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US CMS Silicon Tracker : Overview

US CMS Silicon Tracker : Overview. J. Incandela University of California Santa Barbara US CMS Silicon Tracker Project Manager Fermilab PMG April 9, 2004. Squarks and Gluinos. ~. ~. The figure shows the q, g mass reach for various luminosities in the inclusive E T + jets channel.

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US CMS Silicon Tracker : Overview

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  1. US CMS Silicon Tracker : Overview J. Incandela University of California Santa Barbara US CMS Silicon Tracker Project Manager Fermilab PMG April 9, 2004

  2. Squarks and Gluinos ~ ~ The figure shows the q, g mass reach for various luminosities in the inclusive ET + jets channel. • SUSY could be discovered in one good month of operation …

  3. Gluino reconstruction ~ (26 %) p p g b b   (35 %) ~ (0.2 %) c 0 1 ~ ~ (60 %) 0 - + + - c l l l l  1 + - l l p - l b ~ + l + l b p ~ • Event final state: •  2 high pt isolated leptons OS •  2 high pt b jets • missing Et M. Chiorboli

  4. Tracking • Efficient & robust • Fine granularity to resolve nearby tracks • Fast response time to resolve bunch crossings • Radiation resistant devices • Reconstruct high PT tracks and jets • ~1-2% PT resolution at ~ 100 GeV • Tag b jets • Asymptotic impact parameter sd ~ 20 mm

  5. Silicon Strips 6 layers of 500 mm sensors high resistivity, p-on-n 9+3 disks per end Blue = double sided Red = single sided 4 layers of 320 mm sensors low resistivity, p-on-n Strip lengths range from 10 cm in the inner layers to 20 cm in the outer layers. Strip pitches range from 80mm in the inner layers to near 200mm in the outer layers

  6. 6,136 Thin wafers 320 μm 19,632 Thick wafers 500 μm 6,136 Thin detectors (1 sensor) 9,816 Thick detectors (2 sensors) 3112 + 1512 Thin modules (ss +ds) 4776 + 2520 Thick modules (ss +ds) 10,016,768 individual strips and readout electronics channels 78,256 APV chips ~26,000,000 Bonds 470 m2 of silicon wafers 223 m2 of silicon sensors (thick = 175 m2 + thin= 48 m2) Some Tracker Numbers Silicon sensors CF frame Pitch adapter FE hybrid with FE ASICS

  7. Our Responsibility NEW:End Caps (TEC) 50% Modules for Rings 5 and 6 and hybrid processing for Rings 2,5,6 Outer Barrel (TOB) ~105 m2 2.4 m 5.4 m

  8. Efficiency, Purity, Resolution

  9. Pisa UCSB Brussels FNAL UCSB Sensors: Pitch adapter: Frames: Hybrid: Hybrids: factories Brussels Brussels CF carrier Strasbourg US in the tracker CERN Perugia Wien Louvain KSU Sensor QAC Karlsruhe Strasbourg Module assembly Perugia Bari Lyon UCSB Wien FNAL Bonding & testing Wien Zurich Strasbourg Karlsruhe Aachen Padova Pisa Torino Bari Firenze Integration into mechanics ROD INTEGRATION TIB - TID INTEGRATION PETALS INTEGRATION Aachen Louvain Lyon Strasbourg Karlsruhe Pisa FNAL Brussels UCSB TOB assembly TIB - ID assembly TEC assembly TEC assembly Sub-assemblies At CERN Pisa Aachen Karlsruhe . -- > Lyon US carries roughly half of the total production load TK ASSEMBLY At CERN

  10. Outer Barrel Production • Outer Barrel • Modules • 4128 Axial (Installed) • 1080 Stereo (“ “) • Rods • 508 Single-sided (“ “) • 180 Double-sided (“ “) • US Tasks • All hybrid bonding & test • All Module assembly & test • All Rod assembly & test • Joint Responsibilities with CERN • Installation & Commissioning • Maintenance and Operation ~20 cm Modules Built & Tested in US

  11. Rods & Wheels 1.2 m 0.9 m

  12. End Cap Construction First TEC Module Built at UCSB • Central European Consortium requested US help • With consent of US CMS and DOE, we agreed to produce up to 2000 R5 and R6 modules • After 10 weeks UCSB successfully built the R6 module seen above. • We’re nearly ready to go on R5

  13. The Group • Fermilab (FNAL) • M. Demarteau, A. Ronzhin, K. Sogut, L. Spiegel, S. Tkaczyk + technicians • Kansas State University (KSU) • T.Bolton, W.Kahl, R.Sidwell, N.Stanton • University of California, Riverside (UCR) • Gail Hanson, Gabriella Pasztor, Patrick Gartung • University of California, Santa Barbara (UCSB) • A. Affolder, S. Burke, C.Campagnari, D. Hale, (C. Hill), J.Incandela, S. Kyre, J. Lamb, S. Stromberg, (D. Stuart), R. Taylor, D. White + techs. • University of Illinois, Chicago (UIC) • E. Chabalina, C. Gerber, T. Ten • University of Kansas (KU) • P. Baringer, A. Bean, L. Christofek, X. Zhao • University of Rochester (UR) • R.Demina, R. Eusebi, E. Halkiadakis, A. Hocker, S.Korjenevski, P. Tipton • Mexico:3 institutes led by Cinvestav Cuidad de Mexico • Brown is also planning to join

  14. Recap of this past year • Problems continued to plague components • US contributions have been critical • US played major role in finding and fixing a series of flaws • In some cases these problems would have been fatal • Problems for module components have been addressed (see talks by R. Demina and E.Chabalina) • Frames and hybrids: Yield and rates are high and rising • Sensors and US involvement • US identified CM Noise problem with STM sensors • Advocated shifting order to HPK: • Provided funds for procuring the masks • Insisted order be placed with HPK by end of February – beyond which we would have delayed HPK deliveries • CMS is Re-qualifying STM now • Either STM quality reaches HPK standards or remainder of order will be shifted to HPK • Upshot: no matter what, we achieve very high delivery rates by July

  15. Adapting to Delays • But these issues have meant that the schedule has slipped again! • We have lost 6-8 months in FY04 due to this last round of problems • In parallel with our work to resolve component problems • We underwent a major upgrade of the US production lines in order to achieve significantly higher production capacity to allow us to recover lost schedule time. • New and better methods • More and better tooling and hardware • Better software and Quality Control • Both FNAL and UCSB production lines have demonstrated more than 100% increases in stable, high quality module production • Our production capacity is unprecedented: • CDF Run 2 silicon detector = 750k channels: • We can produce this many channels in 10 weeks without overtime or extended working weeks. With overtime we could do this in 6 weeks

  16. Productivity Enhancements(see talks by White and Spiegel) • Gantry (robotic) module assembly • Redesigned: more robust, flexible, easily maintained • Surveying and QA • Automated use of independent system (OGP) • More efficient, accurate, fail-safe • Module Wirebonding • Fully automated wirebonding • Faster and more reliable bonding • Negligible damage or rework • Taken together: • Major increase in US capabilities • Higher quality

  17. Testing & QA(see talk by E. Chabalina) • US has led in many respects • US testing macros and test stand configurations now used everywhere • Critical contributions • Discovered and played lead role in solution of potentially fatal problems! • Defective hybrid cables • Vibration damage to module wirebonds • Common Mode Noise problem - traced it to ST sensors • Other Important contributions; • Problem of Faulty pipeline cells • Led to improved screening • Taken together • Averted a disaster • Resulted in higher quality

  18. Rod Assembly, Test, Transport(See talks by P. Tipton and J. Lamb) • US contributions • Designed and built module installation tools • Built single rod test stands • Designed and built and multi-rod burn-in stands • Will lead in the definition of tests and test methods • Transportation boxes • Production • Will build and test ~350 rods (+10% spares) at each site

  19. CMS is designed to maximize LHC physics The tracker is one of the main strengths of CMS US is making critical contributions We have (unfortunately) proven to be far more essential to the success of the CMS tracker project than anticipated We have uncovered serious problems Huge US effort to help find good solutions as quickly as possible. Module component problems have been solved Sensor issue is dynamic but we have a solution We’ve accumulated more delays! Summary

  20. Upshot • Schedule has slipped and the project has evolved: • Increased US capacity from 15 modules per day to > 30 • Complete all deliverable modules before the end of FY05 • Delivery of parts crucial • Rod assembly to keep pace with module assembly • Final assembly of the wheels at CERN slipping into FY06. • The costs of an unexpectedly prolonged module and rod production period are being partially offset by use of funds originally allocated for I&C in FY04-05 • Parts are the issue

  21. Schedule of Presentations 1:00 pm Project Overview J. Incandela (UCSB) 1:15 pm Fermilab Production Line L. Spiegel (FNAL) 1:35 pm UCSB Production Line D. White (UCSB) video 1:55 pm Results from Module Testing E. Chabalina (UIC) 2:20 pm Module Components R. Demina (U. Rochester) 2:50 pm Coffee Break 3:00 pm Rods J. Lamb (UCSB) video 3:20 pm Long-term testing and transportation of rods P. Tipton (U. Rochester) video 3:40 pm Schedule J. Incandela (UCSB) 4:00 pm Executive Session E. Temple 4:40 pm Closeout 5:00 pm Adjourn

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