Flexible printed circuit: Innovations and New Technologies
Flex printed circuit boards are at the heart of most modern day electronics, it is the circuit board that provides the density to the electronic. The high density electronics have eyes for a much thinner FPC than the conventional ones. The conventional FPCs comprises of three layers formed by copper, polyimide and bonding adhesives. The three layered circuits are being replaced by two-layer circuits that equate to the copper being directly placed on the polyimide without the help of any adhesives. The process of manufacturing a flexible printed circuit is a very complex one within itself. The manufacturing of the circuit can be affected by a shift, as tiny as 0.01mils. The FPCs themselves aren’t very huge in their size, so a small shift could have a major impact on the manufacturing of the circuit board. The manufacturing of a flexible printed circuit is a much more complex than that of a rigid PCB. With regards to this, there have been multiple innovations in the manufacturing process of the flexible printed circuits. Here are some of the inventions in the manufacturing world of FPCs:
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