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Hereu2019s a look at the trending techniques that top PCB manufacturers are using to improve their production processes and boost end-product performance.
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MICROWAVE PCB, RADIO FREQUENCY PCB, TLY-8 PCB, F4BM255 PCB, LOW DK PCB Part No.: E0215060179A Layer count: 2 layerMaterial: FR4, 0.5mm,TLX-8-200, 1 OZ for all layerMinimum tack: 16 mil Minimum space(gap): 16 milMinimum hole: 0.5mmSurface finished: LF HASL
PCB Assembly, PCBA for medical device Part No.: E0215060189A Layer count: 2 layerMaterial: FR4, 1.6mm, 1 OZ for all layerMinimum tack: 5 mil Minimum space(gap): 5 milMinimum hole: 0.20mmSurface finished: ENIG Panel size: 88*108mm/1up
Hard Gold Circuit Board, IPC Class III Circuit board, Via On PAD printed circuit board Layer count: 6 layerMaterial: FR4, 2.0mm, 1 OZ for all layerMinimum tack: 6 milMinimum space(gap): 6 milMinimum hole: 0.25mm
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