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Clip-On Heat Sinks

Clip-On Heat Sinks. Thermal Resistance for Clip-On. Bond-On Extrusions for DIP Packages. Thermal Performance. Thermal Resistances for Bond-On. Example. TO-220 case style dissipating 5 watts R JC = 3.0 C / Watt (from device spec) T Jmax = 150 C T Amax = 50 C

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Clip-On Heat Sinks

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  1. ECE 442

  2. Clip-On Heat Sinks ECE 442

  3. Thermal Resistance for Clip-On ECE 442

  4. Bond-On Extrusions for DIP Packages ECE 442

  5. Thermal Performance ECE 442

  6. Thermal Resistances for Bond-On ECE 442

  7. Example • TO-220 case style dissipating 5 watts • RJC = 3.0 C / Watt (from device spec) • TJmax = 150 C • TAmax = 50 C • Find the proper heat sink to keep the junction temperature from exceeding 150C in natural convection. ECE 442

  8. Need to determine a value for RCS – depends on the mounting technique. If the device is mounted without an insulator, but only with Thermalcote, (silicone grease), check page 57, Figure 9 for TO -220 case style. ECE 442

  9. Use Thermalcote RCS = 1 C/W No Insulator ECE 442

  10. ECE 442

  11. Thermalloy P/N 6030 Temperature rise above ambient@ 5 Watts Power Dissipation = 66 C ECE 442

  12. Thermal Resistance RSA As long as RSA is less than 16 C/W, the requirement is met. ECE 442

  13. Thermalloy P/N 6030 ECE 442

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