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ECE 3110: Introduction to Digital Systems

ECE 3110: Introduction to Digital Systems. Introduction (Contd.). Previous class Summary. Digital devices Digital vs. analog Why digital. Digital Logic. Binary system -- 0 & 1, LOW & HIGH, negated and asserted. Basic building blocks -- AND, OR, NOT. Electronic aspect of digital design.

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ECE 3110: Introduction to Digital Systems

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  1. ECE 3110: Introduction to Digital Systems Introduction (Contd.)

  2. Previous class Summary • Digital devices • Digital vs. analog • Why digital

  3. Digital Logic • Binary system -- 0 & 1, LOW & HIGH, negated and asserted. • Basic building blocks -- AND, OR, NOT

  4. Electronic aspect of digital design Digital abstraction Range Noise margin Invalid range Specifications

  5. Software aspect of digital design • Digital design need not involve any software tools. • But: modern design, software tools are essential. • Examples: • Schematic entry, HDLs (platform compilers, simulators, synthesis tools), simulators, test benches, timing analyzers and verifiers, word processors, high-level languages, CAD

  6. Integrated Circuits (IC) • A collection of one or more gates fabricated on a single silicon chip. • Wafer, die • Small-scale integration (SSI): 1-20 • DIP: dual in-line-pin package • Pin diagram, pinout • MSI: 20-200 gates • LSI: 200-200,000 • VLSI: >100,000, 50million (1999)

  7. DIP pinout

  8. Programmable Logic Device (PLD) • ICs which Logic function can be programmed after manufacturing. • 2-level AND-OR gates using user-programmable connections • PLAs: programmable Logic Arrarys. • PALs: programmable array logic devices • Programmable logic devices (PLDs) • CPLD: complex PLD • FPGA: Field-Programmable Gate Array

  9. CPLD vs FPGA

  10. Application-Specific ICs (ASIC) • Semi-custom IC: chips designed for a particular, limited product/application • Reducing chip count, size, power consumption • Higher performance. • NRE: nonrecurring engineering cost • Standard cells: library • Gate array: an IC with internal structure as an array of gates, unspecified interconnection

  11. Printed-Circuit Board • PCB or PWB (printed-wiring board) • Mount ICs so that an IC can connect to other ICs in a system. • SMT: Surface-mount technology • MCM: multi-chip modules: high speed and density.

  12. Summary • Electronics aspects of digital design • Integrated Circuits • (wafer, die, SSI, MSI, LSI, VLSI) • PLDs: PLAs, PALs, CPLD, FPGA • ASIC

  13. Next… • Number systems • Reading: Wakerly chapter 2

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