ITRS Conference, Tokyo, Japan

1. ESH ITWG PresentationJim Jewett (Intel) Walter Worth(SEMATECH) Junichi Aoyama(Sony) Yoshinari Matsushita(MEI)Kenji Takahashi(Renesas)Shinya Hashimoto(NEC Electronics) ITRS Conference, Tokyo, Japan Dec. 1, 2004

2. Cross-Thrusts that Need Mapping • Front End Processes • Lithography • Interconnect • Factory Integration • Assembly and Packaging • Yield Enhancement • Emerging Research Materials/Devices

3. ESH Issues for ITWGS - Front End Processes (Precursor for High k Material - Lithography (PFOS, Energy Consumption Lithium for excimer laser----)- Interconnect (Copper Reclaim ---) - Factory Integration (- Assembly and Packaging (Lead, Halogen Free --- )- Yield Enhancement (Water Consumption---)- Emerging Research Materials/Devices

4. Cross-Thrust Mapping Process • Meet with technologist(s) in each of the cross-cut areas individually • Use template (next slide) to identify any ESH issues based on the thrust’s technology drivers • Map these issues and potential solutions against five (5) key ESH areas(Chemical, Materials & EquipmentMgmt. , Resource Conservation, Workplace Protection, Climate Change Mitigation, DfE Safety & Health) • Indicate the status of the potential solutions as to Research, Development or Qualification • Fill out the template by the end of Jan.

5. Template for Cross-Thrust Mapping

6. Partial Sample of Completed Cross-Thrust Mapping R = Research required D = Development required Q = Qualification/Pre-production

7. Back up

8. Synergy Between Technology R&D and ESH Legislative and Regulatory Development • Lack of synergy between technology R&D and ESH legislative/regulatory development. – Improve “crystal ball” • Regional differences in chemical regulatory restrictions (government and/or supplier constrained).

9. Five Difficult Challengesof ESH Environmental　benign Mfg. - Climate Change Mitigation - Chemicals, Materials, and Equipment Management - Resource ConservationDesign for Environment, Safety, and Health (DFESH) - Environmental benign device development - Workplace Protection (materials and tools design) Source:LCA Working Group, JEITA , 2004

10. ESH Difficult Challenges • Chemical, Materials, and Equipment Management • Incomplete MSDSs with insufficient ESH data for proprietary ingredients • Replacement of hazardous materials with more benign materials • Inefficient utilization of chemicals • Increased global regulation of chemicals (e.g., PFOS, Pb, PBTs) • Geographical differences in regulations affecting use of chemicals

11. ESH Difficult Challenges (cont’d) • Resource Conservation • Lack of sufficient historical water and energy use data to establish trends and set more realistic future usage goals • Push-back from process engineers on recycle of water or chemicals • Acceptance by process engineers of tool and pump operation with idle/sleep mode

12. ESH Difficult Challenges (cont’d) • Climate Change Mitigation • Meeting of the WSC PFC emission reduction goal in face of: • increase in total chip production • increase in the number of metal layers • proliferation of the use of PFCs in manufacturing • Increasing the energy efficiency of tools and Facilities systems • Meet the requirements of Kyoto Protocol

13. Synergy Between Technology R&D and ESH Legislative and Regulatory Development • Lack of synergy between technology R&D and ESH legislative/regulatory development. – Improve “crystal ball” • Regional differences in chemical regulatory restrictions (government and/or supplier constrained).

14. Emerging Research Materials (ERM) • Need to identify existing ESH restrictions pertaining to ERMs research. • Need to understand impact of uncertain future ESH barriers on ERMs. • New and emerging materials may have unique metrology requirements. e.g. – Nanomaterials