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RockHydro. Northwest Nazarene University Advisor: Dr. Lawrence Chad Larson Ben Gordon Seth Leija David Vinson Zach Thomas Drew Johnson. Preliminary Design Review. Table of Contents. Section 1: Mission Overview Purpose Goals Theory Success Benefits Expected Results
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RockHydro Northwest Nazarene University Advisor: Dr. Lawrence Chad Larson Ben Gordon Seth Leija David Vinson Zach Thomas Drew Johnson Preliminary Design Review
Table of Contents • Section 1: Mission Overview • Purpose • Goals • Theory • Success • Benefits • Expected Results • Concept of Operations • Section 2: Design Overview • Design Process • Design Requirements • System Overview • Design View • Superhydrophobic • Flexible Chips • Radiation Hardened Chips • Data / Sensors • Block Diagram • Prototyping Plan • RockSat-C 2012 User’s Guide Compliance • Shared Can Logistics
Table of Contents • Section 3: Management • Team Organization • Budget • Work Breakdown Schedule • Timeline • Risk Factors • Section 4: Conclusions
Mission Overview: Purpose • Study the feasibility of using superhydrophobicmaterials in the presence of high acceleration and vibrations for possible use on space missions. • Test Radiation Hardened chips and new flexible chips with American Semiconductors
Mission Overview: Goals • Do research on superhydrophic material that would allow it to be used in future space missions. • Gather data on Radiation hardened chips and to gain experience working with the microchip industry.
Mission Overview: Theory • When water is in contact with the superhydrophobic surface (diatomaceous earth) it is more attracted to its own surface tension than it is to the material. This is because the material works like a microscopic bed of nails. Diatomaceous earth is a new material developed by John Simpson at Oakridge National Laboratory and is exceptional due to its high contact angle with water and low price.
Mission Overview: Success • For this mission to be considered a success, the SH material needs to be recovered and tested post-flight. It would be best if the superhydrophobicmaterial survived the flight. • Get usable data from the radiation hardened chips
Mission Overview: Benefits • The goal of this launch is to prove that this diatomaceous earth can survive a rocket launch and still be functional post-flight. • This material could have many different benefits if it is shown to survive space travel. The SH material has already been shown to work in microgravity by NNU and NASA’s Reduced Gravity program. NASA would benefit from the data gathered if they decide to use this material on future missions. • Provide data to American Semiconductors about their radiation hardened chips.
Mission Overview: Expected Results It is hypothesized that the material will survive the high acceleration and vibrations and still be functional in post-flight testing.
Expected Results • It is expected that the radiation hardened chips will make less errors in the flight compared to the non-hardened chips.
Concept of Operations Time= 4.5 min Height: 75km Main chip data complete Time =1.3 min Height: 75km Start of main chip data Time=2.8 min Apogee of Flight Best data on chips gathered Time=5.5 min Chute is deployed Time= 15 min Lands in ocean Rocket Launch/G-switch triggered
Design Process • Design Superhydrophobic Encasement • Design American Semiconductor Board/ Final Design of Plate. • Build encasement/Build American Semiconductor board. • Implement into Plate • Test board • Run full flight test
Design Requirements • Physical Envelope Cylindrical: • Diameter: 9.3 inches • Height: 4.75 inches • Mass Canister + Payload = 20±0.2 lbf • Center of Gravity Lies within a 1x1x1 inch envelope of the RockSatpayload canister‘s geometric centroid.
System Overview • A Superhydrophobic “donut” will be on one plate • Along with that is the Flexible chips attached to small cylinders. • The electrical systems will be on another plate above the original plate.
Design View Geiger Counter American Semiconductor Board Flexible Chips Superhydrophobic “donut”
Superhydrophobic • A donut shaped hollow object will house Superhydrophobic material. This shape allows for different forces on different axis. • This will be on the lower plate and will be placed around the center support. “Donut”
Flexible Chips • New flexible chips from American Semiconductors will be placed on different axis to find effects of space travel on them. Flexible Chip Cylinders
Radiation Hardened Chips • American Semiconductors will work with students to design a board which will test their radiation hardened chips American Semiconductor Board & Geiger Counter
Data/Sensors • Time • Radiation – Geiger Counter • American Semiconductor data will be stored on a flash memory.
Block Diagram Geiger Counter Memory Radiation Hardened Chip Clock/Signal Power FleX
Prototyping Plan • Between now and the CDR, the superhydrophobic enclosure will be in production. The American Semiconductor plate will be fully designed and the actual AVR board will be in production.
User’s Guide Compliance • Predicted mass - 10lb • Using Rocksat Workshop Plexiglas plate • Diameter – 9” • Height – 3” to 4.5” • A g-switch will be used for activation • Using deionized double contained water
Shared Can Logistics • We will share a canister with the RockOn Workshop. • We will stay in contact with Colorado via e-mail and keep then updated with our design. • We will be using standoffs.
Team Organization Electrical –American Semiconductors Mechanical - Superhydrophobic David Vinson Seth Leija Drew Johnson Ben Gordon Chad Larson Zach Thomas
Work Breakdown Schedule Mechanical/ Superhydrophobic Electrical/ American Semiconductors Build Paint material on interior of “donut” Fabricate AVR Begin Fabrication of Enclosure Design Complete Design
Timeline Mechanical Subsystem Complete design on SH subsystem Complete Fabrication Begin Fabrication Begin Testing Nov 30 Nov 14 Jan 30 Complete Fabrication Finalized Design Preliminary Design with American Semiconductors Begin Testing Electrical Subsystem
Risk Factors • Risk 1: SH enclosure breaks • Risk 2: G-switch fails to start data collection • Risk 3:Malfunction on electrical board.
Future Work before CDR • The main focus before the CDR will be completing the design of the American Semiconductor board and begin the construction of the board. • Begin fabrication of superhydrophobic enclosure.
