AIDA-2020 WP2: Innovation & Outreach

1. AIDA-2020WP2: Innovation & Outreach Aurelie Pezous, CERN AIDA-2020 5th annual Meeting, 4th April 2019

2. Objectives • Scientific Coordination • Communication, dissemination and outreach • Industrial relations and technology transfer • Management of the Proof-of-Concept (PoC) fund • Pre-industrialisation of large area silicon detectors WP2-A.Pezous.

3. Task 2.3 Industrial relations and technology transfer • Academia meetsIndustrySymposium feedback: • 59% of the participants ranked the overalleventwith maximum grade • 53% of the participants ranked the event as not toomuchtechnical (whichwas the goal) WP2-A.Pezous

4. Task 2.3 Industrial relations and technology transfer • Feedbackconcerning the 2 AMI eventsto be sent after the Annual meeting: • https://docs.google.com/forms/d/e/1FAIpQLSdNbldhN7r-n3n2yXRKBUarLi9NHazhoO2LbnwaRozKEDFzPg/viewform • Key questions: • How many new projects/collaborations came out of this event? Please comment. • [For industrials only] Did this event bring you new leads/customers for your business? If yes, how many? WP2-A.Pezous.

5. Task 2.3 Industrial relations and technology transfer • How to improve the KT/TT from AIDA2020 to Industry? • Prepare a value proposition of whatis unique in each WP: • 1slide to explainwhatisdone or whatis the specific know-how developpedin AIDA2020, whatis in it for Industry and the type of industrythatmightbeinterested WP2-A.Pezous.

6. Key competence: Thermal management using silicon microchannels • Cooling of integrated circuits, particularly where stable thermal management is needed, for example… • Laboratory coolers • Manufacturing of specialised components • Data centres apps The volumetric power density of a LHC Pixel detector is approximately 100 W/dm3 - comparable to the most demanding high power electronics applications. To provide stable and precisely controlled thermal management, CERN experts have developed know-how in the design and manufacture of ultra-thin microchannel cooling plates. what • Know-how on designs for high power density cooling: •  Increase performance and protect electronic equipment from • thermal damage • Ultra-compact, integrated cold plate/heat exchanger: •  Reduce space requirements • Know-how on interconnection of multiple devices: •  Large cooling surfaces possible (>300mm) added value • Proven technology - already adopted in two experiments at CERN • Cooling up to 100s W/cm2 depending on design • Down to 150um silicon • Suitable for single- or two-phase refrigerants • No mismatch in coefficient of thermal expansion (CTE) between integrated circuits • Significant expertise in the integration of micro-scale components, surface preparation, and bonding techniques • Ongoing R&D on new microfabrication techniques tech specs

7. Task 2.3 Industrial relations and technology transfer • WP4: Value proposition prepared to be sent to Christophe • WP9: • visit Airbus D&S • µchannelcooling value proposition • WP13: • Value proposition in progress • license agreement about APIC in 2017, 1st orders in 2019 WP2-A.Pezous

8. Task 2.4 Management of the Proof-of-Concept (PoC) fund • Objectives of PoC: • General field of detector development • Collaborative projectindustryoriented • Bringing technologies closer to the market  Impact beyond high energy physics WP2-A.Pezous.

9. Task 2.4 Management of the Proof-of-Concept (PoC) fund • 3 projectsfunded: WP2-A.Pezous.

10. D2.4: SMART • Microdosimetry for hadron therapy • 96% channelyield • Planning proton/carbon beam tests of pixellatedsensors • Licencing conditions agreedwithAlibava WP2-A.Pezous

11. D2.4:TSV • Development of a process by IZM for Uni Bonn • Successfuldevelopment and good performances • IZM acquired 3 new projects/customersthanks to thesedevelopments WP2-A.Pezous

12. D2.4:RaDoM • Incorporation in progress in Switzerland • And Italy (Trentino ) in a later stage CONNECT DEVICES Connect sensors and existing HCVA system control units to our cloud. Install IoT minimally invasive air purifiers, if needed MONITOR THE AIR QUALITY AND DRIVE SYSTEMS Continuously monitor radon and optimize already installed HCVA systems to solve the radon and air quality problems. Sensors, purifiers and HCVA system are driven through our cloud WP2-A.Pezous

13. Task 2.5Pre-industrialisation of large area silicon detectors • Phase-II Upgrades will need more than 46.000 x 6-inch and 30.000 x 8-inch wafers • ATLAS/CMS Market Survey was started in 2016 to identify interested companies • European vendor Infineon was interested in HEP detectors • Prototype sensors for CMS tracker, HGCal and ATLAS Itk produced through year-long collaboration • Infineon stopped further that project in summer 2018 because of economic reasons • Project was very visible within local funding agencies and academic environment • Very educative collaboration • We learned a lot about commercial production of silicon devices • Infineon gained insights in HEP community, device irradiations and received highly trained manpower • Market Survey closed with only one qualified company • Experiments defined technical specifications for procurement • Invitation to Tender sent out yesterday • HPK has time to answer until 24 April WP2-A.Pezous. Bologna

14. Milestones and Deliverables • Milestonessince last annual meeting: • MS79:2nd AIDA-2020 “Academia meets Industry” event (M36) • Deliverablessince last annual meeting: • D2.3: Identification of companies (production capabilities including evaluation of possible samples and prototypes) (M44) WP2-A.Pezous.

15. Comingyear • Follow-up PoCprojects • Finish value proposition value proposition with WP leaders • AIDA 4EVER: • What? Findingcompaniesinterestedeither in the topic of researcheither on developping technologies for HEP and other applications • When? The sooner the better WP2-A.Pezous.