: “Development of 3D Single Photon Counting Modules for Radiation Instrumentation”, SLAC seminar Oct. 2013 SiPM review, March 13, 2012 9 3D Workshop, Nov. 15, 2013 SiPM review, March 13, 2012

10. Plan - Fermilab 4significant steps achieved and projects, like VIPIC, are ready for large scale designs (obtain funding), 4NEW Novati/Tezzaron TSVs technologies needs to be demonstrated, 4projects, like VIPRAM, need their first 3D prototypes. 1 year timescale 10 3D Workshop, Nov. 15, 2013

11. Plan - Fermilab 4Follow up funds required to run developments of ‘production’ devices need to be sufficient 11 3D Workshop, Nov. 15, 2013

12. Discussion Some questions: • Is 3D matured enough to base projects with planned deliverables on it? • Is there enough discussion to get detector R&D for experiments interested in 3D? • What is required to handle 3D projects at the required scale and momentum? • Do we have enough resources to handle 3D challenges? (of course we cannot start too many projects) • How to handle projects for applications outside of HEP – synergies – involvement in shorter term and well defined (specifications) projects? 12 3D Workshop, Nov. 15, 2013