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HIROSE ELECTRIC CO., LTD.

IT3 series. High-speed mezzanine Connector System. March, 2010. HIROSE ELECTRIC CO., LTD. IT3 Series Design Overview. A New Standard Mezzanine for Flexibility and Performance. Flexibility:

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HIROSE ELECTRIC CO., LTD.

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  1. IT3 series High-speed mezzanine Connector System March, 2010 HIROSE ELECTRIC CO., LTD.

  2. IT3 Series Design Overview A New Standard Mezzanine for Flexibility and Performance Flexibility: Hirose’s IT3 mezzanine connector system is as comfortable in today’s data rates of PCIE and XAUI as it is in tomorrow’s 20+ Gbps systems. With the ability to transmit differential, single-ended, and power through one package and being stackable from 15 – 40 mm, IT3 can solve your interface needs for both current and future generations. Detachable(Mating) Side Mating / Unmating • Features: • Unique 3-piece structure for excellent reflow solderability • Differential, single-ended, and power • Low mating/extracting forces • Wide misalignment tolerances • Stacking heights from 15 to 40mm • Both SnPb and Pb-free are available • Staggered 1.5mm x 1.75mm BGA Flexible 3-piece design has many advantages

  3. Hirose IT3 vs. Competition Hirose IT3 Amphenol NexLev FCI GigArray Pin counts : 100/200/300 100/200/300 200/296 Stack heights : 10mm to 40mm 10mm to 33mm 15mm to 40mm Signal density : 73 diff pairs/inch 73 diff pairs/inch 66 diff pairs/inch Sales channel : Direct / Disty Direct only Direct / Disty 2nd Source : Tyco None None High ASP = $ 50 + per mated connector

  4. High Speed “Terms” to Know: Mechanical • BGA: Ball grid array interconnect system using reflow solder balls • Ground: An electrical connection between a circuit and the earth • Power: The rate of generation, transferring or using energy, measured in watts • Stack Height: Vertical distance measured in mm between PCB & connector

  5. Application Examples Servers/ Storage Base Transceiver Station Internet Routers &Switches

  6. Currently Available Variations

  7. Coming May 2010 Available Sales tools Assembly and Design Notes 2D Mechanical Drawings 3D STEP Files Product Brochure SI Data Mechanical Show & Tell Samples Sample Display Cases • General Presentation • Modeling • Detailed Test Reports • (Available by Stack Height) • Test/Demo Board Qualification Data • L1 Environmental Qualification Test Report • L2 Long-term BGA Reliability Test Report • L3 Manufacturing Yield Test Report

  8. Available Sales tools Technical Data Technical Document From Assembly Notes and Design Notes; documents 3 through 6 are based on EIA spec.

  9. High Speed “Terms” to Know: SI • Differential Signaling: Digital signals transmitted as the difference in voltage of a pair of signal lines • Gbps: = Gigabits per second;a unit data transfer rate/speed = 1k megabits per second • S. Parameter: Plots attenuation vs. frequency used to document connector performance and is also known as insertion loss • SI: = Signal Integrity;Process of analyzing and making appropriate system design decisions • Signal Ended Signaling: Signals transmitted over one wire using common ground return • Spice Model: Simulated program with integrated circuit emphasis • Touchstone File: Also known as SnP file; intended for use with documents and specifications for parameter data of active or passive interconnect network

  10. IT3 3-Piece Design Features & Benefits Assembly friendly unique 3-piece IT3 series mounting & mating procedure X-ray Inspection Friendly “Interposer”Installed onto “Mounting receptacle” after reflow “Mating receptacle”Mated with “Interposer” “Mounting receptacle”Reflow-mounted on PCB X-ray inspection from bottom side Low Thermal Mass for Reflow process For any stacking height combination, receptacle is always same and its height is 6mm only. Small size of receptacle has wide process window for reflow profile. No need to reflow Significantly reduces frequency of false calls Simple receptacle design gives clear vision for X-ray inspection. Lead-Free applications benefit from our easy reflow process design. Reflow receptacle only

  11. Signal BGA Ground BGA 0.875 mm IT3D/M -***S - BGA 0.75 mm IT3 3-Piece Design Features & Benefits Industry standard footprint High reliableBGA connection *Patent Pending IT3’s unique 3 piece design and construction gives industry leading BGA reliability, while still providing the density of 73 differential pares per linear inch. The IT3’s divided receptacle structure reduces thermal stress and ensures long-term reliability of the BGA ball connection with the PWB Drop-in replacement for NexLev Mating / Un-mating operation HRS IT3 Series: 10˚ acceptableCompetitors’: Not acceptable HRS IT3 Series: 3˚ acceptableCompetitors’ : Not acceptable

  12. IT3 3-Piece Design Features & Benefits Lower force Insertion and Extraction Housing design prevents pin stubbing Pre-load structure Contact normal force Contact force (N) Spring workload is decreased. 0 IT3 Series Displacement of spring (mm) Existing solution Exposed contacts

  13. 3-Piece Connector Assembly Benefit 2nd Reflow soldering compatible 6mm PCB 19.7mm IT3 connectors IT3 series for 30mm (or any) stacking height application Other supplier for 30mm height application May not suitable for 2nd Reflow soldering due to the weight. Already confirmed that there are no issues to mount Hirose IT3 series connectors on the bottom side of PCB for 2nd reflow soldering by major CEMs.

  14. High Speed Interconnect Solutions Robust and Reliable Solder Ball Attachment Hirose IT3 series Other connector & silicon device package As a contact lead is positioned into a solder ball, it prevents the ball from pealing off during severe shock &vibration test. Uncontrolled co-planarity brings the migration of solder ball from low to high temperature side during reflow, which causes the soldering failure. The countermeasures are to improve the excess co-planarity or to implement the thicker metal mask to cover such co-planarity. Not to scale After reflow soldering Since the receptacle’s contact resides in the BGA ball, the IT3 is very strong for shock and vibration. (Patent Pending)

  15. Unique Interposer Design for Signal Integrity • Micro strip line structure • Up to 6.25G bps with fully populated pin assignment • Over 10G bps with skipped pin assignment for differential pairs • Also can be used for power lines Interposerwafer Interposer wafer structure Signal Ground Signal / Ground configuration

  16. IT3 vs. IT2 * Because of connector structure, IT2 cannot have pins skipped for faster data transfer requirement.

  17. Hybrid (Selectively Loaded) Type Available • IT3HY (85&100Ω) mating / internal structure IT3D-100S-BGA IT3HY-100P-38H (schematic only) 85Ω QPI wafer (typical for new Server applications) Existing 100Ωwafer (typical for Telecom applications) IT3M-100S-BGA

  18. IT5 vs. IT3 IT5 has improved ICR (with 8-aggressor FEXT) for 25 Gbps data rate with plenty of margins. 12.5 GHz Via stub IT3 IT5

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