The Quality Assurance and Reliability Testing (QART) Lab at CERN

1. The Quality Assurance and Reliability Testing (QART) Lab at CERN Outline • Purpose of Lab • Lab site • Personnel and Equipment • Activities • The DSF and Bonding Lab • Conclusions A. Honma, CERN PH/DT CMS Upgrade Meeting, A. Honma

2. Purpose of Lab CERN DSF QART and Bonding Lab • Was created from the White Paper initiative of the DG in 2007, R&D for LHC upgrades • Part of WP6: Interconnect Technology and QA (for LHC silicon detector upgrades) • Located in the PH Departmental Silicon Facility (DSF) in Bldg 186 • Common QA lessons learned from LHC silicon detector construction should be documented. Avoid mistakes in the LHC detector upgrades and provide infrastructure and expertise to apply QA and reliability testing for the upgrade R&D and construction phases. • QA ⇒ Planning and procedures common to ANY project. Broader scope for lab: any LHC detector, non-LHC detectors, other CERN projects • Reliability Testing has become essential owing to lack of accessibility and long expected life times of detectors and electronics CMS Upgrade Meeting, A. Honma

3. Lab Site CERN DSF QART and Bonding Lab CERN DSF QART and Bonding Lab Location of QART lab is inside B186-R (ground floor) in the Departmental Silicon Facility QART Lab Departmental Silicon Facility High Bay Hall CMSPreshower Final Assembly CMS Tracker Integration Facility Bldg 186 B186 CMS Upgrade Meeting, A. Honma

4. Personnel and Equipment CERN DSF QART and Bonding Lab CERN DSF QART and Bonding Lab QART Website: http://bondlab-qa.web.cern.ch/bondlab-qa/QA.html Personnel (2.5 FTE): • 1 proj. assoc. (F. Manolescu) – 100% • 1 fellow (A. Drozd) – 100% Equipment: • Climatic chamber (large volume, fast temp. cycling with humidity control) • Thermal cycling chamber (small volume, med. speed, no humidity control) • Vibration tester (mono-axial shaker can deliver 10G’s to 10Kg payload) • Infra-red thermal imaging video camera • High magnification stereo-microscope on probe station with video camera • Small aperture permanent magnet with B=0.7T for high mag field studies • Die shear tester / bond wire pull tester • 1 physicist (A. Honma) – 30% • 1 technician (I. McGill) – 20% CMS Upgrade Meeting, A. Honma

5. Equipment: Climatic Chambers CERN DSF QART and Bonding Lab CERN DSF QART and Bonding Lab • Tests: • Thermal cycling • Accelerated lifetime • Humidity tolerance • Cold tolerance • Stress screening • Environment simulation Climatic Chamber Temp range: -70°C to +180°C Hum range: 10% to 95%RH Heating speed: 15°C/min Cooling speed: 11°C/min TOTEM hybrid thermal cycle Thermal Cycling Chamber Temp range: -40°C to +180°C Heating speed: 5°C/min Cooling speed: 6°C/min +60°C +20°C -30°C 65 min CMS Upgrade Meeting, A. Honma

6. Equipment: Vibration Tester CERN DSF QART and Bonding Lab CERN DSF QART and Bonding Lab • Mono-axial shaker with control system and analysis tools for Random, Sine, Shock, and Recorded vibration inputs. Can perform: • Destructive testing • Stress screening • Modal analysis • Playback of transport and handling vibrations and shocks • 30cm x 30cm head expander allows testing of large objects (ex.: CMS silicon tracker module) Acceleration frequency spectrum Accelerometer on silicon sensor CMS Upgrade Meeting, A. Honma

7. Equipment: IR Video Camera CERN DSF QART and Bonding Lab CERN DSF QART and Bonding Lab • High sensitivity (0.1°K) thermal imaging IR video camera. Expected uses: • Identifying hot spots on silicon sensors, thermal run-away conditions(?), … • Heat flow study on front-end PCBs and detector modules • Many other possible uses … Temperature measurements Example #1: Motherboard of a PC. Frame capture from the video output. 1: and2: User selectable measurement points (3 max) 4: Hottest point in frame Example #2: Malfunctioning heating loop was easily located on one of CMS Tracker Endcap panels. CMS Upgrade Meeting, A. Honma

8. Equipment: High Magnification Zoom Stereo-microscope CERN DSF QART and Bonding Lab CERN DSF QART and Bonding Lab • High magnification (up to 320x) needed for silicon sensors (pixel or strips) and for (bare) read-out chips. • Stereo needed for 3-D structure identification. • Video camera useful if object’s visual aspect has time dependence and for documentation. • Possibility to probe the observed object. • Example: Poor wire bonding quality can often be spotted from surface details and form of welded bond “foot”. Below: right-most bond foot is heavily over-deformed (flattened). Leica MZ16 acceptable marginal rejected 50μm CMS Upgrade Meeting, A. Honma

9. Equipment: High Field Magnet CERN DSF QART and Bonding Lab CERN DSF QART and Bonding Lab Motivation: CDF silicon strip detector had broken bond wires from vibration owing to AC current at resonant frequency of wires (10-30KHz) in high B field (1.4T). 0.7 T dipole field using neodymium magnets. Plan to get a small electromagnet with up to 2T ATLAShas published ananalysis for at-risk bonds in ATLAS silicon detectors. But no known systematic study of effects of wire loop properties and bonding quality on breakage risk. Try to quantify more generally these risks. Resonant oscillation on bond wire of 3.5mm length found at6.8KHz. Both ATLAS and CMS have determined the risk of existing bonds to be minimal but have taken precautions to avoid fixed frequency triggers. In agreement with FEA calculations CMS Upgrade Meeting, A. Honma

10. Activities, Past/Planned CERN DSF QART and Bonding Lab All equipment is ready for use by the user community. Although priority is given to the LHC experiments silicon detector upgrade projects, other upgrade projects, other experiments, and other CERN projects can use the lab. Examples of tests done or planned: • Thermal cycling done on front-end electronics (CMS, TOTEM, ALICE), sensors/chips (Medipix), standard PCBs (LHC quench protection system, CMS Preshower), small mechanical structures. Tests can be passive or active (users provide control and powering electronics). • Accelerated aging (timed heat soak) performed for corrosion (with humidity), metal migration (bond wire pads), oxidation. • The IR video camera used for hot spot detection on silicon sensors. • We plan to do transport and handling vibration damage studies for silicon detector modules and components. This will include real recordings of transport examples (plane, truck, train) for playback. • Continue wire vibration damage studies in magnetic field. CMS Upgrade Meeting, A. Honma

11. The Departmental Silicon Facility (DSF) CERN DSF QART and Bonding Lab The QART lab shares clean room space and personnel with the bond lab. The QART lab also uses space in the non-clean DSF areas. Departmental Silicon Facility (2010) P=power, E=Ethernet, G=gas lines (N2) DSF Clean Room (~270m2usable) PE PEG PEG PG RD50 • LHCb and Medipix ~30m Technical Rooms and Airlocks ~85m PEG P P LHCb CMS Access Way Non-Clean Areas Clean room boundary ALICE PEG PE P ~65m Bond and QART Lab RD50 ATLAS PE PEG CMS Upgrade Meeting, A. Honma

12. The Bonding Lab CERN DSF QART and Bonding Lab The Bonding Lab is a CERN shared facility which is dedicated to: • Ultrasonic wedge wire bonding with aluminium wire. • Pull testing of wires (destructive and non-destructive). • Die attach (chip and small detector gluing). • Encapsulation of wire bonds (new). IJ Fisnar 7300-LF Glue (Encapsulation) dispenser Cammax DB600 die bonder with heated chuck Dage 4000 bond wire pull tester and die shear tester CERN Bond lab did about 20% of CMS Tracker bonding + 100% of Preshower. Now doing sensor, chip and radmonR&D for CMS. 2 Delvotec 6400 ultrasonic wedge wire bonding machines CMS Upgrade Meeting, A. Honma

13. Conclusions CERN DSF QART and Bonding Lab • Quality Assurance and Reliability Testing (QART) Lab is now equipped with all foreseen major test apparatus. • Lab personnel are trained or in training for test equipment. We are able to provide test services (for smaller jobs) or advice and assistance (for larger jobs) to the LHC experiments upgrade projects. • We have a resource library and experience concerning quality assurance for detector projects. We are always interested in learning from others experience as concerns quality issues. • Reliability testing is a critical step in assuring that the components and the systems that cannot be easily repaired or replaced will be able to function over the required lifetime. • Please feel free to contact us for questions, discussions, planning and requests for QA, reliability testing, equipment usage, wire bonding and chip gluing. http://bondlab-qa.web.cern.ch/bondlab-qa/QA.html CMS Upgrade Meeting, A. Honma