10 likes | 147 Views
Secured by wax. Grinding. Delamination by heating. Cleaning. Wax Securing Process. To IC fabrication. Tape Securing Process. Wafer. Pattern. Substrate. To IC fabrication. Wax. Tape peeling. Grinding. Secured by tape. Tape.
E N D
Secured by wax Grinding Delamination by heating Cleaning Wax Securing Process To IC fabrication Tape Securing Process Wafer Pattern Substrate To IC fabrication Wax Tape peeling Grinding Secured by tape Tape