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AMS-CHESS-1 daughterboard – bonding diagram for Edge TCT

AMS-CHESS-1 daughterboard – bonding diagram for Edge TCT Part 1 – outermost chip pads and bias for isolated amplifiers

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AMS-CHESS-1 daughterboard – bonding diagram for Edge TCT

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  1. AMS-CHESS-1 daughterboard – bonding diagram for Edge TCT Part 1 – outermost chip pads and bias for isolated amplifiers Note the “bars” of bias pads encircling the chip. For bias bonds, anywhere along these extended pads is equivalent and can be varied, if another angle is easier to achieve during wire-bonding. 24 September 2015 Board cutout for Edge TCT Blue = signal Yellow = bias Orange = 3.3V Red = HV White = ground Pink = bias for amplifiers Casc iNSF iN VPLoad iNBias iPFB APA8 APA2 APA3 APA5 APA4 APA6 Note that for this Edge TCT configuration, Active Pixels Arrays APA1 and APA7 are not bonded out, so that arrays APA2 and APA8 can be read out. This is because APA2 and APA8 could be stimulated by laser. APA7 APA1 iPFB iNBias VPLoad iN iNSF Casc

  2. AMS-CHESS-1 daughterboard – bonding diagram for Edge TCT Part 2 – inner throw for Passive Pixel Array 9 (PPA9) and the isolated amplifiers. These are layers of bonds arcing over the bonds for active pixel array APA3. Board cutout for Edge TCT Blue = signal Yellow = bias Orange = 3.3V Red = HV White = ground Pink = jumpers to outer pads Casc iNSF iN VPLoad iNBias iPFB PPA9 APA8 APA2 APA3 APA5 APA4 APA6 Note that isolated amplifier pads Out4 and Out5 are not connected, to ease the bonding of PPA9. APA1 APA7 iPFB iNBias VPLoad iN iNSF Casc

  3. AMS-CHESS-1 daughterboard – bonding diagram for Edge TCT Part 3 – outer throw for isolated amplifiers This is a layer arcing over the inner throw for the isolated amplifiers, or interspersed with the inner throw. Bonds anywhere along the long vertical input ‘bar’ pad are equivalent. Board cutout for Edge TCT Blue = signal Yellow = bias Orange = 3.3V Red = HV White = ground Casc iNSF iN VPLoad iNBias iPFB Input pad for isolated amplifiers APA8 APA2 APA3 APA5 APA4 APA6 Note that isolated amplifier pads In4 and In5 are not connected, to ease the bonding of PPA9. The angle of the 5 input wire bonds can be varied freely, as bonding anywhere along the extended input pad is equivalent. APA1 APA7 iPFB iNBias VPLoad iN iNSF Casc

  4. AMS-CHESS-1 daughterboard – bonding diagram for Edge TCT Part 4 – bonds for capacitors and high voltage Capacitors should be glued with non-conductive glue Blue = signal Yellow = bias Orange = 3.3V Red = HV White = ground Board cutout for Edge TCT VDD3V3 Bond these pads multiple times Bond these pads multiple times VDD3V3 iNSF iN iPFB

  5. Capacitor specifications: Manufacturer: Ipdia Part number: EMSC 42F.610 (935.121.42F.610) Value: 100nF Size: 0404 Height: 100µm Notes about capacitors Capacitors should be glued with non-conductive glue. Pins 1 & 2 are tied together; pins 3 & 4 are tied together. Orientation for C1, C4, C5 and C6: Orientation for C3: Label expected to be E6101 on all capacitors This connecting bar is probably the best feature for orienting the capacitors. C1 = VDD3V3 to GND C4 = iN to GND C3 = VDD3V3 to GND C5 = iPFB to VDD3V3 Note, there is no C2 (by oversight) C6 = iNSF to GND

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