SilC: an International R&D Collaboration to develop Si-tracking technologies for the LC

1. SiLC: Silicon tracking For the Linear Collider ECFA-DESY Extended StudiesNIKHEF, Amsterdam 1st to 4th April, 2003Tracking session 31st March 2003 Aurore Savoy-Navarro, LPNHE-Universités de Paris 6&7/IN2P3-CNRS-France SilC: an International R&D Collaboration to develop Si-tracking technologies for the LC

2. The SiLC Collaboration: Institutions List (still preliminary) Brookhaven National Lab., USA Department of Physics, Michigan U., USA LPNHE-Paris, France University of Peruggia/INFN, Italy, Department of Physics, Tokyo U., Japan SCIPP and UCSC at Santa Cruz, USA University of Torino/INFN, Italy Wayne University, USA [University of Geneva, Switzerland University of Helsinki, Finland University of Pisa/INFN, Italy University of Roma 1/INFN, Italy University of Valencia/CSIC, Spain CNM-Barcelona/CSIC, Spain Charles University in Prague, Czech Rep. Korea, Taiwan]

3. The SiLC R&D Collaboration isdriven by thePhysics motivationsto build the outmost performing tracking systemfor the experiment at the future Linear Collider

4. Two detectors concepts The Si-Envelope: Si-trackers surrounding the TPC Si-FCH SET The SD detector (all Si detector) SIT + FTD

5. Independent of the detector concepts: Period from 2003 till end 2006 will be dedicated to collaborative worldwide effort on: GENERIC R&D

6. Starting from the present state-of-the-art The LEP/SLC legacy: First µvertex @ MarkII –SLAC LEP II µvertex  first long ladders & VA FEelectronics The currently running experiments: AMS, CDF II & STAR AMS: 1st very long ladders (up to 15 sensors), fabrication CDF II & AMS : 1st ‘’large area Si-trackers’’, 5 to 6 m2 sophisticated RT Si-data processing (SVT) STAR: 1st ‘’large Si-drift tracker’’, 0.7 m2, Si-drift FE electronics & readout The LHC detectors in construction: ATLAS, CMS & ALICE CMS & ATLAS: Very large area Si-tracking systems (200 m2) ALICE = further improvements wrt STAR Impressive progresses in Si-tracking technology this past decade !!

7. The R&D Program and Main objectives:from mid 2003 to end 2006 R&D on Si- Sensor technologies R&D on Electronics R&D on Mechanics Simulation Studies and developments Test set-ups Calibration, Monitoring and Slow Control Issues

8. Three main streams: The long µstrips: Main appealing features: drastic diminution of FE channels thus less material and power dissipatio (transparency) high position reso., simplified mechanical design Presently starting from AMS & GLAST exp. (LPNHE, Santa Cruz) 1.- R&D on Si-sensor technologies See R.Bellwied’s & B. Schumm’s @track // ses presentations 1st prototyped long ladder (see ASN talk in tracking session) R&D on wafers: 6’’->12’’, thinner, smaller pitch, D.S. & yield>50%

9. The Si-drift sensors: Appealing features:Equivalent tosolid state TPC, thus 3-D tracker, with timing measurement (nanosecond), Position reso = 10 to 15 µm New developments are underway starting from STAR present expertise (see R. Bellwied’s talk): thinning of the sensors and improved timing and position resolutions with new sensors • New solide state sensor technologies: SiLC will be investigating all possible new SS-technologies of interest for our applicationS, in collaboration with high tech firms and Solid State Research Labs. Depending the locations and/or functions various Si-sensor technos will have to be considered.

10. 2.- R&D on electronics Development of the VFE electronics for each Si-sensor optimization of S/N and power dissipation => power cycling ? Digital architecture: on-detector electronics Sparsification, pedestal substraction on-detector electronics Charge = pulseheight measurement clusterization for point resolution (preprocessing data at earliest possible stage) Timing for noise rejection (&Z measurement ??) « Triggering » or realtime data processing using capabilities of Standalone Si-tracking system Data transmission from detector to outside world Going to submicroelectronics ( <0.25 µm) Packaging and Cabling (TAB etc…) Integration in the overall readout & DAQ system

11. 1.- VFE for long µstrips: => SCIPP @ Santa Cruz: simulation studies and design of a dedicated preamplifier-long shaper with power- cycling circuit , 0.25 µm techno (see Bruce’s talk) => LPNHE-Paris: Detailed studies on the test bench of VA-based F.E. electronics (VA-64-hdr and VA-1) from LEP & AMS and other available FE’s. Forthcoming design of a VFE following similar lines to SCIPP project (collab) 2.- VFE Si-drift Following the lines of STAR + ALICE improvements (cf Rene) VFE electronics: main present electronics issue

12. The first stage in the readout chain is the digization; Some preliminary thoughts on how to implement on-detector this function, and related issues. But still many questions in ??? In the case of Si-drift: {PASA + SCA + ADC} into a single chip as for ALICE is considered also for the LC Si-readout schema: very preliminary

13. 3.-R&D on Mechanics • Mechanics are a major issue to build the appropriate • Si-trackers for the future LC detector. • Main challenges = need for: • An ‘’extreme’’ transparency or as less material as (im)possible • Very high precision in position, mechanical stability • large surface detector • cheap and easy to build devices THIS IMPLIES a real and multi-facets R&D on mechanics to achieve a step forward in mechanics as compared to presently running or under construction Si-trackers.

14. Main R&D Mechanics topics: • Detailed CAD design of a Si-tracking system • Transparency related issues studies • Cooling studies: test on mechanical prototypes and CAD computations • Tests and studies on materials and approaches (mechanical structures, cooling etc…) • Mechanical precision issues • Alignement • Mechanical constraints and stabiltiy • Technique to build a large number of basic mechanical elements: study of technology transfer to Industry • Studies on mechanical prototypes (feasibility of mechanical design components, Industry transfers etc…)

15. 3.1- Detailed CAD design of the Si-envelope and outcomesAllows to address all the possible Si-tracking cases: SET=large area Si-tracker Si-FCH = forward Si-tracker (ASN’s talk at tracking // session) SIT intermediate Si-tracker =>CAD detailed design reveals pbs =>Gives inputs for geometry DB in GEANT4 based simus

16. 3.2- Cooling studiesOn prototypes and comparing with CAD dedicated software computations (ASN @tracking parallel session)

17. 4.-Test set-ups Most of the Institutions are well equipped in various Lab test benches in clean rooms. A few of them are getting equipped. To be developed: the appropriate test bench for various mechanical prototypes test issues Foreseen: Beam test by fall 2006 with a full prototype possibly preceeded by intermediate test beam studies ( under discussion)

18. 5.- Calibration, Monitoring and Slow control issues • Three main issues will be addressed: • The handling of distorsions in the tracking system • The alignement issues • The very high precision in position required Expertise developed for the LHC on these issues will be very fruitful, as for instance: Interferometer system for ATLAS by the Michigan group

19. 6.- Simulations and developments studiesSiLC is benefitting from both FAST MC’s expertise (SGV, LCTRK..) and GEANT4-based starting expertise Work to be done or underway: Detailed pattern reconstruction, including forward direction GEANT-4 detailed simu developt. Various detector set-ups & technos comparisons including TPC Background studies[ including GEANT simulation of beam line & related detector issues (ex: forward ..)] Calorimeter-assisted tracking (for SD) Physics studies to establish performan ce requirements

20. Schedule & Milestones for the Si-SENSOR R&D 2003 2004 2005 2006 Milestones Long Si µstrips R&D Si-Drift techno R&D New sensor technos Proto Beam Test

21. Schedule/milestones for electronics R&D 2003 2004 2005 2006 R&D on Long Si-µstrip F.E. R&D on Si- Drift F.E. R&D readout R&D RT data proc.

22. Schedule/milestones for mechanics R&D2003 2004 2005 2006

23. CONCLUDING REMARKS Proposal will be submitted in about one week from now, Presentation at the next PRC opened session, May 7th and 8th, 2003