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LHCb VELO Hybrid

LHCb VELO Hybrid. T. Bowcock University of Liverpool. LHCb Vertex Locator. Silicon Module. Components Sensors Substrate Hybrid Cooling Paddle Base Cables Module-0 ‘04. Silicon Modules. 50 modules Approximately 500,000 bonds Operation at –5C Thermal issues over assembly at 21C

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LHCb VELO Hybrid

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  1. LHCb VELO Hybrid T. BowcockUniversity of Liverpool

  2. LHCb Vertex Locator

  3. Silicon Module • Components • Sensors • Substrate • Hybrid • Cooling • Paddle • Base • Cables • Module-0 ‘04

  4. Silicon Modules • 50 modules • Approximately 500,000 bonds • Operation at –5C • Thermal issues over assembly at 21C • Vacuum • Movement several times a day • But very small magnetic field

  5. Silicon Module • Double Sided Module • Modification from TDR • Two hybrids on one substrate • Symmetry • Mass • Difficult to fabricate and bond

  6. Substrate • CF encapsulated TPG • Thermal conductivity • Mass • Big relative CTE to kapton

  7. Module Assembly • All glued • Combination of film and robot dispensed glue • Test of procedures for vacuum operation • Removing air VERY important • How do we stop glue oozing out through holes (kapton), edges?

  8. Prototype • 2002 prototype • Bonded with SCT-VELO chips • Single Sided(!) • K&S 8090 pattern recognition • Sensors • 150-300microns • Kapton and Fanouts at CERN Glass Fanouts

  9. Prototype • Problems • “Bad” design… • Lineup of Fanouts and sensor • Angles of pads • Two types of sensor • 2 or more sets of fanouts • Sensor pads cannot be made the same

  10. 2003 Prototype • Beetle 1.2/1.3 • Substrate • Lamination • “Bounce” • Jig • Flatness • Double Sided • Kapton fanouts

  11. Beetle 1.2 5100  6100m – chip is very small 4 row bonding Row to row centres are 150 um. Pitchwithin a row is 160um so the effective pitch for the four row bonding is 40um Pads 120  95m SMALL

  12. Pads at angle to Fanout? Sensor Pads under design and review Straight Line? Circle?

  13. Proposed Fanouts • The fanouts have two metal layers • pitch at the beetle end is the tightest with 40um tracks and gaps on each layer. • the bottom layer protrudes out from under the top layer by about 400um. • For four row bonding the two rows of beetle pads nearest the edge of the chip bond to the lower copper layer and the two other rows bond to the top copper layer • The copper is coated with nickel and flash gold.

  14. Liverpool Semiconductor Centre • K&S 8090 • H&K 710(2) • Wirepull • Dage • Class 100 • 100m2

  15. Bonding • Lengths up to 3mm • Fanout to Sensor: TO BE IMPROVED • 17micron Al wire • Height Difference ~ 0.5mm • Smallest Pitch dominated by Beetle • Multi-loop height • Wire pull tests • Strengths >6g

  16. Problems Expected • Fabrication of solid substrate/kapton that does not delaminate • Flatness (helps bonding) • Quality of bonding • Jig for Double Sided Bonding • Non-trivial • Pattern Recognition and Programming of 8090. Bonding on arc. • Problem solved. Memory + Shipping • Optimisation of Pad Layout • Avoid foot being skewed relative to pads

  17. Problems • We cannot afford to test at the same level as ATLAS/CMS • cycling, radiation damage etc • Procedures have to be right • 20 modules = 50% of the production! • Need to learn from ATLAS,CMS,+…

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