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Reliability Issues

Reliability Issues. Mohammad Sharifkhani. Reading. Textbook I Chapter 18 Textbook I Chapter 20 The paper on SER. Motivation. There is a long distance from a chip working in a lab to a chip working in the field Reliability Robustness Fatigue

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Reliability Issues

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  1. Reliability Issues Mohammad Sharifkhani

  2. Reading • Textbook I Chapter 18 • Textbook I Chapter 20 • The paper on SER

  3. Motivation • There is a long distance from a chip working in a lab to a chip working in the field • Reliability • Robustness • Fatigue • Many of the culprits are in rise as technology scales

  4. Introduction • Packaging • Electromigration • ESD Protection • SER Protection

  5. Chip Packaging • Bond wires (~25m) are used to connect the package to the chip • Pads are arranged in a frame around the chip • Pads are relatively large (~100m in 0.25m technology),with large pitch (100m) • Many chips areas are ‘pad limited’

  6. Pad Frame Layout Die Photo

  7. Chip Packaging • An alternative is ‘flip-chip’: • Pads are distributed around the chip • The soldering balls are placed on pads • The chip is ‘flipped’ onto the package • Can have many more pads

  8. V DD V DD En Out En En Out In In En Increased output drive Out = In.En + Z.En Tristate Buffers

  9. Electromigration • Current density (current per unit area) • A reliability issue  creates problem over time • Due to transport of metal ions • AC signals will be fine • Breaking or shorting to adjacent wire • Keeping current below 0.5 to 1mA/um relaxes the problem • For DC wires (power/GND) • IR Drop  transient problem (peak current) • Electromigration  DC problem (ave. current) • Using copper helps

  10. Electromigration (1)

  11. Electromigration (2)

  12. Electro-Static Discharge (ESD)

  13. Electro-Static Discharge (ESD)

  14. Electro-Static Discharge (ESD)

  15. Electro-Static Discharge (ESD)

  16. Electro-Static Discharge (ESD)

  17. Electro-Static Discharge (ESD)

  18. Electro-Static Discharge (ESD)

  19. Electro-Static Discharge (ESD)

  20. Electro-Static Discharge (ESD)

  21. Electro-Static Discharge (ESD)

  22. Electro-Static Discharge (ESD)

  23. Electro-Static Discharge (ESD)

  24. Electro-Static Discharge (ESD)

  25. Electro-Static Discharge (ESD)

  26. Electro-Static Discharge (ESD)

  27. Electro-Static Discharge (ESD) Which one fails?

  28. Electro-Static Discharge (ESD) Second breakdown of the path at a higher voltage level than the second break- down of the ESD path Second breakdown of the path at a lower voltage than the second break- down of the ESD path

  29. Electro-Static Discharge (ESD)

  30. Electro-Static Discharge (ESD)

  31. Electro-Static Discharge (ESD)

  32. Electro-Static Discharge (ESD)

  33. Electro-Static Discharge (ESD) There are challenges as technology scales!

  34. Electro-Static Discharge (ESD)

  35. Electro-Static Discharge (ESD)

  36. Electro-Static Discharge (ESD)

  37. Electro-Static Discharge (ESD)

  38. Electro-Static Discharge (ESD) Design of ESD protection circuits: A glimpse!

  39. Electro-Static Discharge (ESD)

  40. Electro-Static Discharge (ESD)

  41. Electro-Static Discharge (ESD)

  42. Electro-Static Discharge (ESD) • ESD protection is extremely important when dealing with high speed input output signals • I/O Capacitance

  43. Soft Error

  44. Soft Error

  45. Soft Error

  46. Soft Error

  47. Soft Error

  48. Soft Error

  49. Soft Error

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