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Microplasmas: Physics and Applications. Presented at the MIT Plasma Science and Fusion Center February 18, 2005 Jeff Hopwood, Northeastern University. Outline. Motivation: Applications Plasma Display Panels Micro Propulsion Micro Chemical Analysis Systems “lab-on-a-chip” others
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Microplasmas:Physics and Applications Presented at the MIT Plasma Science and Fusion Center February 18, 2005 Jeff Hopwood, Northeastern University
Outline • Motivation: Applications • Plasma Display Panels • Micro Propulsion • Micro Chemical Analysis Systems • “lab-on-a-chip” • others • Microplasma Devices and Physics • DC (review) • RF (inductively coupled plasma on a chip) • microwave (split ring resonator) • Summary
blue red green Plasma Display Panels (PDPs) Structure From S.S. Yang, et al, IEEE Trans. Plasma Sci. 31, 596 (2003).
initiate breakdown (~ 300 volts) sustain plasma (~ 180 volts) surface + + + + + + Plasma Display Panels (PDPs) Basic Operation Sustain Electrode + + + + 100 kHz Bus Electrode h ~ 200 m l ~ 400 m d ~ 60 m From S.S. Yang, et al, IEEE Trans. Plasma Sci. 31, 596 (2003).
Some plasma details of PDPs • Ne + Xe (1-10%) • Ne is a buffer gas (Eiz-Ne>> Eiz-Xe) • but neon decreases diffusion losses of Xe+ • UV production from • Xe (1s4) • Xe (1s5) • Xe2* …optically thin, desired state for UV production • produced by three-body collision: e.g., Xe* + Xe* + M Xe2* + M • Power ions (large sheath voltage) • excitation is only ~15% of total system power } …optically thick, inefficient
PDP Cell DiagnosticsK. Tachibana, et al., IEEE Trans. Plasma Sci. 31, 68 (2003)3-D temporally-resolved emission and diode laser absorption 150 um
PDP Cell DiagnosticsK. Tachibana, et al., IEEE Trans. Plasma Sci. 31, 68 (2003)3-D temporally-resolved emission and diode laser absorption Address electrode Sustain electrode side view front view Plasma decays in ~1 ms near-IR emission from Xe(2p)
Modelingexample from S.S. Yang, et al, IEEE Trans. Plasma Sci. 31, 596 (2003).
Issues in PDP • Efficiency • currently < 2 lumens/watt • goal: 5 lumens/watt • incandescent lamp ~ 25 lm/w; fluorescent~100 lm/w) • gases, pressure, electrodes, geometry • something more creative? control of the eedf (Rauf-Kushner)? • Phosphor degradation/MgO degradation • due to energetic Xe+ bombardment • RF sustain voltages (LG Electronics) • electrons are trapped in cell; improves eff. (~2 lm/w) • but…complex microstructure, electronics, EMI
Micro Propulsion for Nanosats(autonomous satellites with a mass <10 kg) from D.L. Hitt, et al, Smart Mater. Struct. 10 (2001) 1163–1175
Field Emission Electric Propulsion Taylor cone; E~109 V/m (Cs) another microplasma opportunity? Source: http://www.centrospazio.cpr.it/FEEPPrinciple.html
Micro Pulsed Plasma Thruster(micro-PPT) + from Keidar, et al., AIAA Joint Propulsion Conference, Huntsville, AL, 20-23July2003.
power light process gas optical spectrometer mplasma J. Eijkel, Stoeri, Manz, Anal. Chem 71, 2600 (1999) Micro Chemical Analysis • Emission Spectrometry • possibly coupled with another separation technique (e.g., GC) • Issues • pumping • stability/repeatability • lifetime/contamination • power/heat
Micro Chemical Analysis - differential ion mobility spectrometry - from R.A. Miller, et al, Sensors and Act. Workshop, Hilton Head, 2000) sionex.com
Micro Chemical Analysis- Issues - • Very limited success in micropump development • must operate at or near atmospheric pressure • No practical method for storage of inert gases • must operate with air or other ambient • Long term stability of physical and chemical proc. • no erosion of the microstructure • no contamination/fouling • Low power (< 1W), to be portable • Low temperature (only ambient cooling) will return to these topics later….
Other Microplasma Applicationsmedical/surgicaldecontaminationchemical factory on a chip
Medical Applications RF Plasma Needle • 1 atm, He (+ air, N2, Ar) • d ~ 0.1 – 1 mm • 13.56 MHz, < 1 W • 250-500 Vp-p • Trot < 100 C, non-equil. • Plasma surgery, dentistry • Apoptosis, not necrosis E. Stoffels, et al., Eindhoven University of Technology from Plasma Sources Science and Technology (2002)
Materials Processing, Point of Use Micro Chemical Factories from R. M. Sankaran and K. P. Giapis, J. Appl. Phys. 92, 2406 (2002). Also, production of nanoparticles.
Microplasmas • DC • RF capacitively coupled • RF inductively coupled • microwave
Sputtered material Review of DC Microplasma Sources DC helium plasma on a chip. Plasmas were created in volumes as small as 50 nL. Discharge voltage ~ 800V; Starting voltage ~ 6 kV; Lifetime ~ 2 hours. + Eijkel, Stoeri, and Manz, Dept. of Chemistry, Imperial College, UK “An atmospheric pressure dc glow discharge on a microchip and its application as a molecular emission detector,” J. Anal. At. Spectrom., pp.297-300, (2000). Higher pressure Collisional sheathes Reduced sputter erosion
Anode Cathode Cathode - 250m DC Micro Hollow Cathode Discharges • Electron confinement within hollow cathode • thermionic emission? • Lower voltage than simple capillary: 300-400 V • Increased lifetime, but still has electrode erosion • Tgas~ 2000 K • Refs: K. Schoenbach, Old Dominion University • G. Eden, University of Illinois
Exploiting Electrode Erosion:DC Micro Plasma with Liquid Electrodes Pb Liquid Electrode Spectral Emission Chip Wilson and Gianchandani, University of Michigan from IEEE Trans. on Electron Dev. 49, 2317 (2003).
DC Microplasma Modeling Wilson, Kolobov, Wendt, Gianchandani. meas. model
DC Microplasma Modeling Strong Spatial Potential Gradient: E = 300k-400 kV/m Electron Energy Distribution has a high energy tail
RF Micro Plasma Sources 13.56 MHz Capacitively Coupled Plasma: M. Blades, U. British Columbia from Journal of Analytical Atomic Spectrometry (2002) • 1 atm, Helium only • 1 mm plasma channel • ~ 20 watts
Coil H ERF S Plasma ERF Capacitive vs. Inductive • ERF is perpendicular to boundary • High voltage sheaths • ~100’s V at 13 MHz • Sputter erosion by positive ions • Low ionization efficiency • Power sputtering, heat • ERF is parallel to the boundary • Low voltage sheaths (~10’s V) • Little sputter erosion by ions • Higher ionization efficiency • Power ionization, excitation
Hybrid package Glass wafer Interdigitated capacitor 5 mm coil Microfabricated ICP
Microfabrication Process SEM of Interdigitated Capacitor Structure with 10 micron thick Au
ICP Frequency Scaling Choosing a frequency that maximizes the efficiency of ionization experiment parabolic least squares fit ~ w2
Maximize frequency: Coil H Glass wafer Seal Plasma E Glass tube(Chamber) Vacuum Region Frequency Scaling Model Li ZS = RS + jwLeq Power efficiency= RS / (RS+RC) … RS = 2k2LPLCRP / (RP2 + 2LP2) RS 2k2LPLC/RP if RP2>> 2LP2 …mICP RS k2LCRP /LP if RP2 << 2LP2 ...large ICP
Frequency Scaling of Miniature ICPs Electron inertia limits further improvements as w>>ne-n. w>3ne-n
3nen< w mICP Efficiency vs. Pressure (nen)constant frequency, f = 493 MHz Efficiency, % Symmetric in freq. and pressure Can we reach 1 atm?
Frequency Limitation Increasing coil resistance, RC Electron Density @ 690 and 818 MHz 690 MHz 818 MHz
Coil’s cross section Coil Resistance (3D FEM model)- rf current crowds to the inner and outer radii of the coil (skin effect, RC ~ f 1/2) - the crowding is asymmetric toward the center (proximity effect, RC ~ f 2). LIMITS mICP OPERATION TO f < 1 GHz
Miniature ICP Frequency Scaling Poor performance at 1 atm requires 50 W (Horiike, U Tokyo)
power light process gas optical spectrometer mplasma Low pressure application of an mICP: industrial process monitor Atomic layer deposition, Chemical vapor deposition, Gas purity… detection limit: 10 ppb < DL < 1 ppm
Why microwave microplasma? • Microwave breakdown • Sheath scaling • Vsheath ~ 1/f 2 • Low cost cellphone power amplifier chips • 3-4 W at ~900 MHz or 1800 MHz Meek J.M. and Craggs J.D., “Electrical Breakdown of Gases”, Wiley, New York, 1978 pp 697
Glass tube Glass tube Glass tube Microstrip Microstrip Microstrip Split-Ring Resonator Microplasmain argon @ 1watt @ 900 MHz 9 torr 20 torr ~ 5 mm 760 torr 100x500 mm F. Iza and J. Hopwood, IEEE Trans. Plasma Sci., Aug 2003
Line Dielectric Ground Plane Discharge gap Half-wave Split Ring Resonator Operation:Surface Current Simulation at 1.0 W GAP INPUT INPUT GAP
Microwave Capacitive Coupling microplasma ~ 100 mm Eg ~ 1000kV/m Eg ~ 200kV/m -Vosinwt 500 um gap 100 um gap +Vosinwt er=10.8 Cross section view Rp Top view 1/wCS 1/wCS No sputter erosion: * DC gap voltage = 0 * Vsheath ~ 1/new2 * collisional sheaths