260 likes | 431 Views
The First Entrepreneurial and Practice-Oriented Masters Program in Microelectronics Systems Packaging. Leyla Conrad Associate Director, Education Packaging Research Center Georgia Institute of Technology. Evolution and Expectations in Packaging Industry. 1999 2006
E N D
The First Entrepreneurial and Practice-Oriented Masters Program in Microelectronics Systems Packaging Leyla Conrad Associate Director, Education Packaging Research Center Georgia Institute of Technology
Evolution and Expectations in Packaging Industry 1999 2006 Electronics $993B > $2.0T Microelectronics & Packaging $250B $500B Electronics Packaging $109B* > $200B • To Support the Industry Growth: • • Next-Generation System Technologies • • Skilled Human Resources • Globally-Competitive, System-Level Engineers with Complete Product Dev. Education *Input from Tech Search International
U.S. Industry Needs • 58,000 scientists, engineers, and technicians are currently employed in U.S. in electronic packaging • PRC projects this number will reach 89,000 by 2008 • Total U.S. annual demand for new human resources =3,800 in 2002; current total degree recipients at all levels from all U.S. universities < 300 per year. • Estimated distribution in educational backgrounds:
Annual Human Resource Needs in U.S. Level Need/YearProd./Yr.Provided By PRC Production/10 years • 20 Universities • Graduate Education, • 228 in 10 years (PRC) Ph.D. 600 50 M.S. 2000 70 B.S. 800 50 Professional Engineers • Certificate in Microelectronic • 20 Universities Packaging 267 in 10 years • 3 Universities • Undergraduate Education • 465 in 10 years • Industry Education • IEEE-CPMT • IMAPS • 5-10 Universities • Companies
What is PRC? Georgia Tech 12 Collaborating Universities Global PRC • 50 Companies • 280 Students • 35 Professors, 7 • NSF-ERC • Georgia State • (GRA) • Global Departments Electronics • $20M Annual Industry Budget • 15 Research Eng. • Next-generation of Microelectronic Systems Packaging Technologies Based on SOP • New Breed of Globally-Competitive Engineers • Partnership and Technology Transfer to Global Industry
Integrated Vision forEducation Research • Prototype Research • Curriculum Development • Books • Short Courses • Workshops • Student Monthly Seminars • Systems Research • Labs for Hands-on DBO Courses • Prototype Research Projects • Operation of Manufacturing Equipment • EDUCATION: • Product Dev. Cycle • System-level • Global • IMAPS, IEEE Programs • Web-based Courses • International Internships • Academic Conference Global Relations Infrastructure • Internships/Co-Ops • Manufacturing Education • Distinguished Seminars • Mentoring by Industry Professionals • Industry Engineers on Campus • Entrepreneurial Education Industry
Desired Educational OutcomesResults of IAB Needs Assessment: • Rigorous, broad exposure to fundamentals • Deep level knowledge of issues relevant to electronics packaging • Interdisciplinary and cross-functional skills • Economics and management education • Hands-on work experience • Interpersonal skills • Exposure to foreign cultures • Diversity
Practice Oriented Masters Program • Objective:Implement a microelectronic packaging certificate program in engineering. • Goals: - Deep level knowledge of packaging, - Interdisciplinary and cross-functional skills, - Hands-on work experience, - Economics and management education, - Industry experience, - Exposure to foreign cultures.
STRATEGY 3 primary components 1) Engineering Component - 4 courses,12 hrs 2) Management Component - 2 courses, 6 hrs 3) Internship Component - 3 to 6 months Certificate Program Major: ECE, ME or MSE Minor: Management
Design-Build-Operate (DBO) Courses • Objective: Augment PRC curriculum with hands-on instructional laboratories. • Goal: Ensure that all PRC students have the opportunity to receive training in the hands-on aspects of electronics packaging. • Strategy: 2 hands-on laboratory courses • Substrate Fabrication (design, fabricate, test) • Module Assembly (assemble, test, thermal management) Complete Product Development Cycle
DBO1 Facilities Course Topics • Introduction to Packaging • Laboratory Safety • Interconnect Design • Dielectric/Polymer Deposition • Formation of interconnect vias • Copper Metallization • Substrate Testing Next Generation Substrate Facility
Process Flow Substrate Fabrication 1.ORIGINAL SUBSTRATE 2. COAT AND PRE-BAKE 3. PHOTO-EXPOSE, DEVELOP, CURE 4. SUB-ETCH COPPER LAYER 5. STRIP PHOTORESIST 6. APPLY PHOTO-POLYMER 7. EXPOSE, DEVELOP, FINAL CURE 8. METALLIZATION PROCESS WITH ELECTROLESS PLATING
Infrastructure Spin Coater Design Meniscus Coater Wet stations UV Exposure
DBO2 Facilities Course Topics • Introduction to next generation packaging • Thermo-mechanical modeling and reliability • Assembly processes and materials • Functional testing • Thermal management • Reliability testing Next Generation Module Facility
Management Component MGT6753 - Management for Engineers • Leadership for Creativity and Innovation (Instructor: Christina Shalley • Financial Reporting and Analysis of Tech Firms (Instructor: C.Mulford) • Managerial Accounting (Instructor: Deborah Turner) • Negotiation (Instructor: Christina Shalley) • Teams (Instructor: Dennis Nagao) • Operations I (Instructor: Cheryl Gaimon) • Operations II (Instructor: Cheryl Gaimon) • Focus on Capacity and Process Planning (Instructor: Cheryl Gaimon) • The Value of Quality (Instructor: Vinod Singhal) • Supply Chain Management (Instructor: Soumen Ghosh) • Finance (Instructor: Narayan Jayaraman) • Entrepreneurial Finance--Valuation, Financing (Instructor: Narayan Jayaraman) • New Product Development (NPD) Process (Instructor: Kenneth Kahn) • From Development to Commercialization Mkting (Instructor: Kenneth Kahn) • E-Commerce (Instructor: Fred Riggins) • Strategy (Instructor: Lloyd Byars)
Management Component Management Elective Courses • MGT 6051 Database Development and Applications • MGT 6052 System Analysis and Design • MGT 6055 Decision Support and Expert Systems • MGT 6056 Electronic Commerce and Marketing • MGT 6060 Financial Management • MGT 6198 Corporate Entrepreneurship for Global Competitiveness • MGT 6306 Business to Business Marketing • MGT 6350 Operations Management • MGT 6351 Operations Planning and Control • MGT 6360 Global Operations and Logistics • MGT 6772 Managing Resources of the Technological Firm • MGT 6773 Strategic Management of Technology Based Ventures • MGT 6789 Technology Transfer • MGT 6814 Law, Management, and Economics
Internship Component Lambda Technologies System Companies Automotive Computer Aerospace Communications Medical Packaging Companies Tool Companies CIRCUIT TECHNOLOGIES Material Companies Semiconductor Companies
Corporate Fellowships • Goal: to produce substantial number of microelectronics systems packaging engineers - fellowship grant of $25,000 (US) Company Benefits • Summer intern • Access to PRC graduates • Attend one annual IAB meeting
POM Students • Himanshu Agarwal (MSE) • Ankur Agrawal (ChE) • Charles Butterfield (ECE) • Anil K. Chinthakindi (ChE) • Pranav Patel (ECE) • Melinda Woods (ECE)
8 7 UG Research 6 5 4 3 2 1 Microelectronic Systems Packaging Technology Curriculum at GT 16 15 System Integration Research 14 Ph.D. 13 Professional Communications course System-level course Packaging Certificate Entrepreneurial and Practice Oriented MS 12 11 System Integration Research Fundamental/Thrust courses (14 ) 10 DBO2 DBO1 MS Management Courses Hands-on Courses 9 System-level course SEMESTERS Focused Program of Study System-level course DBO2 DBO1 Hands-on Courses Fundamental/Thrust Courses (8) UG Research FUNDAMENTAL ENGINEERING COURSES ECE Electromagnetics BS ME Heat Transfer MSE Materials ChE Electrochem. Fundamental Science/Math Courses
Future Challenges Enhancing electronic packaging education • Planning human resource needs • Enhanced M.S. degrees • Technology-enhanced educational delivery • Focus on manufacturing, business, management • SOP technology • Environmentally benign processing • Assessment of education programs Forming partnerships • Universities, industry, and professional societies must form partnerships to promote electronics packaging education