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3D ISIS : Different approach to ISIS Andrei Nomerotski, LCFI Collaboration Meeting

3D ISIS : Different approach to ISIS Andrei Nomerotski, LCFI Collaboration Meeting Bristol, 20 June 2006 Outline What is 3D ? Reviewed by Ray Yarema’s in Ringberg May 2006, see http://www.hll.mpg.de/~lca/ringberg/ , three Ray’s slides will follow

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3D ISIS : Different approach to ISIS Andrei Nomerotski, LCFI Collaboration Meeting

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  1. 3D ISIS : Different approach to ISIS Andrei Nomerotski, LCFI Collaboration Meeting Bristol, 20 June 2006 Outline • What is 3D ? • Reviewed by Ray Yarema’s in Ringberg May 2006, see http://www.hll.mpg.de/~lca/ringberg/ , three Ray’s slides will follow • 3D ISIS – some ideas to merge ISIS and 3D approaches • Some speculations about future (not much)

  2. Introduces multilayer PCB philosophy into silicon planar technologies

  3. (by MIT Lincoln Labs)

  4. 3D ISIS Concept • How 3D can help ISIS? • Difficulties of classical ISIS • CCD and CMOS process on same wafer • Complex topology of CCD gates for linear structures 3D ISIS has two Tiers • 1st Tier : Storage (CCD) part • 2nd Tier : Readout (CMOS) part

  5. 3D ISIS Imaging Pixel • View from above  • Store charge in a linear zigzagged CCD register • Need two phase design • As shown has 7 cells – more complicated designs possible • CCD register is confined to a single cell  Simplified gate structure a la’ CPCCD • Charge is moved in all cells simultaneously • Has a via to 2nd Tier – used for readout phase Advantages: • 1st Tier is purely CCD process, 2nd Tier is purely CMOS process • As there are no readout components in Tier 1, more room is left for storage cells and photo-gate, assumed 5x15 um PhG, 3 um cells, 3um via – nothing pushes technology

  6. F1 F2 3D ISIS Clock Steering • Simplified (wrt ISIS) clock steering : whole sensor is driven simultaneously • What about driving large capacitive load i.e. CPCCD-like problems? • Need to move charge 20 times in 1 ms = 20 kHz instead of 50 MHz as in CPCCD  easier to drive • Clock should be fast enough to move the charge before next bunch crossing (330 ns)  5 MHz • Less area occupied by gates = lower C • Considerably less transfers wrt CPCCD (20 vs 5000) = care less about CTE

  7. 3D ISIS Readout • During readout CCD register is advanced and charge appears in 2nd Tier through the via simultaneously for all pixels – similar to MAPS, FAPS, SOI. • Column-based readout : have 200 ms per 5000 pixels – 40 us/pixel which is a lot of time. Many approaches possible, ex. a la’ ATLAS. Advantages • Simple (compared to FAPS etc) design : storage capacity is implemented in 1st Tier • Clock manipulations are minimal during readout (just advancing the CCD register), can be done externally without introducing extra connections between Tiers 1 and 2 (no edge logic necessary in Tier 1)

  8. 3D ISIS Open Issues As any new idea 3D ISIS has many open issues – just to list a few: • Nobody tried so far to bond a CCD wafer to a CMOS wafer - is CCD process compatible with 3D bonding? • Can gate structures be made planar enough? Can aplanarity be compensated by additional CVD oxide & polishing? • Some bonding and via techniques require high T (~450 C) – is it compatible with polySi gates? • Is charge transfer between large photogate and first cell efficient? • Large size of CMOS chip (Tier 2) – yield problems?

  9. Possible Developments • Fermilab has a strong R&D program on SOI pixels based on 3D • Exploring all parts of 3D technologies (wafer bonding, thinning, inter-wafer vias), working with American vendors (MIT LL, Americal Semicondutor, Ziptronix, IZM, RTI), will have 3D multiproject run in 2006 • Design of readout for SOI pixels • We could have Tier 1 ISIS prototypes compatible with their readout and participate in the multiproject run • Some European efforts exist (Belfast QU, Poland, INFN) on 3D and SOI technologies

  10. Summary • Proposed new option for ISIS storage pixels : 3D ISIS • Takes advantage of recent developments in 3D technologies • Opens new opportunities at expense (of course!) of investment needed to explore these new opportunities • It’s clear that to go beyond talking this approach needs • A practical design worked out in enough detail • Some R&D plan – probably joining forces with existing 3D efforts • Goal of this talk was to distribute this idea more broadly and stimulate some discussion re this direction

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