1 / 11

Adhesive Bonding with SU-8

Adhesive Bonding with SU-8. Advanced microtechnology course (P) Maria Berdova. Wafer Bonding. Adhesive Bonding. W. Brockmann, P. L. Geiß, J. Klingen , B. Schröder , Adhesive Bonding, Materials, Applications and Technology , 2009. SU-8. Epoxy-based negative  photoresist

flo
Download Presentation

Adhesive Bonding with SU-8

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Adhesive Bonding with SU-8 Advanced microtechnology course (P) Maria Berdova

  2. Wafer Bonding

  3. Adhesive Bonding W. Brockmann, P. L. Geiß, J. Klingen, B. Schröder, Adhesive Bonding, Materials, Applications and Technology, 2009.

  4. SU-8 • Epoxy-based negative photoresist • Thickness <1um to >300um  • Formulated in gamma butyrolactone (GBL) solvent (or in cyclopentanone) • High chemical and thermal stability • Can be used for building rigid mechanical structures • HAR 40:1 • Relatively cheap, easy to process • The strongest adhesion to Ti and TiO2 J. Micromech. Microeng. 17 (2007) R81–R95

  5. Drawbacks of SU-8 • Difficult removal after curing • High coefficient of thermal expansion (52 ppm/◦C, for silicon and glass ~3 ppm/◦C) • High level of tensile stress • Poor adhesion to Ni substrates

  6. General bonding procedure • Clean silicon and Pyrex wafers in piranha solutions then dehydrate the wafers at 200◦C for at least 40 min • Deposit, pre-bake, expose, post-bake and develop the first SU-8 layer on the silicon wafer • Spin-coat and pre-bake the second SU-8 layer on the Pyrex wafer • Join the two wafers at different bonding temperatures then apply pressure to eliminate trapped air bubbles with a pair of tweezers • After the bonded stack cools to room temperature, blanket expose the second SU-8 layer through the Pyrex wafer • Post-bake the stack with temperature ramping while applying pressure • Low cooling to reduce thermal mismatch stresses in the layers J. Micromech. Microeng. 13 (2003) 732–738 Sensors and Actuators A 120 (2005) 408–415

  7. Micronozzels Thermal oxidation Litho from unpolished back side Etching of SiO2 in BHF DRIE Patterning of 10 µm SU-8 Etching of SiO2 membranes Spinning and backing SU-8 on Pyrex Contact of Si and Pyrex substrates Exposure through the Pyrex wafer and post bake J. Micromech. Microeng. 13 (2003) 732–738

  8. Micronozzels (leakage tests) J. Micromech. Microeng. 13 (2003) 732–738

  9. Capacitive pressure sensor Bonding with a pressure of 60N by pumping 1 h with a surrounding pressure of 10−4 Pa, then heating in ramp for 1 h to 70 ◦C and 100 ◦C, and finally cooling down to room temperature Sensors and Actuators A 147 (2008) 672–676

  10. Calorimetric flow sensor By applying an electrical signal to the heater element, the surrounding liquid is heated up. Then, temperature distribution is measured by means of resistance change at the downstream and upstream sensors 125 µm Kapton PMMA substrate 60 µm SU-8 to define inlet and outlet connections Bonding Removal 20 µm SU-8, exposure PMMA substrate Ti/Pt, lift-off Ox treatment for cleaning 5 µm SU-8 to prevent contact Me/liquid 20 µm SU-8 to define microchannel from 0 ul/min to 25ul/min

  11. Thank You!

More Related