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CCD Packaging: Part 1: Concepts Part 2: Cost and Schedule Jim Fast

CCD Packaging: Part 1: Concepts Part 2: Cost and Schedule Jim Fast. Packaging Issues from LBL meeting. Structure glued to CCD surface must extend to edges of active area No air bubbles are allowed in the bonded region Charge migrates at boundaries due to stress

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CCD Packaging: Part 1: Concepts Part 2: Cost and Schedule Jim Fast

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  1. CCD Packaging:Part 1: ConceptsPart 2: Cost and ScheduleJim Fast

  2. Packaging Issues from LBL meeting • Structure glued to CCD surface must extend to edges of active area • No air bubbles are allowed in the bonded region • Charge migrates at boundaries due to stress • May not be possible to flat field this effect out • Need to match the total shrinkage of silicon over cool down • Aluminum nitride hybrid shrinks a bit more than silicon • Invar 36 foot shrinks a bit less than silicon • Glue bond role is impossible to model – must prototype • This is an ELECTRICAL issue (stress moves charge around), so we need real sensors and a readout system to really investigate the packaging issues • There is only a 270micron gap between the active area and the guard ring structure for the bond pads – this is VERY tight • Need to control glue run-out while ensuring no voids • Bond and wedge interference with hybrid are a big concern • See drawing later in talk

  3. CCD package –LBNL John Bercovitz

  4. CCD package –LBNL • John Bercovitz

  5. CCD Package assembled CRIC, Clocks Molybdenum frame Invar frame Aluminum Nitride CCD

  6. Variations Thermal And Mechanical connection Coldplate Segment cutaway PC board Leads Coldplate Segment cutaway Connector Detector Assembly

  7. Package Components Cold Plate segment Glue CRIC, Clocks Molybdenum frame Invar frame Aluminum Nitride CCD

  8. Exploded View from Back

  9. Cutaway view, Back CCD Flexure Blades Pins Aluminum Nitride Substrate Circuit Board Invar Frame M3 -mounts to Coldplate M2 -into Moly frame Molybdenum Frame

  10. Exploded view, Back Pogo Pads Flexure Blades Copper Pogos CCD Aluminum Nitride Substrate Invar Frame Molybdenum Frame Pins Circuit Board

  11. CTIO package concept – very preliminary and incomplete • J. Fast Invar Frame AlN Hybrid Wirebonds CCD

  12. CTIO package concept – very preliminary and incomplete • J. Fast Invar Frame Wirebonds AlN Hybrid CCD Edges of active area and guard ring

  13. Cost and Schedule Issues • CRIC chip and CRIC board development and production • Assumes 2 prototype cycles plus final order at 20 weeks each • Must start development of board 2/13/04 • Must order first prototypes by 4/22/04 ($21K) • Delivery of first prototypes September 2004 • Delivery of second prototypes July 2005 ($22K) • Production boards and CRIC chips in 2006 ($152K) • CCDs: packaging development and production • Thinned mechanical silicon order in early February, in hand late May • Obtain ~10 low grade but functioning CCDs by October 2004 ($56K) • Study packaging electromechanical issues through early 2005 • Obtain ~10 engineering grade CCDs by July 2005 ($60K) • Finish packaging studies by December 2005 • Production CCD procurement November 2005 ($342K) • Test stands, tooling and mounting “foot” parts • 5 test stands: one this year ($38K) and four in 2005 ($246K) • Tooling and “foot” development in 2004 ($31K) and 2005 ($13K) • Production tooling in 2006 ($12K) • Production “foot” procurement in 2006 ($105K) • Total M&S estimate of $1.1M

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