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Dense Wavelength Division Multiplexed Interconnects for High-Performance Embedded Computing

Explore the benefits of Dense Wavelength Division Multiplexing (DWDM) interconnects for high-bandwidth backbones, offering high data capacity, improved signal integrity, EMI immunity, and more. Learn about passive DWDM networks, application to HPEC systems, challenges, and solutions by Lockheed Martin MS2.

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Dense Wavelength Division Multiplexed Interconnects for High-Performance Embedded Computing

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  1. Dense Wavelength Division Multiplexed Interconnects for High Performance Embedded Computing Architectures Aaron M. Cordes & Rick C. Stevens Lockheed Martin Mission Systems and Sensors (MS2)

  2. Dense Wavelength Division Multiplexing (DWDM) • DWDM fiber optic interconnects form the infrastructure for telco industry’s high-bandwidth backbones • Numerous advantages over electrical interconnects • Extremely high data capacity (100’s of Gbps to 10’s of Tbps per fiber). • Improved signal integrity leading to increased link distances. • EMI immunity. • The ability to increase data rates and add communications channels without changing the cabling infrastructure. • Lower-weight cabling. • To date, environmental and packaging concerns have limited the applicability in HPEC systems

  3. Passive DWDM Networks • Wavelengths are centered around C-Band (1550 nm) or L-Band (1595 nm) • Spaced at 50, 100, or 200 GHz increments • Conforms to ITU grid • Passive combiners and splitters permit full connectivity between endpoints • Active components isolated to Tx/Rx endpoints • Creates a passive, optical broadcast interconnect that is protocol and data-rate agnostic

  4. Application of Passive DWDM Interconnects to HPEC Systems • Additional endpoints can be added to system with no impact on previously installed hardware • Enables low-cost technology insertions • Can carry multiple protocols on a single fiber at multiple signaling rates • 10G Ethernet, 1G Ethernet, SRIO, Fibre Channel, Infiniband, custom, etc. • Allows I/O-challenged systems to push beyond their current limitations • Eliminates contention and blocking in the network • All endpoints are assigned a unique wavelength for transmission • Allows new levels of sensor data sharing • Data is inherently broadcast to all endpoints with no additional overhead • Eliminates the need for switching hardware, reduces SWaP

  5. Challenges of Passive DWDM Interconnects in HPEC Systems • Reduction of the SWaP envelope of the DWDM transmit and receive endpoints so that they can be designed into standard HPEC form factors such as PMC, XMC, and VPX. • Hardening the active components against the temperature, shock, vibration, and other environmental requirements encountered in HPEC systems. • Addressing Information Assurance (IA) and Multi-Level Security (MLS) requirements by developing a secure passive infrastructure for systems where data separation must be provided. • Developing endpoint firmware that leverages standard high-speed point-to-point protocols, such as Serial RapidIO or 10 Gigabit Ethernet, while updating them to support the DWDM broadcast interconnect. Lockheed Martin MS2 is actively addressing each of these challenges

  6. Thank-you!

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