Universidade Federal do Rio Grande do Sul Engenharia Elétrica

1. Testes de CircuitosEletrônicosIntegrados Universidade Federal do Rio Grande do Sul Engenharia Elétrica Circuitos Eletrônicos Integrados – ENG04061 StevanSilveira Leandro Prytula Argus LuconiRosenhaim

2. Amkor Technology, Inc. Site: www.amkor.com Criação: 1968 Mercado: Worldwide Empregados: 400 em Chandler, >22k worldwide Localização: Matriz: Chandler AZ – USA – Headquarters Filiais: China, Japão, Coréia, Filipinas, Singapura e Taiwan. Expansão: Vê a necessidade de aumentar a capacidade de produção para atender os clientes.

3. Distribuição no mundo

4. Amkor Technology, Inc. Dados de Vendas

5. Amkor Technology, Inc. Principaisclientes Sony Semiconductor Corporation Conexant Systems, Inc. ST Microelectronics, N.V. Freescale Semiconductor, Inc. Texas Instruments, Inc. IBM Toshiba Corporation Infineon Technologies AG Qualcomm Incorporated Intel Corporation Xilinx, Inc. LSI Corporation Advanced Micro Devices, Inc. Marvell Technology Group, Ltd. Altera Corporation Mediatek, Inc. Analog Devices, Inc. NEC Corporation Atheros Communication, Inc. NXP Semiconductors Atmel Corporation RF Micro Devices, Inc. Avago Technologies, Pte Samsung Electronics Corporation, Ltd. Broadcom Corporation

6. Amkor Technology, Inc. Serviços: 1. Testes de desenvolvimento: Abrange o desenvolvimento de programas de teste, administração de projetos, caracterização, prototipação. 2. WaferProbe: Abrange a inspeção visual e teste elétrico do wafer contra defeitos antes do encapsulamento. 3.Testes Finais: Processo de ensaio de cada aparelho/circuito depois de ter sido encapsulado. Esse teste analisa os atributos de cada dispositivo e determina se ele atende aos critérios estabelecidos pelo cliente * Os testes incluem circuitos digitais, lineares, sinais mistos, memórias, rádio frequência (especialidade da empresa) e integrações dessas tecnologias.

7. Amkor Technology, Inc. • Project management process(s) • Rapid first article development • Advanced wafer probe • Low cost RF probe • Hardware (contactor, load board, probe card, handler kits) • Robust contacting solutions aligned with Amkor's bump and package roadmap • Novel test solution for low cost, bottom PoP (Package-on-Package) • SiP module test strategies (including in-line test) • Automation of system level test solutions • Program conversion • Multi-site test • Strip test for punch and saw devices (low mix / high volume) Testes de desenvolvimento:

8. Amkor Technology, Inc. • High volume production test for 300mm, 200mm and 150mm wafers • Full temperature range (-55oC to +150oC) • Thin wafer handling capabilities (<150um) • RF probe capabalities • DPS (Die processing services) • Clean room environment • Multi-site probe • Probe card repair capabilities • Bake retention • Bumped wafer probe • Electronic Assembly Support: • Die attach wafer mapping (ALPS) • Edge dies exclusion  • Wafer map template generation • Inkless probe • Probe wafer mapping Wafer Probe:

9. Amkor Technology, Inc. • High volume production final test • Full temperature testing capabilities • Yield and capacity analysis • Highly skilled factory test engineering support • Wide range of test and handling equipment • Custom test processing - Commercial / Military flows and mark after tests • High volume strip test Testes finais:

10. Amkor Technology, Inc. Equipamentos de teste

11. Amkor Technology, Inc. • Comunicação: • GPS, DVB-H, T-DMB, ISDBT receivers, demods, base bands, SiP, SCSP • Dual sided PoP ( package on package ) contactors, 2G / 3G baseband • Advanced media processor SoC(s) • Quadsite celluar Tx front end SiP modules • GPS receiver and baseband • BlueTooth SoC radio RF probe – WLCSP die sales • Multiple die / system in package solutions for OEM(s) • Cellular power amplifier + transceiver modules, SiP, HEDGE • LNA , Video Amplifiers & Drivers • Noise cancellation • Consumidores: • Biometric sensors, MEMS, Quad site fingerprint sensor • x16 Power FET & Op Amp solutions • MOSFET strip test • x32 Memory Card solutions • LVDS timing controller  LCD/PDP display • Image stabilizer & processors, digital still camera (DSC) • USB2.0  / MP3 processor • Hard disc controller • Microcontrollers • Compass IC Testes completos

12. Wafer Inspection Services, Inc. Site: www.waferinspectionservices.com Local: Orleans MA - USA Criação: 1986 Mercado: Worldwide Empregados: < 50

13. Audits • Installations • Deinstallations • Operator Training • Applications Training • Technical Support • Preventive Maintenance • Maintenance Training • Per Call Service • Full time On Site Service Wafer Inspection Services, Inc. Serviços:

14. Wafer Inspection Services, Inc. • NIST Calibration Wafers (PSLs) • NIST Thin Films Calibration Wafers • JDSU New Lasers • SP2 remanufactured lasers • Replacement Lamps • Robotics service / repair • PRI/Equipe, Ludl, Kensington Serviços:

15. Maxtek Components Corp. Site: www.maxtek.com Local: Beaverton, OR – USA Criação: 1970, juntamente com a Tektronix

16. Maxtek Components Corp. • Package Design – Ensuring Your Product's Success • Test Services – Verifying Your Component Performance • Manufacturing – US-based Assembly of Your Components • Reliability & Failure Analysis – Identifying and Eliminating Potential Failures • Project Management – From Design to Finished Component Serviços:

17. BridgePoint Technical Manufacturing Site: www.bridgept.com - em contrução Local: Austin, TX - USA

18. Test Development • Product Engineering • Probe/Final Manufacturing Test • Burn-in • Custom device programming, Inventory • Electronic Assembly • Product Analysis BridgePoint Technical Manufacturing Serviços: