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LTD12 Paris, July 2007. Cryogenic X-ray detectors: state of the art. TES. Si-thermistor: 3.2eV. ~ 100ms @ optimal ETF. g -rays: 25eV @ 103keV (Mo/Cu TES array from NIST). Type I SCs (low k ) are suitable for X-rays; type II for optical).
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LTD12 Paris, July 2007 • Cryogenic X-ray detectors: state of the art • TES Si-thermistor: 3.2eV • ~ 100ms @ optimal ETF g-rays: 25eV @ 103keV (Mo/Cu TES array from NIST) Type I SCs (low k) are suitable for X-rays; type II for optical) • STJ more suited for <2keV and for position sensitive devices • Magnetic microcalorimeters 2.7eV @ 6keV; 35mK, t ~ 8ms • (fast improvements, catching up TES) • KIDs (JPL and Caltech) t limited by qp lifetime: t ~ 30ms
Mo/Au bilayers: Tc versus deposition and stress Deposition of Mo thin films: e-beam: tensile, decreases for increasing Ts; SC for Ts ~ 600ºC Tc<800mK sputtering: stress tuned by deposition conditions; chosen compressive RT sputtered films show better stability and reproducibility Deposition of Au thin films: strong change of RRR: e-beam: higher RRR, ~ 6 sputtering: too low RRR (would force too thick films) (Chervenak et al., GSFC)
TES and noise • Discrepancies between results of SRON (Ti/Au) and NIST (Mo/Cu), regarding unexplained noise and relationship to a and geometry. • SRON: low C TES (low R) display better resolution • Finland: a Ti/Au TES in Corbino geometry: higher noise, reduced for increasing a