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ColorChip: Pioneer in Optical Sub-Systems & Photonics Integration

ColorChip, established in 2001, specializes in developing & manufacturing optical sub-systems for Datacom, Telecom, & FTTH industries. Their Ion-Exchange Technology enables advanced photonics integration for high-speed transceivers & PLC splitters, meeting global standards.

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ColorChip: Pioneer in Optical Sub-Systems & Photonics Integration

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  1. Corporate Profile

  2. Corporate Profile 1 Core Technology 2 3 Key Milestones Products Introduction 4 5 Production Capability 6 Quality Management

  3. Corporate Profile ColorChip, established in 2001 is a privately held enterprise, dedicated to the development and manufacturing of optical sub-systems and components for the Datacom & Telecom and Fiber-To-The-Home (FTTH) industries

  4. Corporate Profile 1 Core Technology 2 Key Milestones 3 Products Introduction 4 5 Production Capability 6 Quality Management

  5. ColorChipIon-Exchange Technology The Process of Making Glass PLC Platforms on glass Step I: WG shaped and embedded Step II: Waveguide core is shaped into a perfect circle Waveguide Exposed Glass WG Core Glass Substrate Infusion into glass substrate Lithography and etching

  6. ColorChipIon-Exchange Technology All components pass Telcordia tests including long term high temperature test to verify technology stability. Step 2 Step I Confidential +1KV

  7. Ion Exchange advantages • Circular buried waveguide • Perfect process control with excellent wafer uniformity • Perfect match to SMF • No internal layer stresses • Low PDL and dispersion Confidential

  8. ColorChipSystemOnGlass™ Platform FAB SOG™ Photonic Integration Ion-Exchange Advanced Application Specific Photonic Integrated Circuits (ASPICs)

  9. Corporate Profile 1 Core Technology 2 3 Key Milestones 4 Products Introduction 5 Production Capability 6 Quality Management

  10. ColorChipIon-Exchange PLC is the basis for our High Speed Transceivers Roadmaps for 100Gbase lr4 Transceivers SOG™ World first 40Gbase lr4 qsfp+ SOG™ Invention reach maturity Iso 9001 granted Incepted 2001 2003 2005 2008 2010 2012 2013-14 PLC Process Development VOA based on PLC Introduction of 1xn PLC Splitter 4’’ PLC Splitter wafer PLC Ion-Exchange

  11. Corporate Profile 1 Core Technology 2 3 Key Milestones 4 Products Introduction 5 Production Capability 6 Quality Management

  12. Passive: PLC 1xN Splitter Product Family PLC Splitter Wafer PLC Splitter Chips PLC Splitter Module FTTH Cabinet ColorChip presently provides PLC Splitter on a 4’’ wafer format ColorChip PLC Splitter Provides full suite of 1XN Splitter ColorChip PLC Splitter Solutions Support the Highest Standards Required by APAC and NA Cabinet Vendors and Telecom Providers

  13. Passive: PLC 1xN Splitter Product Family 4’’ PLC Wafer

  14. Active: High Speed Transceivers World first 40GBASE LR4 QSFP+ Optimized for top-of-rack Data-Center and Enterprise interconnect • Fully certified • In full production over 18 months • Shipping in thousands • Tier 1 customer base

  15. Active: High Speed Transceivers Legacy solutions are no longer enough 40GBASE LR4 QSFP+ a preferred solutions CFP 4x10G Hot pluggable electrical interfaceXLPPI and I2C • Too big • High Power consumption QSFP+ form factor QSFP Active Cable Too short Cabling 4 x 10GBASE LR SFP+ 2xLC Single mode fiber optical connectors Limited speed/blade

  16. Corporate Profile 1 Core Technology 2 3 Key Milestones 4 Products Introduction 5 Production Capability 6 Quality Management

  17. Full Product Development and Production Cycle R&D Class 10-1000 FAB Automatic Manufacturing

  18. Corporate Profile 1 Marketing & Sales 2 3 Products Introduction 4 Research Capability 5 Production Capability 6 Quality Management

  19. ColorChip 4’’ wafer Lid Configurations Pass All Reliability and Durability Testing Lid Glue Wafer Confidential

  20. ColorChip Is Fully Certified Working according to world leading standards Corporate Transceivers PLC Splitters

  21. A world leading pioneer in photonic integration and optical sub-systems

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