250 likes | 459 Views
Latest Developments in MIPI Specifications. April 30, 2014. Yoav Lavi VLSI Plus Ltd. AGENDA. Introduction to MIPI® MIPI® standards - scope How MIPI® standards are created MIPI® CSI2 standard for camera to processor interface VLSI Plus’ CSI2 compliant IP cores
E N D
Latest Developments in MIPI Specifications April 30, 2014 Yoav Lavi VLSI Plus Ltd
AGENDA • Introduction to MIPI® • MIPI® standards - scope • How MIPI® standards are created • MIPI® CSI2 standard for camera to processor interface • VLSI Plus’ CSI2 compliant IP cores • Selected MIPI® third generation standards: • MPHY • UNIPRO • CSI3 • VLSI Plus’ Roadmap
Who Are We? • Experts in VLSI Design and Architectures • Providing Engineering Services to the VLSI community • Providing specialized IP cores • Per customer tailoring • Located in Israel • Contributor – level MIPI member since 2005
MIPI® (Mobile Industry Processor Interface) • Industry consortium • Creates standards for interface between components of mobile devices • Started by Nokia and ST • 252 Members (as of April 2014): • 5 Founder Members (Nokia, ST, Intel, TI, Samsung) • 81 Contributor Members • 165 Adopter Members • 1 Promoter Member
MIPI® - the Creation of Standards • MIPI® has a technical steering committee, which guides a multitude of Working Groups • Typical Working Group has 40 members; some 15 are active • When a Working Group works on a standard, weekly phone conferences are held (typically 3 hours each), in addition to many emails and documents • In addition, every three months there is a F2F meeting • Each WG had a Chairman who makes sure that the group is on schedule, and that due technical diligence is done to all parts of the spec. • Participants present technical arguments, according to the viewpoint of their companies; e.g. some participants look at easy SW implementation, while others are concerned mainly with low power consumption • Each standard has several Draft stages • Major Draft stages as well as final versions undergo a period of all members review and subsequent vote • Final draft is approved / disproved by MIPI BOD
Camera Serial Interface 2 (CSI-2)Introduction • Working Group (CWG) started by MIPI® in March 2004 • In June 2004 MIPI® Technical Steering Group recommended that Display and Camera Interfaces should use the same Physical layer – the D-PHY, which was being developed by the PHY Working Group • At some point It was suggested that the CWG will adopt SMIA CCP2. This proposal was rejected • CSI2 over D-PHY is superior to CCP2 - it allows faster rate at lower power consumption, adds LP signaling, and more
Camera Serial Interface 2 (CSI-2)D-PHY Highlights • 1 DDR Clock Lane • 1 to 4 Data Lanes • High Speed Differential Mode for data transfer • Low Power Mode, using CMOS levels on the two conductors of each pair, for low speed signaling • Low Power Mode is entered between packets reduced overall power consumption • Original speed target – 500M bps per lane (“D”) • First implementations stopped at 1Gbps • Current version limit - 1.5Gbps. • 8 lanes extended-DPHY (non-DPHY) are in the market
Camera Serial Interface 2 (CSI-2)DPHY Universal Lane Module Functions
Camera Serial Interface 2 (CSI-2) Highlights (A) • The processor controls the camera via two CCI lines (not part of DPHY) • Camera sends packets of data to the processor via DPHY lanes • Packets can be Short (32 bit) or Long • All packets have an 8 bit ECC filed in the Header, allowing correction of any single-bit error and detection of all two-bit errors • Short packets are sentto indicate events and to time synchronization (e.g. FS, FE, LS, LE) • Long packets are used to send video lines and user defined data
Camera Serial Interface 2 (CSI-2) Highlights (B) • Long packet header comprises the following fields: • Data-Type, defining one of 19 video formats • Virtual channel selection • Length of the packet, in bytes • 8-bit ECC • Long packets end with a 16 bit CRC • For each of the 19 video formats, bit ordering is defined • Optional DPCM data compression – 10 or 12 bit pixels can be compressed to 8, 7 or 6 bits per pixel
VLSI Plus IP Product Portfolio A: First Generation CSI2 Rx/Tx Cores
SVTCS4-AP1 – Serial Video Transmitterfor CSI2; 1-4 data lanes • ASIC and FPGA Versions • 1-4 lanes, Low gate count • Modular – generic core and customized application package • Optional hardware for CSI2/DPHY link test • Optional DPCM compression
VLSI Plus IP Product Portfolio B: Second Generation CSI2 Rx/Tx Cores
Second Generation CSI2 Receiver – the SVRPlus-CSI2-I For Recently Introduced of the line sensors. • Configurable 1 or 2 clock lanes; 1,2,3,4 or 8 data lanes • 64 bit internal data bus • Configurable 1, 2 or 4 pixels output per clock • Up to 1.5Gbps per lane; • Extensive set of registers, accessible by AMBA APB bus • Support of all video formats • Programmable timing parameters • Support of CSI2 DPCM decompression • Optional output FIFO for continuous output streams • Error counting hardware, for on-line BER measurements
Second Generation CSI2 Receiver – the SVRPlus-CSI2-I Simplified Block Diagram:
SVT-CS4-AP2 – Multiplexing CSI2 Serial Video Transmitter • Multiplex up to 12 independent video sources • Multiplex base is virtual-channel/data type combination • Supports DPCM compression Simplified Block Diagram:
MPHY Benefits (A) • BURST mode operation for improved power efficiency • Multiple transmission modes with different bit-signaling and clocking schemes • Multiple transmission speed rates per BURST mode for better bandwidth utilization and for mitigation of interference problems. • Fixed rates for high-speed mode, flexible (within ranges) for low-speed mode. • Multiple power saving modes • Symbol coding (8b10b) for spectral conditioning, clock recovery, and in-band control options for both PHY and Protocol level • Clocking flexibility: independent local reference clock or shared clocks
MPHY Benefits (B) • Optical friendly: enables low-complexity electro-optical signal conversion and optical data transport inside the interconnect between MODULEs • Optimized for short interconnect (<10 cm); extendable to a meter with optical converters and optical waveguides. • Configurability: differences in supported functionality (to reduce cost) enables tuning and implementation for best performance